WO2018207599A1 - 薄板状基板保持フィンガ、及びこのフィンガを備える搬送ロボット - Google Patents
薄板状基板保持フィンガ、及びこのフィンガを備える搬送ロボット Download PDFInfo
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- WO2018207599A1 WO2018207599A1 PCT/JP2018/016406 JP2018016406W WO2018207599A1 WO 2018207599 A1 WO2018207599 A1 WO 2018207599A1 JP 2018016406 W JP2018016406 W JP 2018016406W WO 2018207599 A1 WO2018207599 A1 WO 2018207599A1
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- Prior art keywords
- substrate
- thin plate
- inert gas
- finger
- semiconductor wafer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/08—Gripping heads and other end effectors having finger members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
Description
2 FOUP
2a 壁面
3 処理装置
4 EFEM
5 ロードポート
5’ 置換機能付きロードポート
6 ミニエンバイロメント空間
7,7a,7b 搬送ロボット
8 FFU
9 搬送室
10 真空搬送ロボット
11 処理室
12 ロードロック室
13 スリットバルブ
14 ゲートバルブ
15 フレーム
16 壁部材
17 ファン
18,70 フィルタ
19 ブラケット
20 プレート
21,21a,21’ 保持フィンガ
22 アーム体
23 基台カバー
24 基台
25 胴体部
26 第1アーム
27 胴体フレーム
28 胴体カバー
29 第2アーム
30 制御部
31 キャリア
32 蓋
33,33’ 棚板
34,64 孔
35 ロック部材
36 ラッチキー
37 リテーナ
38 吸気ポート
38’ 吸気ノズル
39,65a,65b 供給ポート
39’ 供給ノズル
40,40’,45 空間
41 ステージ
42 FIMSドア
43 蓋開閉機構
46,46’ 流路
47 フィンガ本体
47a 上部材
47b 下部材
48 噴出口(貫通孔)
48a,48b 噴出口
49,49’ 当接部材
49a,57a 切り欠き
50 クランプ機構
51 配管部材
52 継手部材
53 パージ部
54 係止部
55 基部
56 リストブロック
57 クランプ部材
58 プッシュロッド
59 電磁弁
60 固定部材
62 移動部材
63 ピストンロッド
65 エアシリンダ
66 透過光式センサ
67 センサドグ
68 シールド部材
69 継手
71 シート状フィルタ
72 置換機能を有さない公知のフィンガ
73a,73b 配管
C 中心線
M1,M2,M3,M4 モータ
W 半導体ウエハ
W’ 処理が終了した半導体ウエハ
Claims (10)
- 薄板状基板を保持して、前記薄板状基板の被処理面に不活性ガスを噴出させる薄板状基板保持フィンガであって、
内部に前記不活性ガスを流通させるための流路が形成されたフィンガ本体と、
不活性ガス供給源と前記流路とを連通させる配管部材と、
前記流路と連通し、前記フィンガ本体の前記薄板状基板の被処理面に対向する面に設けられていて、前記不活性ガスを前記薄板状基板の前記被処理面に噴出するための噴出口と、
前記フィンガ本体の前記噴出口が形成される面に配置され、前記薄板状基板の周縁部と当接する当接部材と、
前記薄板状部材に対して進退移動可能に配置されるクランプ部材と、
前記クランプ部材を進退移動させるクランプ機構と、を備えている
ことを特徴とする薄板状基板保持フィンガ。 - 前記フィンガ本体と前記当接部材とを含む鉛直方向の寸法は、
前記薄板状基板が収納される容器に形成された前記薄板状基板を載置する棚板の鉛直方向のピッチ寸法よりも小さい
ことを特徴とする、請求項1に記載の薄板状基板保持フィンガ。 - 前記フィンガ本体には、前記薄板状基板に前記不活性ガスを噴出させるパージ部が形成され、
前記パージ部は前記薄板状基板と略同じ直径を有する円盤状の形状をしている
ことを特徴とする請求項1もしくは請求項2に記載の薄板状基板保持フィンガ。 - 前記フィンガ本体の前記流路と前記噴出口との間にはフィルタが備えられている
ことを特徴とする請求項1から請求項3のいずれか1項に記載の薄板状基板保持フィンガ。 - 前記パージ部の周囲には、前記パージ部と前記薄板状基板との間に形成される空間を覆って、前記空間に充満した前記不活性ガスを前記薄板状基板の周縁部から下方に向かって排出させるシールド部材が備えられている
ことを特徴とする請求項3もしくは請求項4に記載の薄板状基板保持フィンガ。 - 前記噴出口は被保持基板の外側に向かって傾斜して設けられている
ことを特徴とする請求項1から請求項5のいずれか1項に記載の薄板状基板保持フィンガ。 - 前記噴出口は、前記当接部材にも設けられていて、
前記流路が前記当接部材に形成された前記噴出口にも連通している
ことを特徴とする請求項1から請求項6のいずれか1項に記載の薄板状基板保持フィンガ。 - 請求項1から請求項7のいずれか1項に記載の薄板状基板保持フィンガをアーム体の先端に少なくとも一つ備え、
前記アーム体を水平面内で動作させるアーム体駆動機構と、
前記アーム体を鉛直方向に昇降移動させる昇降機構と、を備えている
ことを特徴とする薄板状基板搬送ロボット。 - 請求項8に記載の薄板状基板搬送ロボットであって、さらに蓄圧器を備えている
ことを特徴とする薄板状基板搬送ロボット。 - 請求項8もしくは請求項9のいずれかに記載の薄板状基板搬送ロボットが配置される搬送空間と、
前記搬送空間を形成する搬送空間形成部材と、
前記搬送空間形成部材に固定され、前記薄板状基板を収容する密閉容器を所定の位置に載置して、前記密閉容器を気密に閉鎖する蓋を開閉する蓋開閉装置と、
前記搬送空間形成部材の上部に備えられ、前記搬送空間に清浄な空気をダウンフローとして供給するFFUと、を備え、
前記搬送空間の床面は、前記FFUから供給される前記清浄な空気の排出口が設けられている
ことを特徴とする薄板状基板搬送装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201880030266.7A CN110612601B (zh) | 2017-05-11 | 2018-04-23 | 薄板状衬底保持指状件以及具有该指状件的运送机器人 |
JP2019517547A JP7084385B2 (ja) | 2017-05-11 | 2018-04-23 | 薄板状基板保持フィンガ、及びこのフィンガを備える搬送ロボット |
US16/611,729 US11107722B2 (en) | 2017-05-11 | 2018-04-23 | Thin-plate substrate holding finger and transfer robot provided with said finger |
KR1020197031458A KR102474585B1 (ko) | 2017-05-11 | 2018-04-23 | 박판형상 기판 유지 핑거 및 이 핑거를 구비하는 반송 로봇 |
EP18797715.2A EP3605598B1 (en) | 2017-05-11 | 2018-04-23 | Thin-plate substrate holding finger and transfer robot provided with said finger |
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JP2017094316 | 2017-05-11 | ||
JP2017-094316 | 2017-05-11 |
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WO2018207599A1 true WO2018207599A1 (ja) | 2018-11-15 |
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US (1) | US11107722B2 (ja) |
EP (1) | EP3605598B1 (ja) |
JP (1) | JP7084385B2 (ja) |
KR (1) | KR102474585B1 (ja) |
CN (1) | CN110612601B (ja) |
TW (1) | TWI765025B (ja) |
WO (1) | WO2018207599A1 (ja) |
Cited By (3)
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CN112542417A (zh) * | 2019-09-20 | 2021-03-23 | 株式会社斯库林集团 | 基板处理装置以及基板搬运方法 |
CN112542411A (zh) * | 2019-09-20 | 2021-03-23 | 株式会社斯库林集团 | 基板处理装置 |
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JP6888852B1 (ja) * | 2020-05-21 | 2021-06-16 | 株式会社ハーモテック | 搬送装置 |
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2018
- 2018-04-23 JP JP2019517547A patent/JP7084385B2/ja active Active
- 2018-04-23 KR KR1020197031458A patent/KR102474585B1/ko active IP Right Grant
- 2018-04-23 EP EP18797715.2A patent/EP3605598B1/en active Active
- 2018-04-23 US US16/611,729 patent/US11107722B2/en active Active
- 2018-04-23 WO PCT/JP2018/016406 patent/WO2018207599A1/ja unknown
- 2018-04-23 CN CN201880030266.7A patent/CN110612601B/zh active Active
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CN112542417A (zh) * | 2019-09-20 | 2021-03-23 | 株式会社斯库林集团 | 基板处理装置以及基板搬运方法 |
CN112542411A (zh) * | 2019-09-20 | 2021-03-23 | 株式会社斯库林集团 | 基板处理装置 |
KR20210034524A (ko) * | 2019-09-20 | 2021-03-30 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 기판 반송 방법 |
KR102535157B1 (ko) | 2019-09-20 | 2023-05-22 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 기판 반송 방법 |
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JP7084385B2 (ja) | 2022-06-14 |
JPWO2018207599A1 (ja) | 2020-04-16 |
TW201901842A (zh) | 2019-01-01 |
EP3605598A4 (en) | 2020-04-15 |
US11107722B2 (en) | 2021-08-31 |
KR20200006045A (ko) | 2020-01-17 |
EP3605598A1 (en) | 2020-02-05 |
KR102474585B1 (ko) | 2022-12-06 |
US20200101624A1 (en) | 2020-04-02 |
CN110612601B (zh) | 2023-08-22 |
TWI765025B (zh) | 2022-05-21 |
EP3605598B1 (en) | 2024-05-01 |
CN110612601A (zh) | 2019-12-24 |
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