JP2005235860A5 - - Google Patents

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Publication number
JP2005235860A5
JP2005235860A5 JP2004040409A JP2004040409A JP2005235860A5 JP 2005235860 A5 JP2005235860 A5 JP 2005235860A5 JP 2004040409 A JP2004040409 A JP 2004040409A JP 2004040409 A JP2004040409 A JP 2004040409A JP 2005235860 A5 JP2005235860 A5 JP 2005235860A5
Authority
JP
Japan
Prior art keywords
layer
semiconductor device
barrier layer
via hole
back surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004040409A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005235860A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004040409A priority Critical patent/JP2005235860A/ja
Priority claimed from JP2004040409A external-priority patent/JP2005235860A/ja
Priority to TW094102436A priority patent/TWI261343B/zh
Priority to US11/054,603 priority patent/US7256497B2/en
Priority to KR1020050012334A priority patent/KR100646722B1/ko
Priority to EP05003396.8A priority patent/EP1564806B1/en
Priority to CN2005100093505A priority patent/CN1658385A/zh
Publication of JP2005235860A publication Critical patent/JP2005235860A/ja
Publication of JP2005235860A5 publication Critical patent/JP2005235860A5/ja
Priority to US11/822,262 priority patent/US7759247B2/en
Pending legal-status Critical Current

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JP2004040409A 2004-02-17 2004-02-17 半導体装置及びその製造方法 Pending JP2005235860A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2004040409A JP2005235860A (ja) 2004-02-17 2004-02-17 半導体装置及びその製造方法
TW094102436A TWI261343B (en) 2004-02-17 2005-01-27 Semiconductor device and method of manufacturing the same
US11/054,603 US7256497B2 (en) 2004-02-17 2005-02-10 Semiconductor device with a barrier layer and a metal layer
KR1020050012334A KR100646722B1 (ko) 2004-02-17 2005-02-15 반도체 장치 및 그 제조 방법
EP05003396.8A EP1564806B1 (en) 2004-02-17 2005-02-17 Semiconductor device and manufacturing method of the same
CN2005100093505A CN1658385A (zh) 2004-02-17 2005-02-17 半导体装置及其制造方法
US11/822,262 US7759247B2 (en) 2004-02-17 2007-07-03 Manufacturing method of semiconductor device with a barrier layer and a metal layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004040409A JP2005235860A (ja) 2004-02-17 2004-02-17 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JP2005235860A JP2005235860A (ja) 2005-09-02
JP2005235860A5 true JP2005235860A5 (enExample) 2007-03-15

Family

ID=34697999

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004040409A Pending JP2005235860A (ja) 2004-02-17 2004-02-17 半導体装置及びその製造方法

Country Status (6)

Country Link
US (2) US7256497B2 (enExample)
EP (1) EP1564806B1 (enExample)
JP (1) JP2005235860A (enExample)
KR (1) KR100646722B1 (enExample)
CN (1) CN1658385A (enExample)
TW (1) TWI261343B (enExample)

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