JP2008141204A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2008141204A5 JP2008141204A5 JP2007310344A JP2007310344A JP2008141204A5 JP 2008141204 A5 JP2008141204 A5 JP 2008141204A5 JP 2007310344 A JP2007310344 A JP 2007310344A JP 2007310344 A JP2007310344 A JP 2007310344A JP 2008141204 A5 JP2008141204 A5 JP 2008141204A5
- Authority
- JP
- Japan
- Prior art keywords
- groove
- insulating film
- manufacturing
- integrated circuit
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 18
- 238000004519 manufacturing process Methods 0.000 claims 16
- 230000004888 barrier function Effects 0.000 claims 15
- 229910052751 metal Inorganic materials 0.000 claims 13
- 239000002184 metal Substances 0.000 claims 13
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims 8
- 229910021529 ammonia Inorganic materials 0.000 claims 4
- 238000009832 plasma treatment Methods 0.000 claims 4
- 238000009713 electroplating Methods 0.000 claims 2
- 238000004544 sputter deposition Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007310344A JP2008141204A (ja) | 2007-11-30 | 2007-11-30 | 半導体集積回路装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007310344A JP2008141204A (ja) | 2007-11-30 | 2007-11-30 | 半導体集積回路装置の製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000104015A Division JP2001291720A (ja) | 2000-04-05 | 2000-04-05 | 半導体集積回路装置および半導体集積回路装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008141204A JP2008141204A (ja) | 2008-06-19 |
| JP2008141204A5 true JP2008141204A5 (enExample) | 2008-07-31 |
Family
ID=39602295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007310344A Pending JP2008141204A (ja) | 2007-11-30 | 2007-11-30 | 半導体集積回路装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008141204A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8178439B2 (en) * | 2010-03-30 | 2012-05-15 | Tokyo Electron Limited | Surface cleaning and selective deposition of metal-containing cap layers for semiconductor devices |
| JP6263450B2 (ja) * | 2014-07-24 | 2018-01-17 | 東京エレクトロン株式会社 | 有機単分子膜形成方法 |
| KR20170135760A (ko) * | 2016-05-31 | 2017-12-08 | 도쿄엘렉트론가부시키가이샤 | 표면 처리에 의한 선택적 퇴적 |
| CN110709967B (zh) * | 2017-07-24 | 2023-09-01 | 应用材料公司 | 改善在氧化硅上的超薄非晶硅膜的连续性的预处理方法 |
| US11826718B2 (en) | 2021-08-18 | 2023-11-28 | Lyten, Inc. | Negative emission, large scale carbon capture during clean hydrogen fuel synthesis |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10154709A (ja) * | 1996-09-25 | 1998-06-09 | Toshiba Corp | 半導体装置の製造方法 |
| JPH10125783A (ja) * | 1996-10-15 | 1998-05-15 | Sony Corp | 半導体装置の製造方法 |
| JPH1116912A (ja) * | 1997-06-25 | 1999-01-22 | Hitachi Ltd | 半導体集積回路装置の製造方法および半導体集積回路装置の製造装置 |
| JP3463979B2 (ja) * | 1997-07-08 | 2003-11-05 | 富士通株式会社 | 半導体装置の製造方法 |
| JP3944317B2 (ja) * | 1998-06-09 | 2007-07-11 | 住友重機械工業株式会社 | Ｃｕ成膜方法 |
| JP3080071B2 (ja) * | 1998-06-12 | 2000-08-21 | 日本電気株式会社 | 半導体装置及びその製造方法 |
-
2007
- 2007-11-30 JP JP2007310344A patent/JP2008141204A/ja active Pending