JP2005203743A5 - - Google Patents

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Publication number
JP2005203743A5
JP2005203743A5 JP2004330576A JP2004330576A JP2005203743A5 JP 2005203743 A5 JP2005203743 A5 JP 2005203743A5 JP 2004330576 A JP2004330576 A JP 2004330576A JP 2004330576 A JP2004330576 A JP 2004330576A JP 2005203743 A5 JP2005203743 A5 JP 2005203743A5
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Japan
Prior art keywords
temperature
processing
heater
heat treatment
set point
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JP2004330576A
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Japanese (ja)
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JP4568089B2 (ja
JP2005203743A (ja
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Priority claimed from US10/713,543 external-priority patent/US6940047B2/en
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Publication of JP2005203743A publication Critical patent/JP2005203743A/ja
Publication of JP2005203743A5 publication Critical patent/JP2005203743A5/ja
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Publication of JP4568089B2 publication Critical patent/JP4568089B2/ja
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JP2004330576A 2003-11-14 2004-11-15 温度制御システムを備えた熱処理装置 Expired - Lifetime JP4568089B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/713,543 US6940047B2 (en) 2003-11-14 2003-11-14 Heat treatment apparatus with temperature control system

Publications (3)

Publication Number Publication Date
JP2005203743A JP2005203743A (ja) 2005-07-28
JP2005203743A5 true JP2005203743A5 (https=) 2007-03-01
JP4568089B2 JP4568089B2 (ja) 2010-10-27

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JP2004330576A Expired - Lifetime JP4568089B2 (ja) 2003-11-14 2004-11-15 温度制御システムを備えた熱処理装置

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US (1) US6940047B2 (https=)
JP (1) JP4568089B2 (https=)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10227953B4 (de) * 2002-06-22 2005-04-07 Schott Glas Druckeinrichtung
EP1803328B1 (en) * 2004-09-30 2012-04-11 Watlow Electric Manufacturing Company Modular layered heater system
US7217670B2 (en) * 2004-11-22 2007-05-15 Asm International N.V. Dummy substrate for thermal reactor
US7980481B2 (en) * 2004-12-08 2011-07-19 Rosemount Inc. Thermally controlled process interface
US7482555B2 (en) * 2004-12-23 2009-01-27 Au Optronics Corporation Substrate transportation device (air)
EP2021279A2 (en) * 2006-04-13 2009-02-11 Cabot Corporation Production of silicon through a closed-loop process
US8043087B2 (en) * 2006-10-11 2011-10-25 Raytheon Company Methods and apparatus for thermal development of large area solids
JP5226206B2 (ja) * 2006-12-22 2013-07-03 三井造船株式会社 誘導加熱を用いた熱処理方法および熱処理装置
KR100820650B1 (ko) * 2007-03-15 2008-04-08 주식회사 경동네트웍 난방장치 제어방법
JP5021347B2 (ja) * 2007-03-26 2012-09-05 三井造船株式会社 熱処理装置
US11738130B2 (en) 2008-01-23 2023-08-29 Deka Products Limited Partnership Fluid line autoconnect apparatus and methods for medical treatment system
US11833281B2 (en) 2008-01-23 2023-12-05 Deka Products Limited Partnership Pump cassette and methods for use in medical treatment system using a plurality of fluid lines
MX340210B (es) 2008-01-23 2016-06-29 Deka Products Ltd Partnership * Componentes desechables para sistemas y métodos de autoconexión de una linea de fluido.
US10195330B2 (en) 2008-01-23 2019-02-05 Deka Products Limited Partnership Medical treatment system and methods using a plurality of fluid lines
US8315746B2 (en) 2008-05-30 2012-11-20 Apple Inc. Thermal management techniques in an electronic device
US8002463B2 (en) * 2008-06-13 2011-08-23 Asm International N.V. Method and device for determining the temperature of a substrate
US12171922B2 (en) 2008-08-27 2024-12-24 Deka Products Limited Partnership Blood treatment systems and methods
WO2010038674A1 (ja) * 2008-09-30 2010-04-08 東京エレクトロン株式会社 基板の異常載置状態の検知方法、基板処理方法、コンピュータ読み取り可能な記憶媒体および基板処理装置
US8306772B2 (en) 2008-10-13 2012-11-06 Apple Inc. Method for estimating temperature at a critical point
US20100130352A1 (en) * 2008-11-25 2010-05-27 Dabich Ii Leonard Charles Methods For Processing Shaped Bodies
US20100127418A1 (en) * 2008-11-25 2010-05-27 Ronald Alan Davidson Methods For Continuous Firing Of Shaped Bodies And Roller Hearth Furnaces Therefor
US20100127421A1 (en) * 2008-11-25 2010-05-27 Dabich Ii Leonard Charles Bi-directional flow for processing shaped bodies
JP2011091386A (ja) * 2009-09-24 2011-05-06 Semiconductor Energy Lab Co Ltd 熱処理装置、熱処理方法及び半導体装置の作製方法
DE112012001031T5 (de) * 2011-02-28 2013-11-28 Ihi Corporation Vorrichtung und Verfahren zum Messen der Temperatur eines wärmebehandelten Werkstücks
EP3498316B1 (en) 2011-11-04 2020-07-22 DEKA Products Limited Partnership Medical treatment system and methods using a plurality of fluid lines
JP6304660B2 (ja) * 2012-08-07 2018-04-04 パナソニックＩｐマネジメント株式会社 バッテリーヒータ装置
US8691598B1 (en) * 2012-12-06 2014-04-08 Ultratech, Inc. Dual-loop control for laser annealing of semiconductor wafers
US8772055B1 (en) * 2013-01-16 2014-07-08 Applied Materials, Inc. Multizone control of lamps in a conical lamphead using pyrometers
JP6324739B2 (ja) * 2014-01-27 2018-05-16 株式会社Kelk 半導体ウェーハの温度制御装置、及び半導体ウェーハの温度制御方法
US10006717B2 (en) 2014-03-07 2018-06-26 Taiwan Semiconductor Manufacturing Company, Ltd. Adaptive baking system and method of using the same
KR101448546B1 (ko) * 2014-04-16 2014-10-14 주식회사 이엔씨 테크놀로지 공기 순환 유닛을 갖는 평면 디스플레이 패널의 열처리 장치 및 그 열처리 방법
US10453714B2 (en) 2016-08-05 2019-10-22 Sandvik Thermal Process, Inc. Thermal process device
JP6798017B6 (ja) * 2016-10-17 2021-01-13 エーエスエムエル ネザーランズ ビー．ブイ． 基板にわたってパラメータ変動を修正する処理装置及び方法
US10851457B2 (en) 2017-08-31 2020-12-01 Lam Research Corporation PECVD deposition system for deposition on selective side of the substrate
CN108088246A (zh) * 2017-12-22 2018-05-29 合肥费舍罗热工装备有限公司 一种立式梯度炉
KR102403198B1 (ko) 2019-07-19 2022-05-27 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP2022544221A (ja) * 2019-08-16 2022-10-17 ラム リサーチ コーポレーション ウエハ内の様々な反りを補償するために空間を調整する堆積
EP4200900A1 (en) * 2020-08-18 2023-06-28 Mattson Technology, Inc. Rapid thermal processing system with cooling system
CN112852469A (zh) * 2021-03-26 2021-05-28 杰瑞环保科技有限公司 含油固体物料处理系统和含油固体物料处理方法
CN113340125A (zh) * 2021-06-08 2021-09-03 吉林麦吉柯半导体有限公司 推拉控制设备和扩散炉系统
KR20230004095A (ko) * 2021-06-30 2023-01-06 주성엔지니어링(주) 캐니스터 온도 제어 방법 및 원료 공급 장치
CN115674550B (zh) * 2022-10-26 2024-02-23 安徽尚诺捷顺智能科技有限公司 用于冰箱门体生产的固化烘炉
CN118522686B (zh) * 2024-07-22 2024-11-19 无锡邑文微电子科技股份有限公司 一种晶圆夹持及热处理设备
CN120816690B (zh) * 2025-09-16 2025-12-02 湖南科太科技有限公司 用于注胶模具智能温控的软启动控制方法

Family Cites Families (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3947236A (en) 1971-11-29 1976-03-30 Lasch Jr Cecil A Fluid bearing transfer and heat treating apparatus and method
US4346433A (en) 1980-03-11 1982-08-24 Phillips Petroleum Company Process control
US4385362A (en) 1980-10-20 1983-05-24 Leeds & Northrup Company Filter arrangement for elimination of unwanted bias in a model reference process control system
NL8103979A (nl) 1981-08-26 1983-03-16 Bok Edward Methode en inrichting voor het aanbrengen van een film vloeibaar medium op een substraat.
NL8200753A (nl) 1982-02-24 1983-09-16 Integrated Automation Methode en inrichting voor het aanbrengen van een coating op een substraat of tape.
NL8203318A (nl) 1982-08-24 1984-03-16 Integrated Automation Inrichting voor processing van substraten.
EP0128491B1 (en) 1983-06-03 1989-12-13 Omron Tateisi Electronics Co. Time-discrete adaptive switching on-off-controller
JPS59229622A (ja) 1983-06-10 1984-12-24 Toshiba Corp プラント診断装置
JPS61294812A (ja) 1985-06-24 1986-12-25 Hitachi Ltd 気相浮上エピタキシヤル成長装置
JPS6221237A (ja) 1985-07-22 1987-01-29 Ulvac Corp ウエハ位置決め用テ−ブル
FR2596070A1 (fr) 1986-03-21 1987-09-25 Labo Electronique Physique Dispositif comprenant un suscepteur plan tournant parallelement a un plan de reference autour d'un axe perpendiculaire a ce plan
US4975561A (en) 1987-06-18 1990-12-04 Epsilon Technology Inc. Heating system for substrates
JPH0234915A (ja) 1988-07-25 1990-02-05 Mitsubishi Electric Corp 半導体熱処理装置
DE69007733T2 (de) 1989-05-08 1994-09-29 Philips Nv Vorrichtung und verfahren zur behandlung eines flachen, scheibenförmigen substrates unter niedrigem druck.
JPH03125453A (ja) 1989-10-09 1991-05-28 Toshiba Corp 半導体ウエハ移送装置
JP2704309B2 (ja) 1990-06-12 1998-01-26 大日本スクリーン製造株式会社 基板処理装置及び基板の熱処理方法
KR0153250B1 (ko) 1990-06-28 1998-12-01 카자마 겐쥬 종형 열처리 장치
JP3061401B2 (ja) 1990-07-20 2000-07-10 株式会社東芝 半導体気相成長装置
KR960010334B1 (en) 1990-09-25 1996-07-30 Matsushita Electric Industrial Co Ltd Fabricating method of semiconductor device
US5436172A (en) 1991-05-20 1995-07-25 Texas Instruments Incorporated Real-time multi-zone semiconductor wafer temperature and process uniformity control system
US5332442A (en) 1991-11-15 1994-07-26 Tokyo Electron Kabushiki Kaisha Surface processing apparatus
NL9200446A (nl) 1992-03-10 1993-10-01 Tempress B V Inrichting voor het behandelen van microschakeling-schijven (wafers).
JP3258748B2 (ja) 1993-02-08 2002-02-18 東京エレクトロン株式会社 熱処理装置
JPH06244095A (ja) 1993-02-12 1994-09-02 Dainippon Screen Mfg Co Ltd 基板冷却装置
JP3380988B2 (ja) 1993-04-21 2003-02-24 東京エレクトロン株式会社 熱処理装置
FR2707638B1 (fr) * 1993-07-16 1995-08-18 Bioprojet Soc Civ Nouveaux dérivés d'amino-acides, leurs procédés de préparation et leur application thérapeutique.
US5650082A (en) 1993-10-29 1997-07-22 Applied Materials, Inc. Profiled substrate heating
US5431700A (en) 1994-03-30 1995-07-11 Fsi International, Inc. Vertical multi-process bake/chill apparatus
JPH08236533A (ja) 1995-02-24 1996-09-13 Toshiba Corp ウエハ加熱冷却装置
JP3824675B2 (ja) 1995-03-03 2006-09-20 有限会社デジタル・ウェーブ 結晶製造装置
US5997588A (en) 1995-10-13 1999-12-07 Advanced Semiconductor Materials America, Inc. Semiconductor processing system with gas curtain
DE19548909A1 (de) 1995-12-27 1997-07-03 Siemens Ag Verfahren zur Regelung eines verzögerungsbehafteten Prozesses mit Ausgleich sowie Regeleinrichtung zur Durchführung des Verfahrens
KR100486158B1 (ko) 1996-01-31 2005-11-08 에이에스엠 아메리카, 인코포레이티드 열처리의모델베이스예측제어
US6111225A (en) 1996-02-23 2000-08-29 Tokyo Electron Limited Wafer processing apparatus with a processing vessel, upper and lower separately sealed heating vessels, and means for maintaining the vessels at predetermined pressures
WO1997045862A1 (en) 1996-05-31 1997-12-04 Ipec Precision, Inc. Non-contact holder for wafer-like articles
US6183565B1 (en) 1997-07-08 2001-02-06 Asm International N.V Method and apparatus for supporting a semiconductor wafer during processing
NL1003538C2 (nl) 1996-07-08 1998-01-12 Advanced Semiconductor Mat Werkwijze en inrichting voor het contactloos behandelen van een schijfvormig halfgeleidersubstraat.
US5855681A (en) 1996-11-18 1999-01-05 Applied Materials, Inc. Ultra high throughput wafer vacuum processing system
JP3802965B2 (ja) 1997-03-21 2006-08-02 ヴイ．ウリヤノフ セルゲイ 非線形の物理的な制御対象の最適制御のための自己組織化方法及び装置
JPH10321505A (ja) 1997-05-20 1998-12-04 Sony Corp フォトレジスト膜の硬化方法およびその装置
DE19722431A1 (de) 1997-05-28 1998-12-03 Siemens Ag Verfahren zur Regelung eines verzögerungsbehafteten Prozesses mit Ausgleich sowie Regeleinrichtung zur Durchführung des Verfahrens
JP3665826B2 (ja) 1997-05-29 2005-06-29 Ｓｍｃ株式会社 基板熱処理装置
US6280790B1 (en) 1997-06-30 2001-08-28 Applied Materials, Inc. Reducing the deposition rate of volatile contaminants onto an optical component of a substrate processing system
US6275744B1 (en) 1997-08-01 2001-08-14 Kokusai Electric Co., Ltd. Substrate feed control
US6018616A (en) 1998-02-23 2000-01-25 Applied Materials, Inc. Thermal cycling module and process using radiant heat
US6072163A (en) 1998-03-05 2000-06-06 Fsi International Inc. Combination bake/chill apparatus incorporating low thermal mass, thermally conductive bakeplate
US6064799A (en) 1998-04-30 2000-05-16 Applied Materials, Inc. Method and apparatus for controlling the radial temperature gradient of a wafer while ramping the wafer temperature
JP2002515648A (ja) 1998-05-11 2002-05-28 セミトゥール・インコーポレイテッド 加熱反応炉の温度制御システム
JP3453069B2 (ja) 1998-08-20 2003-10-06 東京エレクトロン株式会社 基板温調装置
JP4551515B2 (ja) 1998-10-07 2010-09-29 株式会社日立国際電気 半導体製造装置およびその温度制御方法
US6234788B1 (en) 1998-11-05 2001-05-22 Applied Science And Technology, Inc. Disk furnace for thermal processing
JP3522556B2 (ja) * 1998-12-10 2004-04-26 株式会社山武 制御モード切換装置及び温度制御システム
NL1011017C2 (nl) 1999-01-13 2000-07-31 Asm Int Inrichting voor het positioneren van een wafer.
NL1011856C2 (nl) 1999-04-21 2000-10-24 Asm Internat B V Floating wafer reactor alsmede werkwijze voor het regelen van de temperatuur daarvan.
NL1012004C2 (nl) 1999-05-07 2000-11-13 Asm Int Werkwijze voor het verplaatsen van wafers alsmede ring.
NL1013984C2 (nl) 1999-12-29 2001-07-02 Asm Int Werkwijze en inrichting voor het behandelen van substraten.
JP2002108411A (ja) * 2000-10-03 2002-04-10 Omron Corp 温度調節器および熱処理装置
NL1018086C2 (nl) 2001-05-16 2002-11-26 Asm Int Werkwijze en inrichting voor het thermisch behandelen van substraten.
US7427329B2 (en) 2002-05-08 2008-09-23 Asm International N.V. Temperature control for single substrate semiconductor processing reactor
US6843201B2 (en) 2002-05-08 2005-01-18 Asm International Nv Temperature control for single substrate semiconductor processing reactor

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