JP2007088394A5 - - Google Patents

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Publication number
JP2007088394A5
JP2007088394A5 JP2005278771A JP2005278771A JP2007088394A5 JP 2007088394 A5 JP2007088394 A5 JP 2007088394A5 JP 2005278771 A JP2005278771 A JP 2005278771A JP 2005278771 A JP2005278771 A JP 2005278771A JP 2007088394 A5 JP2007088394 A5 JP 2007088394A5
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JP
Japan
Prior art keywords
temperature
temperature sensor
measured
processing chamber
heating means
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JP2005278771A
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English (en)
Japanese (ja)
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JP4878801B2 (ja
JP2007088394A (ja
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Priority to JP2005278771A priority Critical patent/JP4878801B2/ja
Priority claimed from JP2005278771A external-priority patent/JP4878801B2/ja
Publication of JP2007088394A publication Critical patent/JP2007088394A/ja
Publication of JP2007088394A5 publication Critical patent/JP2007088394A5/ja
Application granted granted Critical
Publication of JP4878801B2 publication Critical patent/JP4878801B2/ja
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JP2005278771A 2005-09-26 2005-09-26 基板処理装置、半導体装置の製造方法 Expired - Lifetime JP4878801B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005278771A JP4878801B2 (ja) 2005-09-26 2005-09-26 基板処理装置、半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005278771A JP4878801B2 (ja) 2005-09-26 2005-09-26 基板処理装置、半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2007088394A JP2007088394A (ja) 2007-04-05
JP2007088394A5 true JP2007088394A5 (https=) 2008-10-30
JP4878801B2 JP4878801B2 (ja) 2012-02-15

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ID=37975043

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005278771A Expired - Lifetime JP4878801B2 (ja) 2005-09-26 2005-09-26 基板処理装置、半導体装置の製造方法

Country Status (1)

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JP (1) JP4878801B2 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5510991B2 (ja) * 2007-09-06 2014-06-04 株式会社日立国際電気 半導体製造装置及び基板処理方法
US8916793B2 (en) 2010-06-08 2014-12-23 Applied Materials, Inc. Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow
US9338871B2 (en) 2010-01-29 2016-05-10 Applied Materials, Inc. Feedforward temperature control for plasma processing apparatus
US8880227B2 (en) * 2010-05-27 2014-11-04 Applied Materials, Inc. Component temperature control by coolant flow control and heater duty cycle control
US10274270B2 (en) 2011-10-27 2019-04-30 Applied Materials, Inc. Dual zone common catch heat exchanger/chiller
JP5539449B2 (ja) * 2012-06-29 2014-07-02 東京エレクトロン株式会社 プログラム、熱処理装置及び熱処理装置の動作検出方法
JP7154116B2 (ja) * 2018-11-28 2022-10-17 東京エレクトロン株式会社 原料タンクの監視装置及び原料タンクの監視方法
JP6917495B1 (ja) 2020-03-04 2021-08-11 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法及びプログラム
KR102520584B1 (ko) * 2020-10-14 2023-04-10 세메스 주식회사 공정 계측 장치 및 방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09134886A (ja) * 1995-11-08 1997-05-20 Kokusai Electric Co Ltd 半導体製造装置のランピング温度制御方法
JPH1025577A (ja) * 1996-07-12 1998-01-27 Tokyo Electron Ltd 成膜処理装置
JP4358915B2 (ja) * 1997-03-21 2009-11-04 株式会社日立国際電気 半導体製造システム
WO1999059196A1 (en) * 1998-05-11 1999-11-18 Semitool, Inc. Temperature control system for a thermal reactor
JP4286514B2 (ja) * 2002-09-27 2009-07-01 株式会社日立国際電気 半導体製造装置及び温度制御方法、半導体製造方法
US7006900B2 (en) * 2002-11-14 2006-02-28 Asm International N.V. Hybrid cascade model-based predictive control system
JP2005123308A (ja) * 2003-10-15 2005-05-12 Hitachi Kokusai Electric Inc 基板処理装置

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