JP2021521441A5 - - Google Patents
Info
- Publication number
- JP2021521441A5 JP2021521441A5 JP2020555869A JP2020555869A JP2021521441A5 JP 2021521441 A5 JP2021521441 A5 JP 2021521441A5 JP 2020555869 A JP2020555869 A JP 2020555869A JP 2020555869 A JP2020555869 A JP 2020555869A JP 2021521441 A5 JP2021521441 A5 JP 2021521441A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- temperature
- mass
- heat transfer
- transfer plate
- Prior art date
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB1806377.6A GB201806377D0 (en) | 2018-04-19 | 2018-04-19 | Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method |
| GB1806377.6 | 2018-04-19 | ||
| PCT/EP2019/058388 WO2019201603A1 (en) | 2018-04-19 | 2019-04-03 | Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| JP2021521441A JP2021521441A (ja) | 2021-08-26 |
| JP2021521441A5 true JP2021521441A5 (https=) | 2022-04-11 |
| JPWO2019201603A5 JPWO2019201603A5 (https=) | 2022-04-11 |
| JP7335896B2 JP7335896B2 (ja) | 2023-08-30 |
Family
ID=62236133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020555869A Active JP7335896B2 (ja) | 2018-04-19 | 2019-04-03 | 半導体ウエハ質量計測装置および半導体ウエハ質量計測方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US12288702B2 (https=) |
| EP (1) | EP3782188B1 (https=) |
| JP (1) | JP7335896B2 (https=) |
| KR (3) | KR102547839B1 (https=) |
| CN (1) | CN112368814B (https=) |
| GB (1) | GB201806377D0 (https=) |
| SG (1) | SG11202010143VA (https=) |
| TW (1) | TWI822759B (https=) |
| WO (1) | WO2019201603A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB201815815D0 (en) * | 2018-09-28 | 2018-11-14 | Metryx Ltd | Method and apparatus for controlling the temperature of a semiconductor wafer |
| CN113496912B (zh) * | 2020-04-02 | 2023-10-17 | 长鑫存储技术有限公司 | 监测晶圆及监测系统 |
| CN113819985A (zh) * | 2020-06-18 | 2021-12-21 | 拓荆科技股份有限公司 | 晶圆防干扰称重装置及其应用 |
| CN116417319A (zh) * | 2021-12-30 | 2023-07-11 | 中微半导体设备(上海)股份有限公司 | 一种控温装置及相应的等离子体处理器 |
| KR102706137B1 (ko) * | 2022-06-14 | 2024-09-13 | 주식회사 코비스테크놀로지 | 병렬구조의 질량측정장치를 이용한 질량측정방법 |
| GB202414501D0 (en) * | 2024-10-02 | 2024-11-13 | Metryx Ltd | Method and apparatus for controlling the temperature of a wafer |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6072163A (en) * | 1998-03-05 | 2000-06-06 | Fsi International Inc. | Combination bake/chill apparatus incorporating low thermal mass, thermally conductive bakeplate |
| KR100342754B1 (ko) | 1999-11-10 | 2002-07-04 | 황인길 | 무게 측정을 통한 반도체 웨이퍼의 정렬 시스템 |
| GB0016562D0 (en) | 2000-07-05 | 2000-08-23 | Metryx Limited | Apparatus and method for investigating semiconductor wafers |
| US6790376B1 (en) * | 2001-07-23 | 2004-09-14 | Advanced Micro Devices, Inc. | Process control based upon weight or mass measurements, and systems for accomplishing same |
| CN1702849A (zh) * | 2004-05-26 | 2005-11-30 | 松下电器产业株式会社 | 温度异常检测方法及半导体制造装置 |
| US20060004493A1 (en) * | 2004-06-30 | 2006-01-05 | Jack Hwang | Use of active temperature control to provide emmisivity independent wafer temperature |
| US20060286807A1 (en) * | 2005-06-16 | 2006-12-21 | Jack Hwang | Use of active temperature control to provide emmisivity independent wafer temperature |
| KR20060118747A (ko) * | 2005-05-17 | 2006-11-24 | 삼성전자주식회사 | 온도 조절 어셈블리 및 이를 갖는 이온 주입 장치 |
| US7534627B2 (en) * | 2006-08-07 | 2009-05-19 | Sokudo Co., Ltd. | Methods and systems for controlling critical dimensions in track lithography tools |
| US7935942B2 (en) * | 2006-08-15 | 2011-05-03 | Varian Semiconductor Equipment Associates, Inc. | Technique for low-temperature ion implantation |
| GB0719469D0 (en) | 2007-10-04 | 2007-11-14 | Metryx Ltd | Measurement apparatus and method |
| GB0719460D0 (en) | 2007-10-04 | 2007-11-14 | Metryx Ltd | Measurement apparatus and method |
| DE102008041250A1 (de) | 2008-08-13 | 2010-02-25 | Ers Electronic Gmbh | Verfahren und Vorrichtung zum thermischen Bearbeiten von Kunststoffscheiben, insbesondere Moldwafern |
| US9111971B2 (en) * | 2012-07-30 | 2015-08-18 | Applied Materials Israel, Ltd. | System and method for temperature control of a semiconductor wafer |
| GB201315715D0 (en) * | 2013-09-04 | 2013-10-16 | Metryx Ltd | Method and device for determining information relating to the mass of a semiconductor wafer |
| GB201321423D0 (en) * | 2013-12-04 | 2014-01-15 | Metryx Ltd | Semiconductor wafer processing methods and apparatus |
| WO2015169616A1 (en) * | 2014-05-06 | 2015-11-12 | Asml Netherlands B.V. | Substrate support, method for loading a substrate on a substrate support location, lithographic apparatus and device manufacturing method |
| US20150332942A1 (en) | 2014-05-16 | 2015-11-19 | Eng Sheng Peh | Pedestal fluid-based thermal control |
| US10430719B2 (en) * | 2014-11-25 | 2019-10-01 | Stream Mosaic, Inc. | Process control techniques for semiconductor manufacturing processes |
| US10269682B2 (en) | 2015-10-09 | 2019-04-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices |
| GB201815815D0 (en) * | 2018-09-28 | 2018-11-14 | Metryx Ltd | Method and apparatus for controlling the temperature of a semiconductor wafer |
-
2018
- 2018-04-19 GB GBGB1806377.6A patent/GB201806377D0/en not_active Ceased
-
2019
- 2019-04-03 US US17/048,489 patent/US12288702B2/en active Active
- 2019-04-03 WO PCT/EP2019/058388 patent/WO2019201603A1/en not_active Ceased
- 2019-04-03 CN CN201980026826.6A patent/CN112368814B/zh active Active
- 2019-04-03 SG SG11202010143VA patent/SG11202010143VA/en unknown
- 2019-04-03 KR KR1020207033146A patent/KR102547839B1/ko active Active
- 2019-04-03 KR KR1020257042013A patent/KR20260003408A/ko active Pending
- 2019-04-03 KR KR1020237021001A patent/KR102902474B1/ko active Active
- 2019-04-03 JP JP2020555869A patent/JP7335896B2/ja active Active
- 2019-04-03 EP EP19715474.3A patent/EP3782188B1/en active Active
- 2019-04-16 TW TW108113138A patent/TWI822759B/zh active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2021521441A5 (https=) | ||
| JP2001257169A5 (https=) | ||
| US20160178446A1 (en) | Device for measuring the temperature of a medium through a wall | |
| JP2009081415A5 (https=) | ||
| TW200720681A (en) | Electronic component test apparatus and temperature control method in electronic component test apparatus | |
| US10627204B2 (en) | Coefficient-of-thermal-expansion measurement method and measuring device for coefficient of thermal expansion | |
| CN107817054A (zh) | 一种用于真空腔内部件的红外成像仪测温方法 | |
| JP4355792B2 (ja) | 熱式流量計 | |
| JP6843014B2 (ja) | 熱式流量計および流量補正方法 | |
| KR102715840B1 (ko) | 써모커플 센서의 온도 계측 장치 및 그를 이용한 선박 대형 엔진 시운전용 데이터 계측 시스템 | |
| JP2019129598A5 (https=) | ||
| JPWO2019201603A5 (https=) | ||
| CN104122292B (zh) | 一种低接触应力条件下接触热阻检测装置 | |
| JP6594250B2 (ja) | 温度計測装置及び温度計測方法 | |
| US11173671B2 (en) | Electric heating device | |
| US9696219B2 (en) | Method for calibrating a measuring device in a mobile terminal | |
| JP2015519542A5 (https=) | ||
| JP2007088394A5 (https=) | ||
| KR100791199B1 (ko) | 거리 추정 장치, 이상 검출 장치, 온도 조절기 및 열처리장치 | |
| JP4093099B2 (ja) | 液漏れ検出装置 | |
| JPWO2023162054A5 (https=) | ||
| JP6299876B2 (ja) | 表面温度センサ校正装置 | |
| CN104132963A (zh) | 一种微应力条件下接触热阻检测装置 | |
| JP2015087277A (ja) | 測温体校正装置、測温体校正システム及び測温体校正方法 | |
| WO2021260834A1 (ja) | 温度測定装置、方法およびプログラム |