SG11202010143VA - Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method - Google Patents
Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology methodInfo
- Publication number
- SG11202010143VA SG11202010143VA SG11202010143VA SG11202010143VA SG11202010143VA SG 11202010143V A SG11202010143V A SG 11202010143VA SG 11202010143V A SG11202010143V A SG 11202010143VA SG 11202010143V A SG11202010143V A SG 11202010143VA SG 11202010143V A SG11202010143V A SG 11202010143VA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor wafer
- mass metrology
- wafer mass
- metrology apparatus
- metrology method
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0602—Temperature monitoring
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/72—Investigating presence of flaws
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0432—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3306—Horizontal transfer of a single workpiece
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB1806377.6A GB201806377D0 (en) | 2018-04-19 | 2018-04-19 | Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method |
| PCT/EP2019/058388 WO2019201603A1 (en) | 2018-04-19 | 2019-04-03 | Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11202010143VA true SG11202010143VA (en) | 2020-11-27 |
Family
ID=62236133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11202010143VA SG11202010143VA (en) | 2018-04-19 | 2019-04-03 | Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US12288702B2 (https=) |
| EP (1) | EP3782188B1 (https=) |
| JP (1) | JP7335896B2 (https=) |
| KR (3) | KR102547839B1 (https=) |
| CN (1) | CN112368814B (https=) |
| GB (1) | GB201806377D0 (https=) |
| SG (1) | SG11202010143VA (https=) |
| TW (1) | TWI822759B (https=) |
| WO (1) | WO2019201603A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB201815815D0 (en) * | 2018-09-28 | 2018-11-14 | Metryx Ltd | Method and apparatus for controlling the temperature of a semiconductor wafer |
| CN113496912B (zh) * | 2020-04-02 | 2023-10-17 | 长鑫存储技术有限公司 | 监测晶圆及监测系统 |
| CN113819985A (zh) * | 2020-06-18 | 2021-12-21 | 拓荆科技股份有限公司 | 晶圆防干扰称重装置及其应用 |
| CN116417319A (zh) * | 2021-12-30 | 2023-07-11 | 中微半导体设备(上海)股份有限公司 | 一种控温装置及相应的等离子体处理器 |
| KR102706137B1 (ko) * | 2022-06-14 | 2024-09-13 | 주식회사 코비스테크놀로지 | 병렬구조의 질량측정장치를 이용한 질량측정방법 |
| GB202414501D0 (en) * | 2024-10-02 | 2024-11-13 | Metryx Ltd | Method and apparatus for controlling the temperature of a wafer |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6072163A (en) * | 1998-03-05 | 2000-06-06 | Fsi International Inc. | Combination bake/chill apparatus incorporating low thermal mass, thermally conductive bakeplate |
| KR100342754B1 (ko) | 1999-11-10 | 2002-07-04 | 황인길 | 무게 측정을 통한 반도체 웨이퍼의 정렬 시스템 |
| GB0016562D0 (en) | 2000-07-05 | 2000-08-23 | Metryx Limited | Apparatus and method for investigating semiconductor wafers |
| US6790376B1 (en) * | 2001-07-23 | 2004-09-14 | Advanced Micro Devices, Inc. | Process control based upon weight or mass measurements, and systems for accomplishing same |
| CN1702849A (zh) * | 2004-05-26 | 2005-11-30 | 松下电器产业株式会社 | 温度异常检测方法及半导体制造装置 |
| US20060004493A1 (en) * | 2004-06-30 | 2006-01-05 | Jack Hwang | Use of active temperature control to provide emmisivity independent wafer temperature |
| US20060286807A1 (en) * | 2005-06-16 | 2006-12-21 | Jack Hwang | Use of active temperature control to provide emmisivity independent wafer temperature |
| KR20060118747A (ko) * | 2005-05-17 | 2006-11-24 | 삼성전자주식회사 | 온도 조절 어셈블리 및 이를 갖는 이온 주입 장치 |
| US7534627B2 (en) * | 2006-08-07 | 2009-05-19 | Sokudo Co., Ltd. | Methods and systems for controlling critical dimensions in track lithography tools |
| US7935942B2 (en) * | 2006-08-15 | 2011-05-03 | Varian Semiconductor Equipment Associates, Inc. | Technique for low-temperature ion implantation |
| GB0719469D0 (en) | 2007-10-04 | 2007-11-14 | Metryx Ltd | Measurement apparatus and method |
| GB0719460D0 (en) | 2007-10-04 | 2007-11-14 | Metryx Ltd | Measurement apparatus and method |
| DE102008041250A1 (de) | 2008-08-13 | 2010-02-25 | Ers Electronic Gmbh | Verfahren und Vorrichtung zum thermischen Bearbeiten von Kunststoffscheiben, insbesondere Moldwafern |
| US9111971B2 (en) * | 2012-07-30 | 2015-08-18 | Applied Materials Israel, Ltd. | System and method for temperature control of a semiconductor wafer |
| GB201315715D0 (en) * | 2013-09-04 | 2013-10-16 | Metryx Ltd | Method and device for determining information relating to the mass of a semiconductor wafer |
| GB201321423D0 (en) * | 2013-12-04 | 2014-01-15 | Metryx Ltd | Semiconductor wafer processing methods and apparatus |
| WO2015169616A1 (en) * | 2014-05-06 | 2015-11-12 | Asml Netherlands B.V. | Substrate support, method for loading a substrate on a substrate support location, lithographic apparatus and device manufacturing method |
| US20150332942A1 (en) | 2014-05-16 | 2015-11-19 | Eng Sheng Peh | Pedestal fluid-based thermal control |
| US10430719B2 (en) * | 2014-11-25 | 2019-10-01 | Stream Mosaic, Inc. | Process control techniques for semiconductor manufacturing processes |
| US10269682B2 (en) | 2015-10-09 | 2019-04-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices |
| GB201815815D0 (en) * | 2018-09-28 | 2018-11-14 | Metryx Ltd | Method and apparatus for controlling the temperature of a semiconductor wafer |
-
2018
- 2018-04-19 GB GBGB1806377.6A patent/GB201806377D0/en not_active Ceased
-
2019
- 2019-04-03 US US17/048,489 patent/US12288702B2/en active Active
- 2019-04-03 WO PCT/EP2019/058388 patent/WO2019201603A1/en not_active Ceased
- 2019-04-03 CN CN201980026826.6A patent/CN112368814B/zh active Active
- 2019-04-03 SG SG11202010143VA patent/SG11202010143VA/en unknown
- 2019-04-03 KR KR1020207033146A patent/KR102547839B1/ko active Active
- 2019-04-03 KR KR1020257042013A patent/KR20260003408A/ko active Pending
- 2019-04-03 KR KR1020237021001A patent/KR102902474B1/ko active Active
- 2019-04-03 JP JP2020555869A patent/JP7335896B2/ja active Active
- 2019-04-03 EP EP19715474.3A patent/EP3782188B1/en active Active
- 2019-04-16 TW TW108113138A patent/TWI822759B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| JP7335896B2 (ja) | 2023-08-30 |
| JP2021521441A (ja) | 2021-08-26 |
| CN112368814A (zh) | 2021-02-12 |
| WO2019201603A1 (en) | 2019-10-24 |
| TWI822759B (zh) | 2023-11-21 |
| KR102902474B1 (ko) | 2025-12-18 |
| KR102547839B1 (ko) | 2023-06-23 |
| KR20260003408A (ko) | 2026-01-06 |
| KR20230098696A (ko) | 2023-07-04 |
| KR20200143480A (ko) | 2020-12-23 |
| EP3782188A1 (en) | 2021-02-24 |
| CN112368814B (zh) | 2025-02-28 |
| EP3782188B1 (en) | 2023-06-21 |
| US20210175102A1 (en) | 2021-06-10 |
| US12288702B2 (en) | 2025-04-29 |
| TW202002125A (zh) | 2020-01-01 |
| GB201806377D0 (en) | 2018-06-06 |
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