SG10201912340PA - Pre-alignment apparatus and method for warped wafer - Google Patents

Pre-alignment apparatus and method for warped wafer

Info

Publication number
SG10201912340PA
SG10201912340PA SG10201912340PA SG10201912340PA SG10201912340PA SG 10201912340P A SG10201912340P A SG 10201912340PA SG 10201912340P A SG10201912340P A SG 10201912340PA SG 10201912340P A SG10201912340P A SG 10201912340PA SG 10201912340P A SG10201912340P A SG 10201912340PA
Authority
SG
Singapore
Prior art keywords
alignment apparatus
warped wafer
warped
wafer
alignment
Prior art date
Application number
SG10201912340PA
Inventor
Gang Wang
Hongyan Fu
Dongliang Huang
Wenshu Chen
Hai Xia
Original Assignee
Shanghai Micro Electronics Equipment Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment Group Co Ltd filed Critical Shanghai Micro Electronics Equipment Group Co Ltd
Publication of SG10201912340PA publication Critical patent/SG10201912340PA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing Optical Record Carriers (AREA)
SG10201912340PA 2018-12-27 2019-12-17 Pre-alignment apparatus and method for warped wafer SG10201912340PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811614342.7A CN111383979B (en) 2018-12-27 2018-12-27 Pre-alignment device and method for warping sheet

Publications (1)

Publication Number Publication Date
SG10201912340PA true SG10201912340PA (en) 2020-07-29

Family

ID=71217988

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201912340PA SG10201912340PA (en) 2018-12-27 2019-12-17 Pre-alignment apparatus and method for warped wafer

Country Status (3)

Country Link
CN (1) CN111383979B (en)
SG (1) SG10201912340PA (en)
TW (1) TWI704637B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113399819B (en) * 2021-07-14 2023-12-29 加宏科技（无锡）股份有限公司 Method for positioning warping product assisted by laser processing

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6612590B2 (en) * 2001-01-12 2003-09-02 Tokyo Electron Limited Apparatus and methods for manipulating semiconductor wafers
CN101733697B (en) * 2009-12-04 2012-01-25 北京有色金属研究总院 Silicon chip polishing method
JPWO2013039080A1 (en) * 2011-09-16 2015-03-26 住友重機械工業株式会社 Board manufacturing equipment
CN103165503B (en) * 2011-12-14 2016-09-28 上海微电子装备有限公司 Warpage sheet frock, using method and handing-over sheet devices thereof
JP2013168461A (en) * 2012-02-15 2013-08-29 Tokyo Electron Ltd Substrate processing apparatus and substrate processing method
JP6122299B2 (en) * 2013-01-15 2017-04-26 キヤノン株式会社 Processing apparatus, processing method, and device manufacturing method
CN104752297B (en) * 2013-12-31 2017-12-29 上海微电子装备（集团）股份有限公司 A kind of TSV silicon wafer pre-alignment devices and its method
CN205789887U (en) * 2016-05-31 2016-12-07 弘塑科技股份有限公司 Substrate flattening equipment
JP6978840B2 (en) * 2017-02-28 2021-12-08 株式会社Ｓｃｒｅｅｎホールディングス Board processing equipment and board holding equipment
CN108803245B (en) * 2017-04-28 2020-04-10 上海微电子装备（集团）股份有限公司 Silicon wafer processing device and method

Also Published As

Publication number Publication date
TW202025350A (en) 2020-07-01
CN111383979A (en) 2020-07-07
TWI704637B (en) 2020-09-11
CN111383979B (en) 2023-03-03

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