SG11202010143VA - Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method - Google Patents
Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology methodInfo
- Publication number
- SG11202010143VA SG11202010143VA SG11202010143VA SG11202010143VA SG11202010143VA SG 11202010143V A SG11202010143V A SG 11202010143VA SG 11202010143V A SG11202010143V A SG 11202010143VA SG 11202010143V A SG11202010143V A SG 11202010143VA SG 11202010143V A SG11202010143V A SG 11202010143VA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor wafer
- mass metrology
- wafer mass
- metrology apparatus
- metrology method
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/72—Investigating presence of flaws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB1806377.6A GB201806377D0 (en) | 2018-04-19 | 2018-04-19 | Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method |
| PCT/EP2019/058388 WO2019201603A1 (en) | 2018-04-19 | 2019-04-03 | Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11202010143VA true SG11202010143VA (en) | 2020-11-27 |
Family
ID=62236133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11202010143VA SG11202010143VA (en) | 2018-04-19 | 2019-04-03 | Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20210175102A1 (en) |
| EP (1) | EP3782188B1 (en) |
| JP (1) | JP7335896B2 (en) |
| KR (2) | KR102547839B1 (en) |
| CN (1) | CN112368814A (en) |
| GB (1) | GB201806377D0 (en) |
| SG (1) | SG11202010143VA (en) |
| TW (1) | TWI822759B (en) |
| WO (1) | WO2019201603A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB201815815D0 (en) * | 2018-09-28 | 2018-11-14 | Metryx Ltd | Method and apparatus for controlling the temperature of a semiconductor wafer |
| CN113496912B (en) * | 2020-04-02 | 2023-10-17 | 长鑫存储技术有限公司 | Monitoring wafer and monitoring system |
| CN113819985A (en) * | 2020-06-18 | 2021-12-21 | 拓荆科技股份有限公司 | Wafer anti-interference weighing device and application thereof |
| CN116417319A (en) * | 2021-12-30 | 2023-07-11 | 中微半导体设备(上海)股份有限公司 | Temperature control device and corresponding plasma processor |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6790376B1 (en) * | 2001-07-23 | 2004-09-14 | Advanced Micro Devices, Inc. | Process control based upon weight or mass measurements, and systems for accomplishing same |
| CN1702849A (en) * | 2004-05-26 | 2005-11-30 | 松下电器产业株式会社 | Temperature abnormality detection method and semiconductor manufacturing apparatus |
| US20060286807A1 (en) | 2005-06-16 | 2006-12-21 | Jack Hwang | Use of active temperature control to provide emmisivity independent wafer temperature |
| US20060004493A1 (en) * | 2004-06-30 | 2006-01-05 | Jack Hwang | Use of active temperature control to provide emmisivity independent wafer temperature |
| KR20060118747A (en) * | 2005-05-17 | 2006-11-24 | 삼성전자주식회사 | Temperature controlling assembly and ion implanter having the same |
| US7935942B2 (en) * | 2006-08-15 | 2011-05-03 | Varian Semiconductor Equipment Associates, Inc. | Technique for low-temperature ion implantation |
| US9111971B2 (en) * | 2012-07-30 | 2015-08-18 | Applied Materials Israel, Ltd. | System and method for temperature control of a semiconductor wafer |
| GB201315715D0 (en) * | 2013-09-04 | 2013-10-16 | Metryx Ltd | Method and device for determining information relating to the mass of a semiconductor wafer |
| GB201321423D0 (en) * | 2013-12-04 | 2014-01-15 | Metryx Ltd | Semiconductor wafer processing methods and apparatus |
| JP2017515148A (en) * | 2014-05-06 | 2017-06-08 | エーエスエムエル ネザーランズ ビー．ブイ． | Substrate support, method for mounting a substrate on a substrate support location, lithographic apparatus, and device manufacturing method |
| US20150332942A1 (en) * | 2014-05-16 | 2015-11-19 | Eng Sheng Peh | Pedestal fluid-based thermal control |
| US10430719B2 (en) * | 2014-11-25 | 2019-10-01 | Stream Mosaic, Inc. | Process control techniques for semiconductor manufacturing processes |
| US10269682B2 (en) * | 2015-10-09 | 2019-04-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices |
| GB201815815D0 (en) * | 2018-09-28 | 2018-11-14 | Metryx Ltd | Method and apparatus for controlling the temperature of a semiconductor wafer |
-
2018
- 2018-04-19 GB GBGB1806377.6A patent/GB201806377D0/en not_active Ceased
-
2019
- 2019-04-03 WO PCT/EP2019/058388 patent/WO2019201603A1/en active Application Filing
- 2019-04-03 KR KR1020207033146A patent/KR102547839B1/en active IP Right Review Request
- 2019-04-03 US US17/048,489 patent/US20210175102A1/en active Pending
- 2019-04-03 KR KR1020237021001A patent/KR20230098696A/en not_active Application Discontinuation
- 2019-04-03 CN CN201980026826.6A patent/CN112368814A/en active Pending
- 2019-04-03 EP EP19715474.3A patent/EP3782188B1/en active Active
- 2019-04-03 SG SG11202010143VA patent/SG11202010143VA/en unknown
- 2019-04-03 JP JP2020555869A patent/JP7335896B2/en active Active
- 2019-04-16 TW TW108113138A patent/TWI822759B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TW202002125A (en) | 2020-01-01 |
| EP3782188B1 (en) | 2023-06-21 |
| KR20200143480A (en) | 2020-12-23 |
| CN112368814A (en) | 2021-02-12 |
| KR20230098696A (en) | 2023-07-04 |
| TWI822759B (en) | 2023-11-21 |
| US20210175102A1 (en) | 2021-06-10 |
| GB201806377D0 (en) | 2018-06-06 |
| EP3782188A1 (en) | 2021-02-24 |
| JP7335896B2 (en) | 2023-08-30 |
| KR102547839B1 (en) | 2023-06-23 |
| JP2021521441A (en) | 2021-08-26 |
| WO2019201603A1 (en) | 2019-10-24 |
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