SG11202102550VA - Method and apparatus for controlling the temperature of a semiconductor wafer - Google Patents
Method and apparatus for controlling the temperature of a semiconductor waferInfo
- Publication number
- SG11202102550VA SG11202102550VA SG11202102550VA SG11202102550VA SG11202102550VA SG 11202102550V A SG11202102550V A SG 11202102550VA SG 11202102550V A SG11202102550V A SG 11202102550VA SG 11202102550V A SG11202102550V A SG 11202102550VA SG 11202102550V A SG11202102550V A SG 11202102550VA
- Authority
- SG
- Singapore
- Prior art keywords
- controlling
- temperature
- semiconductor wafer
- wafer
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01G—WEIGHING
- G01G23/00—Auxiliary devices for weighing apparatus
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01G—WEIGHING
- G01G23/00—Auxiliary devices for weighing apparatus
- G01G23/48—Temperature-compensating arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
- G01J5/0007—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter of wafers or semiconductor substrates, e.g. using Rapid Thermal Processing
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1951—Control of temperature characterised by the use of electric means with control of the working time of a temperature controlling device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Automation & Control Theory (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB1815815.4A GB201815815D0 (en) | 2018-09-28 | 2018-09-28 | Method and apparatus for controlling the temperature of a semiconductor wafer |
| PCT/EP2019/075051 WO2020064470A1 (en) | 2018-09-28 | 2019-09-18 | Method and apparatus for controlling the temperature of a semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11202102550VA true SG11202102550VA (en) | 2021-04-29 |
Family
ID=64109021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11202102550VA SG11202102550VA (en) | 2018-09-28 | 2019-09-18 | Method and apparatus for controlling the temperature of a semiconductor wafer |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20220034708A1 (en) |
| EP (1) | EP3857188B1 (en) |
| JP (1) | JP7512260B2 (en) |
| KR (1) | KR20210065154A (en) |
| CN (1) | CN112771354B (en) |
| GB (1) | GB201815815D0 (en) |
| SG (1) | SG11202102550VA (en) |
| TW (1) | TW202027196A (en) |
| WO (1) | WO2020064470A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB201806377D0 (en) * | 2018-04-19 | 2018-06-06 | Metryx Ltd | Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method |
| US11768484B2 (en) * | 2021-03-31 | 2023-09-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor wafer cooling |
| KR102508464B1 (en) * | 2021-04-01 | 2023-03-09 | 주식회사 코비스테크놀로지 | Mass measurement device |
| TWI815109B (en) * | 2021-04-28 | 2023-09-11 | 華碩電腦股份有限公司 | Heat dissipation validation method and electronic device using the same |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IL110549A (en) * | 1994-08-02 | 1998-02-08 | C I Systems Israel Ltd | Multipoint temperature monitoring apparatus for semiconductor wafers during processing |
| US6133550A (en) * | 1996-03-22 | 2000-10-17 | Sandia Corporation | Method and apparatus for thermal processing of semiconductor substrates |
| US6091062A (en) * | 1998-01-27 | 2000-07-18 | Kinetrix, Inc. | Method and apparatus for temperature control of a semiconductor electrical-test contractor assembly |
| WO2000031777A1 (en) * | 1998-11-20 | 2000-06-02 | Steag Rtp Systems, Inc. | Fast heating and cooling apparatus for semiconductor wafers |
| US6331212B1 (en) * | 2000-04-17 | 2001-12-18 | Avansys, Llc | Methods and apparatus for thermally processing wafers |
| GB0016562D0 (en) | 2000-07-05 | 2000-08-23 | Metryx Limited | Apparatus and method for investigating semiconductor wafers |
| JP2002043381A (en) * | 2000-07-19 | 2002-02-08 | Tokyo Electron Ltd | Water temperature controller |
| EP1362211A4 (en) * | 2001-02-23 | 2005-12-21 | Ultra-low temperature closed-loop recirculating gas chilling system | |
| CN2591770Y (en) * | 2002-09-27 | 2003-12-10 | 东京毅力科创株式会社 | Thermal processing device |
| US7094994B2 (en) * | 2003-03-11 | 2006-08-22 | Sony Corporation | Heat treatment apparatus and method of semiconductor wafer |
| US7543981B2 (en) * | 2006-06-29 | 2009-06-09 | Mattson Technology, Inc. | Methods for determining wafer temperature |
| US8107800B2 (en) * | 2008-01-08 | 2012-01-31 | International Business Machines Corporation | Method and structure to control thermal gradients in semiconductor wafers during rapid thermal processing |
| JP5149741B2 (en) | 2008-08-28 | 2013-02-20 | 吉佳エンジニアリング株式会社 | Existing pipe repair method |
| DE102008049726B4 (en) * | 2008-09-30 | 2012-02-09 | Advanced Micro Devices, Inc. | Stacked chip configuration with current-fed heat transfer system and method for controlling the temperature in a semiconductor device |
| WO2010053173A1 (en) * | 2008-11-10 | 2010-05-14 | 株式会社Kelk | Apparatus and method for controlling temperature of semiconductor wafer |
| US8404572B2 (en) * | 2009-02-13 | 2013-03-26 | Taiwan Semiconductor Manufacturing Co., Ltd | Multi-zone temperature control for semiconductor wafer |
| DE102009010555A1 (en) * | 2009-02-25 | 2010-09-02 | Siltronic Ag | Method for detecting a misalignment of a semiconductor wafer during a thermal treatment |
| US20110295539A1 (en) * | 2010-05-28 | 2011-12-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for measuring intra-die temperature |
| JP2013138180A (en) * | 2011-12-01 | 2013-07-11 | Mitsubishi Electric Corp | Semiconductor wafer heat treatment method, solar cell manufacturing method and heat treatment apparatus |
| DE102012214085B4 (en) * | 2012-08-08 | 2016-07-07 | Siltronic Ag | Single crystal silicon wafer and process for its production |
| GB201321423D0 (en) | 2013-12-04 | 2014-01-15 | Metryx Ltd | Semiconductor wafer processing methods and apparatus |
| GB201405926D0 (en) | 2014-04-02 | 2014-05-14 | Metryx Ltd | Semiconductor wafer weighing apparatus and methods |
| JP6587818B2 (en) * | 2015-03-26 | 2019-10-09 | 株式会社Ｓｃｒｅｅｎホールディングス | Heat treatment method |
| DE102016202239B3 (en) * | 2016-02-15 | 2017-07-20 | Globalfoundries Inc. | Fast heating process in the manufacture of semiconductor devices |
| GB201806377D0 (en) * | 2018-04-19 | 2018-06-06 | Metryx Ltd | Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method |
-
2018
- 2018-09-28 GB GBGB1815815.4A patent/GB201815815D0/en not_active Ceased
-
2019
- 2019-09-18 EP EP19770077.6A patent/EP3857188B1/en active Active
- 2019-09-18 CN CN201980063482.6A patent/CN112771354B/en active Active
- 2019-09-18 JP JP2021515485A patent/JP7512260B2/en active Active
- 2019-09-18 KR KR1020217012233A patent/KR20210065154A/en not_active Application Discontinuation
- 2019-09-18 SG SG11202102550VA patent/SG11202102550VA/en unknown
- 2019-09-18 US US17/278,736 patent/US20220034708A1/en active Pending
- 2019-09-18 WO PCT/EP2019/075051 patent/WO2020064470A1/en unknown
- 2019-09-24 TW TW108134344A patent/TW202027196A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP7512260B2 (en) | 2024-07-08 |
| US20220034708A1 (en) | 2022-02-03 |
| KR20210065154A (en) | 2021-06-03 |
| TW202027196A (en) | 2020-07-16 |
| EP3857188A1 (en) | 2021-08-04 |
| CN112771354A (en) | 2021-05-07 |
| EP3857188B1 (en) | 2024-02-21 |
| JP2022501823A (en) | 2022-01-06 |
| WO2020064470A1 (en) | 2020-04-02 |
| CN112771354B (en) | 2024-07-23 |
| GB201815815D0 (en) | 2018-11-14 |
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