GB201806377D0 - Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method - Google Patents

Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method

Info

Publication number
GB201806377D0
GB201806377D0 GBGB1806377.6A GB201806377A GB201806377D0 GB 201806377 D0 GB201806377 D0 GB 201806377D0 GB 201806377 A GB201806377 A GB 201806377A GB 201806377 D0 GB201806377 D0 GB 201806377D0
Authority
GB
United Kingdom
Prior art keywords
semiconductor wafer
mass metrology
wafer mass
metrology apparatus
metrology method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB1806377.6A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Metryx Ltd
Original Assignee
Metryx Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metryx Ltd filed Critical Metryx Ltd
Priority to GBGB1806377.6A priority Critical patent/GB201806377D0/en
Publication of GB201806377D0 publication Critical patent/GB201806377D0/en
Priority to KR1020207033146A priority patent/KR102547839B1/ko
Priority to CN201980026826.6A priority patent/CN112368814B/zh
Priority to EP19715474.3A priority patent/EP3782188B1/en
Priority to PCT/EP2019/058388 priority patent/WO2019201603A1/en
Priority to US17/048,489 priority patent/US12288702B2/en
Priority to JP2020555869A priority patent/JP7335896B2/ja
Priority to KR1020237021001A priority patent/KR102902474B1/ko
Priority to SG11202010143VA priority patent/SG11202010143VA/en
Priority to KR1020257042013A priority patent/KR20260003408A/ko
Priority to TW108113138A priority patent/TWI822759B/zh
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
GBGB1806377.6A 2018-04-19 2018-04-19 Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method Ceased GB201806377D0 (en)

Priority Applications (11)

Application Number Priority Date Filing Date Title
GBGB1806377.6A GB201806377D0 (en) 2018-04-19 2018-04-19 Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method
KR1020257042013A KR20260003408A (ko) 2018-04-19 2019-04-03 반도체 웨이퍼 질량 계측 장치 및 반도체 웨이퍼 질량 계측 방법
PCT/EP2019/058388 WO2019201603A1 (en) 2018-04-19 2019-04-03 Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method
CN201980026826.6A CN112368814B (zh) 2018-04-19 2019-04-03 半导体晶片质量计量装置和半导体晶片质量计量方法
EP19715474.3A EP3782188B1 (en) 2018-04-19 2019-04-03 Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method
KR1020207033146A KR102547839B1 (ko) 2018-04-19 2019-04-03 반도체 웨이퍼 질량 계측 장치 및 반도체 웨이퍼 질량 계측 방법
US17/048,489 US12288702B2 (en) 2018-04-19 2019-04-03 Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method
JP2020555869A JP7335896B2 (ja) 2018-04-19 2019-04-03 半導体ウエハ質量計測装置および半導体ウエハ質量計測方法
KR1020237021001A KR102902474B1 (ko) 2018-04-19 2019-04-03 반도체 웨이퍼 질량 계측 장치 및 반도체 웨이퍼 질량 계측 방법
SG11202010143VA SG11202010143VA (en) 2018-04-19 2019-04-03 Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method
TW108113138A TWI822759B (zh) 2018-04-19 2019-04-16 半導體晶圓質量計量裝置及半導體晶圓質量計量方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB1806377.6A GB201806377D0 (en) 2018-04-19 2018-04-19 Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method

Publications (1)

Publication Number Publication Date
GB201806377D0 true GB201806377D0 (en) 2018-06-06

Family

ID=62236133

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB1806377.6A Ceased GB201806377D0 (en) 2018-04-19 2018-04-19 Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method

Country Status (9)

Country Link
US (1) US12288702B2 (https=)
EP (1) EP3782188B1 (https=)
JP (1) JP7335896B2 (https=)
KR (3) KR102547839B1 (https=)
CN (1) CN112368814B (https=)
GB (1) GB201806377D0 (https=)
SG (1) SG11202010143VA (https=)
TW (1) TWI822759B (https=)
WO (1) WO2019201603A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201815815D0 (en) * 2018-09-28 2018-11-14 Metryx Ltd Method and apparatus for controlling the temperature of a semiconductor wafer
CN113496912B (zh) * 2020-04-02 2023-10-17 长鑫存储技术有限公司 监测晶圆及监测系统
CN113819985A (zh) * 2020-06-18 2021-12-21 拓荆科技股份有限公司 晶圆防干扰称重装置及其应用
CN116417319A (zh) * 2021-12-30 2023-07-11 中微半导体设备(上海)股份有限公司 一种控温装置及相应的等离子体处理器
KR102706137B1 (ko) * 2022-06-14 2024-09-13 주식회사 코비스테크놀로지 병렬구조의 질량측정장치를 이용한 질량측정방법
GB202414501D0 (en) * 2024-10-02 2024-11-13 Metryx Ltd Method and apparatus for controlling the temperature of a wafer

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6072163A (en) * 1998-03-05 2000-06-06 Fsi International Inc. Combination bake/chill apparatus incorporating low thermal mass, thermally conductive bakeplate
KR100342754B1 (ko) 1999-11-10 2002-07-04 황인길 무게 측정을 통한 반도체 웨이퍼의 정렬 시스템
GB0016562D0 (en) 2000-07-05 2000-08-23 Metryx Limited Apparatus and method for investigating semiconductor wafers
US6790376B1 (en) * 2001-07-23 2004-09-14 Advanced Micro Devices, Inc. Process control based upon weight or mass measurements, and systems for accomplishing same
CN1702849A (zh) * 2004-05-26 2005-11-30 松下电器产业株式会社 温度异常检测方法及半导体制造装置
US20060004493A1 (en) * 2004-06-30 2006-01-05 Jack Hwang Use of active temperature control to provide emmisivity independent wafer temperature
US20060286807A1 (en) * 2005-06-16 2006-12-21 Jack Hwang Use of active temperature control to provide emmisivity independent wafer temperature
KR20060118747A (ko) * 2005-05-17 2006-11-24 삼성전자주식회사 온도 조절 어셈블리 및 이를 갖는 이온 주입 장치
US7534627B2 (en) * 2006-08-07 2009-05-19 Sokudo Co., Ltd. Methods and systems for controlling critical dimensions in track lithography tools
US7935942B2 (en) * 2006-08-15 2011-05-03 Varian Semiconductor Equipment Associates, Inc. Technique for low-temperature ion implantation
GB0719469D0 (en) 2007-10-04 2007-11-14 Metryx Ltd Measurement apparatus and method
GB0719460D0 (en) 2007-10-04 2007-11-14 Metryx Ltd Measurement apparatus and method
DE102008041250A1 (de) 2008-08-13 2010-02-25 Ers Electronic Gmbh Verfahren und Vorrichtung zum thermischen Bearbeiten von Kunststoffscheiben, insbesondere Moldwafern
US9111971B2 (en) * 2012-07-30 2015-08-18 Applied Materials Israel, Ltd. System and method for temperature control of a semiconductor wafer
GB201315715D0 (en) * 2013-09-04 2013-10-16 Metryx Ltd Method and device for determining information relating to the mass of a semiconductor wafer
GB201321423D0 (en) * 2013-12-04 2014-01-15 Metryx Ltd Semiconductor wafer processing methods and apparatus
WO2015169616A1 (en) * 2014-05-06 2015-11-12 Asml Netherlands B.V. Substrate support, method for loading a substrate on a substrate support location, lithographic apparatus and device manufacturing method
US20150332942A1 (en) 2014-05-16 2015-11-19 Eng Sheng Peh Pedestal fluid-based thermal control
US10430719B2 (en) * 2014-11-25 2019-10-01 Stream Mosaic, Inc. Process control techniques for semiconductor manufacturing processes
US10269682B2 (en) 2015-10-09 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices
GB201815815D0 (en) * 2018-09-28 2018-11-14 Metryx Ltd Method and apparatus for controlling the temperature of a semiconductor wafer

Also Published As

Publication number Publication date
JP7335896B2 (ja) 2023-08-30
JP2021521441A (ja) 2021-08-26
CN112368814A (zh) 2021-02-12
WO2019201603A1 (en) 2019-10-24
TWI822759B (zh) 2023-11-21
KR102902474B1 (ko) 2025-12-18
KR102547839B1 (ko) 2023-06-23
KR20260003408A (ko) 2026-01-06
KR20230098696A (ko) 2023-07-04
KR20200143480A (ko) 2020-12-23
EP3782188A1 (en) 2021-02-24
CN112368814B (zh) 2025-02-28
EP3782188B1 (en) 2023-06-21
US20210175102A1 (en) 2021-06-10
US12288702B2 (en) 2025-04-29
SG11202010143VA (en) 2020-11-27
TW202002125A (zh) 2020-01-01

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Legal Events

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AT Applications terminated before publication under section 16(1)