JP2004530288A5 - - Google Patents

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Publication number
JP2004530288A5
JP2004530288A5 JP2002566524A JP2002566524A JP2004530288A5 JP 2004530288 A5 JP2004530288 A5 JP 2004530288A5 JP 2002566524 A JP2002566524 A JP 2002566524A JP 2002566524 A JP2002566524 A JP 2002566524A JP 2004530288 A5 JP2004530288 A5 JP 2004530288A5
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JP
Japan
Prior art keywords
film
sio
component
complex
platinum
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JP2002566524A
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English (en)
Japanese (ja)
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JP2004530288A (ja
JP4226905B2 (ja
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Priority claimed from US09/789,083 external-priority patent/US6617674B2/en
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Publication of JP2004530288A publication Critical patent/JP2004530288A/ja
Publication of JP2004530288A5 publication Critical patent/JP2004530288A5/ja
Application granted granted Critical
Publication of JP4226905B2 publication Critical patent/JP4226905B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2002566524A 2001-02-20 2002-01-17 半導体パッケージおよびその調製方法 Expired - Lifetime JP4226905B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/789,083 US6617674B2 (en) 2001-02-20 2001-02-20 Semiconductor package and method of preparing same
PCT/US2002/001263 WO2002067292A2 (en) 2001-02-20 2002-01-17 Semiconductor package and method of preparing same

Publications (3)

Publication Number Publication Date
JP2004530288A JP2004530288A (ja) 2004-09-30
JP2004530288A5 true JP2004530288A5 (enExample) 2008-06-05
JP4226905B2 JP4226905B2 (ja) 2009-02-18

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JP2002566524A Expired - Lifetime JP4226905B2 (ja) 2001-02-20 2002-01-17 半導体パッケージおよびその調製方法

Country Status (11)

Country Link
US (1) US6617674B2 (enExample)
EP (1) EP1362364B1 (enExample)
JP (1) JP4226905B2 (enExample)
KR (1) KR100813821B1 (enExample)
CN (3) CN1514954A (enExample)
AT (1) ATE494629T1 (enExample)
AU (1) AU2002248357A1 (enExample)
CA (1) CA2438126A1 (enExample)
DE (1) DE60238823D1 (enExample)
TW (1) TW563210B (enExample)
WO (2) WO2002067292A2 (enExample)

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JP2018507290A (ja) * 2015-02-03 2018-03-15 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 硬化性シリコーン配合物及び関連する硬化生成物、方法、物品、並びにデバイス
TWI678551B (zh) 2015-07-28 2019-12-01 美商道康寧公司 智慧型光學材料、配方、方法、用途、物品、及裝置

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