JP2005526398A5 - - Google Patents

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Publication number
JP2005526398A5
JP2005526398A5 JP2004506078A JP2004506078A JP2005526398A5 JP 2005526398 A5 JP2005526398 A5 JP 2005526398A5 JP 2004506078 A JP2004506078 A JP 2004506078A JP 2004506078 A JP2004506078 A JP 2004506078A JP 2005526398 A5 JP2005526398 A5 JP 2005526398A5
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JP
Japan
Prior art keywords
silicone
cured silicone
sio
component
deposit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004506078A
Other languages
English (en)
Japanese (ja)
Other versions
JP4773089B2 (ja
JP2005526398A (ja
Filing date
Publication date
Priority claimed from US10/068,755 external-priority patent/US6940177B2/en
Application filed filed Critical
Publication of JP2005526398A publication Critical patent/JP2005526398A/ja
Publication of JP2005526398A5 publication Critical patent/JP2005526398A5/ja
Application granted granted Critical
Publication of JP4773089B2 publication Critical patent/JP4773089B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004506078A 2002-05-16 2003-03-19 半導体パッケージおよびその製造方法 Expired - Fee Related JP4773089B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/068,755 US6940177B2 (en) 2002-05-16 2002-05-16 Semiconductor package and method of preparing same
US10/068,755 2002-05-16
PCT/US2003/008345 WO2003098682A1 (en) 2002-05-16 2003-03-19 Semiconductor package and method of preparing same

Publications (3)

Publication Number Publication Date
JP2005526398A JP2005526398A (ja) 2005-09-02
JP2005526398A5 true JP2005526398A5 (enExample) 2006-03-09
JP4773089B2 JP4773089B2 (ja) 2011-09-14

Family

ID=29418266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004506078A Expired - Fee Related JP4773089B2 (ja) 2002-05-16 2003-03-19 半導体パッケージおよびその製造方法

Country Status (9)

Country Link
US (1) US6940177B2 (enExample)
EP (1) EP1504469B1 (enExample)
JP (1) JP4773089B2 (enExample)
CN (1) CN1328770C (enExample)
AT (1) ATE347737T1 (enExample)
AU (1) AU2003230678A1 (enExample)
DE (1) DE60310222T2 (enExample)
TW (1) TWI265578B (enExample)
WO (1) WO2003098682A1 (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
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US6870272B2 (en) * 1994-09-20 2005-03-22 Tessera, Inc. Methods of making microelectronic assemblies including compliant interfaces
US6211572B1 (en) 1995-10-31 2001-04-03 Tessera, Inc. Semiconductor chip package with fan-in leads
US6284563B1 (en) 1995-10-31 2001-09-04 Tessera, Inc. Method of making compliant microelectronic assemblies
US20040102022A1 (en) * 2002-11-22 2004-05-27 Tongbi Jiang Methods of fabricating integrated circuitry
JP4193052B2 (ja) * 2003-08-25 2008-12-10 信越化学工業株式会社 高熱伝導性シリコーンゴム組成物並びに定着ロール及び定着ベルト
CN100481415C (zh) * 2004-03-12 2009-04-22 联华电子股份有限公司 芯片封装体及其制造方法
US7190157B2 (en) * 2004-10-25 2007-03-13 Agilent Technologies, Inc. Method and apparatus for layout independent test point placement on a printed circuit board
JP4741230B2 (ja) * 2004-12-28 2011-08-03 東レ・ダウコーニング株式会社 フィルム状シリコーンゴム接着剤
CN101128931B (zh) 2005-02-25 2010-05-19 德塞拉股份有限公司 具有顺应性的微电子组件
US7695819B2 (en) * 2005-09-30 2010-04-13 Wacker Chemical Corporation Two piece curable HCR silicone elastomers
JP4993555B2 (ja) * 2005-12-07 2012-08-08 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 付加反応硬化型シリコーン組成物
TWI296037B (en) * 2006-04-28 2008-04-21 Delta Electronics Inc Light emitting apparatus
GB2444775B (en) * 2006-12-13 2011-06-08 Cambridge Silicon Radio Ltd Chip mounting
US7749886B2 (en) * 2006-12-20 2010-07-06 Tessera, Inc. Microelectronic assemblies having compliancy and methods therefor
CN100580914C (zh) * 2007-02-16 2010-01-13 南茂科技股份有限公司 封装导电结构及其形成方法
US20080308932A1 (en) * 2007-06-12 2008-12-18 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package structures
US7772691B2 (en) * 2007-10-12 2010-08-10 Taiwan Semiconductor Manufacturing Company, Ltd. Thermally enhanced wafer level package
US20110046242A1 (en) * 2008-01-17 2011-02-24 Jean-Luc Garaud Film Forming, Silicone Containing Compositions
CN102449073B (zh) 2009-07-03 2013-11-13 道康宁公司 成膜的含硅酮组合物
US8421226B2 (en) * 2010-02-25 2013-04-16 Infineon Technologies Ag Device including an encapsulated semiconductor chip and manufacturing method thereof
JP5384443B2 (ja) * 2010-07-28 2014-01-08 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、半導体装置の製造方法、及び、フリップチップ型半導体装置
JP6300218B2 (ja) 2010-12-31 2018-03-28 サムスン エスディアイ カンパニー, リミテッドSamsung Sdi Co., Ltd. 封止材用透光性樹脂組成物、該透光性樹脂を含む封止材および電子素子
TWI575684B (zh) * 2011-06-13 2017-03-21 矽品精密工業股份有限公司 晶片尺寸封裝件
JP2013095809A (ja) * 2011-10-31 2013-05-20 Nitto Denko Corp シリコーン樹脂組成物、シリコーン樹脂シート、光半導体素子装置、および、シリコーン樹脂シートの製造方法。
JP5563695B2 (ja) * 2013-04-17 2014-07-30 株式会社カネカ 半導体のパッケージ用硬化性樹脂組成物および半導体
TW201601358A (zh) * 2014-06-19 2016-01-01 道康寧公司 用於晶圓級ｚ軸熱中介層的可光圖案化聚矽氧
EP3306674B1 (en) * 2015-05-27 2021-06-23 Kyocera Corporation Solar cell element and method for manufacturing same
US9812414B1 (en) 2016-06-17 2017-11-07 Nanya Technology Corporation Chip package and a manufacturing method thereof
WO2018121706A1 (en) 2016-12-30 2018-07-05 Elkem Silicones Shanghai Co., Ltd. Curable silicone compositions
CN108165014A (zh) * 2017-12-23 2018-06-15 苏州赛源微电子有限公司 一种集成电路芯片的封装方法

Family Cites Families (12)

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US5171716A (en) 1986-12-19 1992-12-15 North American Philips Corp. Method of manufacturing semiconductor device with reduced packaging stress
US5907190A (en) * 1994-11-24 1999-05-25 Dow Corning Toray Silicone Co., Ltd. Semiconductor device having a cured silicone coating with non uniformly dispersed filler
US6284563B1 (en) * 1995-10-31 2001-09-04 Tessera, Inc. Method of making compliant microelectronic assemblies
JPH09286971A (ja) * 1996-04-19 1997-11-04 Toray Dow Corning Silicone Co Ltd シリコーン系ダイボンディング剤、半導体装置の製造方法および半導体装置
CN1244038A (zh) * 1998-08-04 2000-02-09 长兴化学工业股份有限公司 半导体封装用树脂组合物
US6103552A (en) 1998-08-10 2000-08-15 Lin; Mou-Shiung Wafer scale packaging scheme
KR20010101419A (ko) * 1999-01-07 2001-11-14 크리스 로저 에이취. 유기히드리도실록산 수지로부터 생성된 유전막
US6239378B1 (en) * 1999-02-02 2001-05-29 Dow Corning Corporation Flame resistant silicone rubber wire and cable coating composition
US6197613B1 (en) 1999-03-23 2001-03-06 Industrial Technology Research Institute Wafer level packaging method and devices formed
US6369185B1 (en) * 1999-03-31 2002-04-09 Dow Corning Toray Silicone Co., Ltd. Curable organopolysiloxane composition, cured products formed therefrom and unified articles
US6277669B1 (en) 1999-09-15 2001-08-21 Industrial Technology Research Institute Wafer level packaging method and packages formed
US7271219B2 (en) * 2001-01-25 2007-09-18 Sanyo Chemical Industries, Ltd. Curable resin, curable resin material, curable film, and insulator

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