CN1328770C - 半导体封装件及其制备方法 - Google Patents

半导体封装件及其制备方法 Download PDF

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Publication number
CN1328770C
CN1328770C CNB038155664A CN03815566A CN1328770C CN 1328770 C CN1328770 C CN 1328770C CN B038155664 A CNB038155664 A CN B038155664A CN 03815566 A CN03815566 A CN 03815566A CN 1328770 C CN1328770 C CN 1328770C
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China
Prior art keywords
silicone
semiconductor package
sio
component
cured silicone
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Expired - Fee Related
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CNB038155664A
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English (en)
Chinese (zh)
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CN1666326A (zh
Inventor
S·丹特
L·拉尔森
R·尼尔森
D·索里兹
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Dow Silicones Corp
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Dow Corning Corp
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    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
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    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CNB038155664A 2002-05-16 2003-03-19 半导体封装件及其制备方法 Expired - Fee Related CN1328770C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/068,755 2002-05-16
US10/068,755 US6940177B2 (en) 2002-05-16 2002-05-16 Semiconductor package and method of preparing same

Publications (2)

Publication Number Publication Date
CN1666326A CN1666326A (zh) 2005-09-07
CN1328770C true CN1328770C (zh) 2007-07-25

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US (1) US6940177B2 (enExample)
EP (1) EP1504469B1 (enExample)
JP (1) JP4773089B2 (enExample)
CN (1) CN1328770C (enExample)
AT (1) ATE347737T1 (enExample)
AU (1) AU2003230678A1 (enExample)
DE (1) DE60310222T2 (enExample)
TW (1) TWI265578B (enExample)
WO (1) WO2003098682A1 (enExample)

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