DE60310222T2 - Halbleiterkapselung und verfahren zu ihrer herstellung - Google Patents

Halbleiterkapselung und verfahren zu ihrer herstellung Download PDF

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Publication number
DE60310222T2
DE60310222T2 DE60310222T DE60310222T DE60310222T2 DE 60310222 T2 DE60310222 T2 DE 60310222T2 DE 60310222 T DE60310222 T DE 60310222T DE 60310222 T DE60310222 T DE 60310222T DE 60310222 T2 DE60310222 T2 DE 60310222T2
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DE
Germany
Prior art keywords
silicone
semiconductor package
sio
silicon
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60310222T
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German (de)
English (en)
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DE60310222D1 (de
Inventor
Stanton Midland DENT
Lyndon Auburn Larson
Robert Bay City NELSON
Debra Midland SOLIZ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
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Dow Corning Corp
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Publication of DE60310222D1 publication Critical patent/DE60310222D1/de
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Publication of DE60310222T2 publication Critical patent/DE60310222T2/de
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Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
DE60310222T 2002-05-16 2003-03-19 Halbleiterkapselung und verfahren zu ihrer herstellung Expired - Lifetime DE60310222T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/068,755 US6940177B2 (en) 2002-05-16 2002-05-16 Semiconductor package and method of preparing same
US68755 2002-05-16
PCT/US2003/008345 WO2003098682A1 (en) 2002-05-16 2003-03-19 Semiconductor package and method of preparing same

Publications (2)

Publication Number Publication Date
DE60310222D1 DE60310222D1 (de) 2007-01-18
DE60310222T2 true DE60310222T2 (de) 2007-09-13

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Application Number Title Priority Date Filing Date
DE60310222T Expired - Lifetime DE60310222T2 (de) 2002-05-16 2003-03-19 Halbleiterkapselung und verfahren zu ihrer herstellung

Country Status (9)

Country Link
US (1) US6940177B2 (enExample)
EP (1) EP1504469B1 (enExample)
JP (1) JP4773089B2 (enExample)
CN (1) CN1328770C (enExample)
AT (1) ATE347737T1 (enExample)
AU (1) AU2003230678A1 (enExample)
DE (1) DE60310222T2 (enExample)
TW (1) TWI265578B (enExample)
WO (1) WO2003098682A1 (enExample)

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CN100481415C (zh) * 2004-03-12 2009-04-22 联华电子股份有限公司 芯片封装体及其制造方法
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CN101128931B (zh) 2005-02-25 2010-05-19 德塞拉股份有限公司 具有顺应性的微电子组件
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JP4993555B2 (ja) * 2005-12-07 2012-08-08 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 付加反応硬化型シリコーン組成物
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US20080308932A1 (en) * 2007-06-12 2008-12-18 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package structures
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WO2003098682A1 (en) 2003-11-27
EP1504469B1 (en) 2006-12-06
ATE347737T1 (de) 2006-12-15
JP4773089B2 (ja) 2011-09-14
TWI265578B (en) 2006-11-01
US20030214051A1 (en) 2003-11-20
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TW200308030A (en) 2003-12-16
US6940177B2 (en) 2005-09-06

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