DE60001434T2 - Klebstoff und Halbleiterbauelemente - Google Patents
Klebstoff und HalbleiterbauelementeInfo
- Publication number
- DE60001434T2 DE60001434T2 DE60001434T DE60001434T DE60001434T2 DE 60001434 T2 DE60001434 T2 DE 60001434T2 DE 60001434 T DE60001434 T DE 60001434T DE 60001434 T DE60001434 T DE 60001434T DE 60001434 T2 DE60001434 T2 DE 60001434T2
- Authority
- DE
- Germany
- Prior art keywords
- adhesive
- semiconductor devices
- semiconductor
- devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 title 1
- 230000001070 adhesive effect Effects 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/54—Inorganic substances
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
- H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/83009—Pre-treatment of the layer connector or the bonding area
- H01L2224/83051—Forming additional members, e.g. dam structures
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- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
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- H01L2924/013—Alloys
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- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
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- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11193829A JP2001019928A (ja) | 1999-07-08 | 1999-07-08 | 接着剤、および半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60001434D1 DE60001434D1 (de) | 2003-03-27 |
DE60001434T2 true DE60001434T2 (de) | 2003-11-20 |
Family
ID=16314444
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60001434T Expired - Lifetime DE60001434T2 (de) | 1999-07-08 | 2000-06-21 | Klebstoff und Halbleiterbauelemente |
Country Status (6)
Country | Link |
---|---|
US (1) | US6750550B1 (de) |
EP (1) | EP1067163B1 (de) |
JP (1) | JP2001019928A (de) |
KR (1) | KR100637611B1 (de) |
DE (1) | DE60001434T2 (de) |
TW (1) | TWI225886B (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001139894A (ja) * | 1999-11-15 | 2001-05-22 | Dow Corning Toray Silicone Co Ltd | シリコーン系接着性シート、および半導体装置 |
JP4037619B2 (ja) * | 2001-04-27 | 2008-01-23 | ソニーケミカル&インフォメーションデバイス株式会社 | 接着剤及び電気装置 |
US6784555B2 (en) | 2001-09-17 | 2004-08-31 | Dow Corning Corporation | Die attach adhesives for semiconductor applications utilizing a polymeric base material with inorganic insulator particles of various sizes |
US7074481B2 (en) * | 2001-09-17 | 2006-07-11 | Dow Corning Corporation | Adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes |
JP2005026363A (ja) * | 2003-06-30 | 2005-01-27 | Toshiba Corp | 半導体装置とその製造方法 |
US7118940B1 (en) * | 2005-08-05 | 2006-10-10 | Delphi Technologies, Inc. | Method of fabricating an electronic package having underfill standoff |
JP2007288003A (ja) * | 2006-04-18 | 2007-11-01 | Sharp Corp | 半導体装置 |
JP4213767B2 (ja) | 2007-01-12 | 2009-01-21 | 積水化学工業株式会社 | 電子部品用接着剤 |
JP2010018675A (ja) * | 2008-07-09 | 2010-01-28 | Mitsuboshi Belting Ltd | 厚膜形成用ペースト |
JP2012074512A (ja) * | 2010-09-28 | 2012-04-12 | Sekisui Chem Co Ltd | 光半導体装置用ダイボンド材及びそれを用いた光半導体装置 |
CN104968747B (zh) * | 2013-01-29 | 2017-03-08 | 株式会社Kcc | 用于粘附半导体芯片的硅橡胶组合物 |
WO2014141596A1 (ja) * | 2013-03-11 | 2014-09-18 | パナソニック株式会社 | 破片飛散抑制塗料 |
KR101854501B1 (ko) * | 2015-04-29 | 2018-05-04 | 삼성에스디아이 주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자 |
KR102164171B1 (ko) * | 2019-04-26 | 2020-10-13 | (주)엘프스 | 미니 led 칩 본딩용 자가융착형 도전접속 페이스트, 이를 포함하는 미니 led 칩-회로기판 본딩 모듈 및 이의 제조방법 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60189229A (ja) * | 1984-03-09 | 1985-09-26 | Toshiba Chem Corp | 半導体素子 |
JPH0791475B2 (ja) * | 1988-02-29 | 1995-10-04 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性樹脂組成物 |
JP2882823B2 (ja) | 1989-11-15 | 1999-04-12 | 東レ・ダウコーニング・シリコーン株式会社 | 接着剤 |
JPH04152642A (ja) * | 1990-10-17 | 1992-05-26 | Fujitsu Ltd | 接着用ペースト |
JP2605970B2 (ja) | 1993-06-21 | 1997-04-30 | 日本電気株式会社 | 半導体チップ用ダイボンディング樹脂及びそれを用いた半導体装置。 |
JP2983816B2 (ja) * | 1993-10-29 | 1999-11-29 | 住友ベークライト株式会社 | 導電性樹脂ペースト |
JPH07221125A (ja) * | 1994-01-27 | 1995-08-18 | Toyota Autom Loom Works Ltd | 半導体部品の実装構造及び絶縁性接着剤 |
JP3519779B2 (ja) * | 1994-04-27 | 2004-04-19 | 東レ・ダウコーニング・シリコーン株式会社 | 接着剤および半導体装置 |
EP0699717A3 (de) * | 1994-08-30 | 1997-01-02 | Dow Corning | Aus Polysiloxanzusammensetzungen gehärtete Produkte mit guter Adhäsion und reduzierter Enflammbarkeit |
US6201055B1 (en) * | 1999-03-11 | 2001-03-13 | Dow Corning Corporation | Silicone composition and silicone pressure sensitive adhesive |
-
1999
- 1999-07-08 JP JP11193829A patent/JP2001019928A/ja active Pending
-
2000
- 2000-06-20 US US09/597,218 patent/US6750550B1/en not_active Expired - Fee Related
- 2000-06-21 EP EP00305237A patent/EP1067163B1/de not_active Expired - Lifetime
- 2000-06-21 DE DE60001434T patent/DE60001434T2/de not_active Expired - Lifetime
- 2000-07-07 KR KR1020000038822A patent/KR100637611B1/ko not_active IP Right Cessation
- 2000-09-19 TW TW089113524A patent/TWI225886B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE60001434D1 (de) | 2003-03-27 |
EP1067163A1 (de) | 2001-01-10 |
US6750550B1 (en) | 2004-06-15 |
JP2001019928A (ja) | 2001-01-23 |
EP1067163B1 (de) | 2003-02-19 |
KR100637611B1 (ko) | 2006-10-24 |
TWI225886B (en) | 2005-01-01 |
KR20010049733A (ko) | 2001-06-15 |
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