JP2003174120A5 - - Google Patents

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Publication number
JP2003174120A5
JP2003174120A5 JP2002103684A JP2002103684A JP2003174120A5 JP 2003174120 A5 JP2003174120 A5 JP 2003174120A5 JP 2002103684 A JP2002103684 A JP 2002103684A JP 2002103684 A JP2002103684 A JP 2002103684A JP 2003174120 A5 JP2003174120 A5 JP 2003174120A5
Authority
JP
Japan
Prior art keywords
terminal
metal wiring
connection terminal
upper terminal
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002103684A
Other languages
English (en)
Other versions
JP2003174120A (ja
JP4014912B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2002103684A external-priority patent/JP4014912B2/ja
Priority to JP2002103684A priority Critical patent/JP4014912B2/ja
Priority to US10/252,504 priority patent/US20030062631A1/en
Priority to TW91137702A priority patent/TW571416B/zh
Priority to DE10300951A priority patent/DE10300951A1/de
Priority to KR10-2003-0004529A priority patent/KR20030080187A/ko
Publication of JP2003174120A publication Critical patent/JP2003174120A/ja
Priority to US11/150,296 priority patent/US7148576B2/en
Publication of JP2003174120A5 publication Critical patent/JP2003174120A5/ja
Publication of JP4014912B2 publication Critical patent/JP4014912B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Claims (4)

  1. 電極を一主面に備える半導体チップと、
    接続端子と、
    上部端子と、
    前記接続端子および上部端子を、対応する前記半導体チップの前記電極と接続する金属配線と、
    上面および底面を有し、前記金属配線および前記半導体チップの前記一主面を覆う封止樹脂とを備え、
    前記接続端子は、前記封止樹脂の底面から露出しており、
    前記上部端子は、前記封止樹脂の上面から露出しており、
    前記接続端子、上部端子、および金属配線が同じ材料から形成されている、半導体装置。
  2. 前記上部端子は、対応する前記接続端子の上に接続されている、請求項１記載の半導体装置。
  3. 前記上部端子は、対応する前記金属配線の上に接続されている、請求項１記載の半導体装置。
  4. 前記接続端子、前記上部端子、および前記金属配線は、ボンディングワイヤによって形成されている、請求項１〜３のいずれか１項に記載の半導体装置。
JP2002103684A 2001-09-28 2002-04-05 半導体装置 Expired - Fee Related JP4014912B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2002103684A JP4014912B2 (ja) 2001-09-28 2002-04-05 半導体装置
US10/252,504 US20030062631A1 (en) 2001-09-28 2002-09-24 Semiconductor device and method of fabricating the same
TW91137702A TW571416B (en) 2001-09-28 2002-12-27 Semiconductor device and method of fabricating the same
DE10300951A DE10300951A1 (de) 2002-04-05 2003-01-13 Halbleitervorrichtung und Verfahren zur Herstellung derselben
KR10-2003-0004529A KR20030080187A (ko) 2002-04-05 2003-01-23 반도체장치
US11/150,296 US7148576B2 (en) 2001-09-28 2005-06-13 Semiconductor device and method of fabricating the same

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001299756 2001-09-28
JP2001-299756 2001-09-28
JP2002103684A JP4014912B2 (ja) 2001-09-28 2002-04-05 半導体装置

Publications (3)

Publication Number Publication Date
JP2003174120A JP2003174120A (ja) 2003-06-20
JP2003174120A5 true JP2003174120A5 (ja) 2005-09-15
JP4014912B2 JP4014912B2 (ja) 2007-11-28

Family

ID=26623238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002103684A Expired - Fee Related JP4014912B2 (ja) 2001-09-28 2002-04-05 半導体装置

Country Status (3)

Country Link
US (2) US20030062631A1 (ja)
JP (1) JP4014912B2 (ja)
TW (1) TW571416B (ja)

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US20070216033A1 (en) * 2006-03-20 2007-09-20 Corisis David J Carrierless chip package for integrated circuit devices, and methods of making same
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US20090154111A1 (en) * 2007-12-17 2009-06-18 Lynch Thomas W Reticulated heat dissipation
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JP5343359B2 (ja) * 2008-01-09 2013-11-13 富士通セミコンダクター株式会社 半導体装置の製造方法
US8138024B2 (en) * 2008-02-26 2012-03-20 Stats Chippac Ltd. Package system for shielding semiconductor dies from electromagnetic interference
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JP2010141066A (ja) * 2008-12-11 2010-06-24 Rohm Co Ltd 半導体装置
JP5112275B2 (ja) * 2008-12-16 2013-01-09 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
JP5588150B2 (ja) * 2009-02-06 2014-09-10 セイコーインスツル株式会社 樹脂封止型半導体装置
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