JP5588150B2 - 樹脂封止型半導体装置 - Google Patents
樹脂封止型半導体装置 Download PDFInfo
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- JP5588150B2 JP5588150B2 JP2009258415A JP2009258415A JP5588150B2 JP 5588150 B2 JP5588150 B2 JP 5588150B2 JP 2009258415 A JP2009258415 A JP 2009258415A JP 2009258415 A JP2009258415 A JP 2009258415A JP 5588150 B2 JP5588150 B2 JP 5588150B2
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- resin
- semiconductor element
- microball
- semiconductor device
- sealing body
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Description
のマイクロボール3と、半導体素子4とマイクロボール3を電気的に接続する金属ワイヤ5と、半導体素子4、マイクロボール3の一部、および金属ワイヤ5とを絶縁樹脂7で封止する封止体とを備えている。図1(b)に示すように、半導体素子4の裏面は、封止体の底面と一平面をなすように露出し、外部端子としてマイクロボール3の少なくとも一部は、封止体の裏面から突出した露出部を有している。マイクロボール3は、封止体内の半導体素子4との内部接続用配線の役割と、実装基板との接続に用いる外部接続用端子としての役割を兼ね備えている。
初めに図3(a)に示されるようにステンレス、銅などの導電性金属薄板1あるいは耐熱ゴム薄板または樹脂薄板を用いる。例えば本実施例の場合は、1.0mm厚のステンレス薄板にレーザー加工により円柱形の開口部2を形成した薄板1を準備する。開口部にはテーパを施し面取り加工を施す。ここで図3(a)は上面図、図3(b)は図3(a)のx1−x1断面図である。
の上端面が樹脂封止金型(上型)と接触し、マイクロボールに押付け圧力が負荷された状態で絶縁樹脂7を薄板1上に片面封止することにより形成する。ここでは、エポキシ樹脂を用いたトランスファモールド法により行う。実施例2の樹脂封止型半導体装置は図7(b)に示されるとおり樹脂封止金型に接触したマイクロボール3の上端面が露出する形態となる。
初めに図9(a)に示されるようにステンレス、銅などの導電性金属薄板1あるいは耐熱ゴム、樹脂薄板を用い、例えば本実施例の場合は、0.08mm厚の銅薄板にパンチを用いたプレス加工により円柱形の開口部2を形成する。開口部にはテーパを施し面取り加工を施してもよい。図9(a)は上面図、図9(b)〜図9(j)は、図9(a)のx2−x2で示される位置における工程順の断面図である。
の際は前項のとおりマイクロボール3がテープ8を介して薄板1に固定された状態で行われ、ここでは、トランスファモールド法により、樹脂封止金型6内に絶縁樹脂7を注入する。絶縁樹脂を封止する際には、トランスファモールド法の代わりに、ポッティング法を用いても良い。実施例3の樹脂封止型半導体装置は図11(j)に示されるとおり絶縁樹脂7内にマイクロボール3がボールの下端面を除いて埋め込まれる形態となる。
の際は前項のとおりマイクロボール3がテープ8を介して薄板1に固定された状態で行われ、ここでは、トランスファモールド法により、樹脂封止金型6内に絶縁樹脂7を注入する。絶縁樹脂を封止する際には、トランスファモールド法の代わりに、ポッティング法を用いても良い。実施例4の樹脂封止型半導体装置は図15(j)に示されるとおり絶縁樹脂7内にマイクロボール3がボールの下端面を除いて埋め込まれる形態となる。
2 開口部
3 マイクロボール
4 半導体素子
5 金属ワイヤ
6 樹脂封止金型
7 絶縁樹脂
8 テープ
9 ローラー
Claims (7)
- 半導体素子と、内部端子面と外部端子面を表裏一体に備える複数のマイクロボールと、前記半導体素子と前記内部端子面とを電気的に接続する金属ワイヤと、前記半導体素子、前記複数のマイクロボールの一部、および、前記ワイヤを封止樹脂で封止する封止体とを備えた樹脂封止型半導体装置において、
前記マイクロボールがプラスチックの粒子表面に金属メッキを施したボールであり、前記金属メッキは単一組成のメッキもしくは多層組成のメッキにより形成され、前記半導体素子の裏面が前記封止体から露出し、かつ、前記複数のマイクロボールの一部が前記外部端子面として前記封止体の底面から突起状に露出していることを特徴とする樹脂封止型半導体装置。 - 前記半導体素子の裏面が、前記封止体底面と一平面をなすように露出形成されることを特徴とする請求項1に記載の樹脂封止型半導体装置。
- 前記半導体素子の裏面と前記マイクロボールの少なくとも一部が、前記封止体の底面と一平面をなすように露出形成されることを特徴とする請求項1に記載の樹脂封止型半導体装置。
- 前記マイクロボールが、前記封止体の上面および底面から露出形成されることを特徴とする請求項1に記載の樹脂封止型半導体装置。
- 前記マイクロボールの外部露出部が、前記封止体底面から前記マイクロボールの半径以下の寸法で突出形成されることを特徴とする請求項1に記載の樹脂封止型半導体装置。
- 前記マイクロボールが金属ボールであり、前記金属ボールは単一材料もしくは多種の材料により積層形成されることを特徴とする請求項1に記載の樹脂封止型半導体装置。
- 半導体素子と
前記半導体素子の周囲に配置された複数のマイクロボールと、
前記半導体素子と、前記複数のマイクロボールのそれぞれの第1の部分である内部端子面とを電気的に接続する金属ワイヤと、
前記半導体素子、前記複数のマイクロボールのそれぞれの所望の領域、および、前記ワイヤを封止樹脂で封止する封止体とからなり、
前記マイクロボールがプラスチックの粒子表面に金属メッキを施したボールであり、前記金属メッキは単一組成のメッキもしくは多層組成のメッキにより形成され、
前記半導体素子の裏面が前記封止体から露出し、前記複数のマイクロボールのそれぞれの第2の部分が外部端子面として前記封止体の底面から突起状に露出している樹脂封止型半導体装置。
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JP2009258415A JP5588150B2 (ja) | 2009-02-06 | 2009-11-11 | 樹脂封止型半導体装置 |
TW099101642A TWI478296B (zh) | 2009-02-06 | 2010-01-21 | 樹脂密封型半導體裝置 |
CN201010113656.6A CN101901788B (zh) | 2009-02-06 | 2010-02-05 | 树脂密封型半导体装置及其制造方法 |
US12/701,018 US8703532B2 (en) | 2009-02-06 | 2010-02-05 | Semiconductor device and manufacturing method thereof |
KR1020100011105A KR101665963B1 (ko) | 2009-02-06 | 2010-02-05 | 수지 봉지형 반도체 장치 및 그 제조 방법 |
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US20100200982A1 (en) | 2010-08-12 |
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