JP5642473B2 - Bga半導体パッケージおよびその製造方法 - Google Patents
Bga半導体パッケージおよびその製造方法 Download PDFInfo
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- JP5642473B2 JP5642473B2 JP2010212555A JP2010212555A JP5642473B2 JP 5642473 B2 JP5642473 B2 JP 5642473B2 JP 2010212555 A JP2010212555 A JP 2010212555A JP 2010212555 A JP2010212555 A JP 2010212555A JP 5642473 B2 JP5642473 B2 JP 5642473B2
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- microball
- semiconductor element
- substrate
- bga
- semiconductor package
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Description
本発明のBGA半導体パッケージは、半導体素子と、前記半導体素子を搭載する基板と前記半導体素子と前記基板を接着する接着剤と前記基板に設けられたスルーホールにはめ込まれた導電性のマイクロボールと、前記半導体素子と前記マイクロボールとを電気的に接続するボンディングワイヤと、前記半導体素子、前記接着剤、前記マイクロボールの一部、および前記ボンディングワイヤを前記基板の半導体素子の搭載面側のみを封止樹脂で封止する封止体とを備えたBGA半導体パッケージにおいて、前記マイクロボールの底面の少なくとも一部が前記封止体の底面から前記基板に設けられたスルーホールを通して外部接続用端子として露出する露出部を有することを特徴とする。
前記マイクロボールの上面高さは、前記ダイパッドに固定された前記半導体素子の上面より低いことを特徴とする。
前記マイクロボールの直径が、5μmから500μmであることを特徴とする。
図1は、本発明の実施例であるBGA半導体パッケージの一例を示す図で、(A)は封止体を封止樹脂側から透視した概略構成を示した斜視図であり、(B)は側面図、(C)は上面図である。(D)は封止体を外部端子側から透視した斜視図である。
2 基板
3 テーパ
4 スルーホール
5 マイクロボール
6 ボンディングワイヤ
7 吸引ジグ
8 吸引孔
9 テープ
10 封止金型
11 封止樹脂
12 接着剤
20 配線
21 外部接続部
22 半田ボール
23 ダイパッド
24 プレス板
Claims (9)
- 半導体素子と、
前記半導体素子を搭載する基板と、
前記半導体素子を前記基板に接着する接着剤と、
前記基板に設けられた、円柱形であって半導体素子搭載面側にテーパを有するスルーホールの前記半導体素子搭載面側に、その一部が圧接嵌合された導電性のマイクロボールと、
前記半導体素子と前記マイクロボールとを電気的に接続するボンディングワイヤと、
前記半導体素子、前記接着剤、前記マイクロボールのうち前記スルーホールにはめ込まれていない部分、および前記ボンディングワイヤを、前記基板の前記半導体素子搭載面側のみにおいて封止樹脂で封止する封止体と、
を備え、
前記マイクロボールの底面の少なくとも一部が、前記封止体の底面となる前記基板に設けられたスルーホールを通して外部接続用端子として露出する露出部を有することを特徴とするBGA半導体パッケージ。 - 前記基板の厚さが、前記マイクロボールの直径よりも小さいことを特徴とする請求項1に記載のBGA半導体パッケージ。
- 前記マイクロボールが挿入される前記基板に設けられたスルーホールが、前記半導体素子の両側に配置されるか、もしくは前記半導体素子を取り囲む4辺に配置されることを特徴とする請求項1または2に記載のBGA半導体パッケージ。
- 前記マイクロボールの材質が、はんだ、金、銀、銅、アルミ、鋼もしくは、ニッケルから選ばれた単一金属材料あるいは、はんだ、金、銀、銅、アルミ、鋼および、ニッケルから選ばれた複数の金属を用いた多層金属材料からなることを特徴とする請求項1乃至請求項3の何れか1項に記載のBGA半導体パッケージ。
- 前記マイクロボールの中心部(コア)が弾力性のある樹脂材で構成され、前記弾力性のある樹脂材の外周部をはんだ、金、銀、銅、アルミ、鋼もしくは、ニッケルから選ばれた単一金属材料で被覆された複合マイクロボールであること、あるいは前記弾力性のある樹脂材の外周部をはんだ、金、銀、銅、アルミ、鋼および、ニッケルから選ばれた複数の金属を用いた多層金属材料で被覆された複合マイクロボールであることを特徴とする請求項1乃至請求項3の何れか1項に記載のBGA半導体パッケージ。
- 前記マイクロボールの上面高さは、前記ダイパッドに固定された前記半導体素子の上面より高いことを特徴とする請求項1乃至請求項5の何れか1項に記載のBGA半導体パッケージ。
- 前記マイクロボールの上面高さは、前記ダイパッドに固定された前記半導体素子の上面より低いことを特徴とする請求項1乃至請求項6の何れか1項に記載のBGA半導体パッケージ。
- 基板に円柱形であって半導体素子搭載面側にテーパを有する複数のスルーホールを形成する工程と、
複数の前記スルーホールが形成された前記基板にマイクロボールを圧接嵌合により搭載し、前記マイクロボールの底面の少なくとも一部が、前記封止体の底面となる前記基板に設けられたスルーホールを通して外部接続用端子として露出する工程と、
前記スルーホールを除く前記マイクロボール搭載側の領域に設けたダイパッド部上に半導体素子をボンディングする工程と、
前記半導体素子と前記マイクロボールとをボンディングワイヤにより電気接続する工程と、
前記半導体素子,前記ダイパッド、前記ボンディングワイヤ、および前記マイクロボールの一部のそれぞれを一体に封止樹脂で封止し、封止体を形成する工程と、
前記封止体を個々のBGA半導体パッケージに個片化する工程と、
を有するBGA半導体パッケージの製造方法。 - 前記基板に複数のスルーホールを形成する工程は、ドリル加工、レーザー加工、パターンエッチング加工、もしくは、金型を用いたプレス加工のいずれかによって行うことを特徴とする請求項8に記載のBGA半導体パッケージの製造方法。
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JP2010212555A JP5642473B2 (ja) | 2010-09-22 | 2010-09-22 | Bga半導体パッケージおよびその製造方法 |
TW100133210A TW201232731A (en) | 2010-09-22 | 2011-09-15 | Ball grid array semiconductor package and method of manufacturing the same |
CN201110281227.4A CN102412225B (zh) | 2010-09-22 | 2011-09-21 | Bga半导体封装及其制造方法 |
US13/200,246 US8940629B2 (en) | 2010-09-22 | 2011-09-21 | Ball grid array semiconductor package and method of manufacturing the same |
KR1020110095258A KR101832494B1 (ko) | 2010-09-22 | 2011-09-21 | Bga 반도체 패키지 및 그 제조 방법 |
US14/595,476 US9245864B2 (en) | 2010-09-22 | 2015-01-13 | Ball grid array semiconductor package and method of manufacturing the same |
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TW201602715A (zh) * | 2014-07-07 | 2016-01-16 | Hitachi Maxell | 配列用遮罩及其製造方法 |
KR20170020002A (ko) | 2015-08-13 | 2017-02-22 | 삼성전기주식회사 | 인쇄회로기판 및 이를 포함한 칩 패키지 |
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US20120068340A1 (en) | 2012-03-22 |
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CN102412225B (zh) | 2016-06-22 |
TW201232731A (en) | 2012-08-01 |
KR101832494B1 (ko) | 2018-02-26 |
US9245864B2 (en) | 2016-01-26 |
KR20120031147A (ko) | 2012-03-30 |
JP2012069690A (ja) | 2012-04-05 |
US8940629B2 (en) | 2015-01-27 |
US20150123277A1 (en) | 2015-05-07 |
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