JP4705614B2 - 樹脂封止型半導体装置 - Google Patents
樹脂封止型半導体装置 Download PDFInfo
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- JP4705614B2 JP4705614B2 JP2007203943A JP2007203943A JP4705614B2 JP 4705614 B2 JP4705614 B2 JP 4705614B2 JP 2007203943 A JP2007203943 A JP 2007203943A JP 2007203943 A JP2007203943 A JP 2007203943A JP 4705614 B2 JP4705614 B2 JP 4705614B2
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- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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Description
(1)樹脂封止型半導体装置の製造歩留まりが低下する。
(2)樹脂封止型半導体装置をプリント基板上に実装するときの歩留まりが低下する。
(3)樹脂封止型半導体装置が実装されたプリント基板の品質低下等を回避するために特別の対策が必要になる。
(1)半導体チップを接着して保持する両面配線基板が必要である。
(2)従来のQFPの製造設備以外の新規製造設備の導入が不可欠となって新たな設備コスト等が発生する。
(3)両面配線基板として、通常、ガラス・エポキシ樹脂基板が使用されるため、半導体チップの樹脂接着工程及び加熱硬化工程における半導体チップに加わる歪み対策、半導体チップの各電極パッドと両面配線基板上の配線パターンとをワイヤーボンディングにより電気的に接続する工程における両面配線基板の反り対策、半導体チップを接着した面側のみを樹脂封止することによる両面配線基板の反り対策、或いは、両面配線基板の反りが多少存在する場合における複数の半田ボールの水平面上での高さを均一にするための対策等、製造技術上解決すべき多くの課題が生じる。
(4)半導体装置の信頼性、特に耐湿性が劣化する可能性がある。例えば、ガラス・エポキシ樹脂と樹脂パッケージとの界面の密着力が弱い場合、高温高湿試験又はプレッシャ・クッカー試験等の環境試験において半導体装置の品質保証が困難になる。
以下、本発明の第1の実施形態に係るターミナルランドフレームについて、図面を参照しながら説明する。尚、第1の実施形態に係るターミナルランドフレームにおいては、複数個のパターン(ダイパッドとそれを取り囲む複数個の信号接続用リードとの組み合わせ)が2次元的に配置されているものとする。
以下、本発明の第2の実施形態に係るターミナルランドフレームの製造方法について、図面を参照しながら説明する。尚、第2の実施形態においては、図1〜図3に示す第1の実施形態に係るターミナルランドフレームと同一の部材には同一の符号を付す。
以下、本発明の第3の実施形態に係る樹脂封止型半導体装置について、図面を参照しながら説明する。尚、第3の実施形態に係る樹脂封止型半導体装置は、第1の実施形態に係るターミナルランドフレームを用いて製造されている。また、第3の実施形態において、図1〜図3に示す第1の実施形態に係るターミナルランドフレームと同一の部材には同一の符号を付す。
以下、本発明の第4の実施形態に係る樹脂封止型半導体装置の製造方法について、図10(a)〜(d)を参照しながら説明する。尚、第4の実施形態に係る樹脂封止型半導体装置の製造方法は、第1の実施形態に係るターミナルランドフレームを用いた樹脂封止型半導体装置の製造方法である。また、第4の実施形態において、図1〜図3に示す第1の実施形態に係るターミナルランドフレーム、又は図7及び図8に示す第3の実施形態に係る樹脂封止型半導体装置と同一の部材には同一の符号を付す。
2 フレーム枠
2a フレーム枠の補強材
3 樹脂フイルム
3a 開口部
4 ダイパッド
5 信号接続用リード
5a 金属細線接続部
5b 凹部
6 ターミナルランド部
7 金属板
8 レジスト膜
8A レジストパターン
9 金型
10 金属積層メッキ
11 半導体チップ
12 接着剤
13 金属細線
14 樹脂パッケージ
15 封止フィルム
16 回転刃
Claims (5)
- 樹脂フイルム上に保持されたダイパッドと、
前記樹脂フイルム上に前記ダイパッドを取り囲むように保持された複数個の信号接続用リードと、
前記ダイパッド上に保持された半導体チップと、
前記半導体チップと前記信号接続用リードとを接続する金属細線と、
前記樹脂フイルムの上面側において前記樹脂フイルム、前記ダイパッド、前記信号接続用リード、前記半導体チップ及び前記金属細線を封止している樹脂パッケージとを備え、
前記信号接続用リードのそれぞれに、凹部が形成されるように前記樹脂フイルムの下方に突出するターミナルランド部が設けられ、
前記信号接続用リードは、前記金属細線が接続される一の部分が前記一の部分以外の他の部分よりも細く形成されていると共に各信号接続用リードの前記一の部分が前記ダイパッドを取り囲んで一列のみに並ぶように配置されており、
前記複数個のターミナルランド部は、一列のみに並ぶ前記各信号接続用リードの前記一の部分を挟んだ両側でそれぞれ2列設けられており、当該2列は千鳥配列となっており、
前記ターミナルランド部の厚さは、前記ターミナルランド部を除く前記信号接続用リードの厚さよりも小さいことを特徴とする樹脂封止型半導体装置。 - 前記半導体チップの面積は前記ダイパッドの面積よりも大きく、
前記ターミナルランド部は前記半導体チップの下方に配置されていることを特徴とする請求項1に記載の樹脂封止型半導体装置。 - 前記ターミナルランド部は、前記樹脂フイルムの下方に突出する部分の突出量が、30〜100μmであることを特徴とする請求項1に記載の樹脂封止型半導体装置。
- 前記凹部には、前記樹脂パッケージを構成する封止樹脂が充填されていることを特徴とする請求項1に記載の樹脂封止型半導体装置。
- 前記複数個の信号接続用リードは、前記金属細線との接続部分が前記ターミナルランド部から見て前記ダイパッド側に配置されている第1の信号接続用リードと、前記金属細線との接続部分が前記ターミナルランド部から見て前記ダイパッドの反対側に配置されている第2の信号接続用リードとを有することを特徴とする請求項1に記載の樹脂封止型半導体装置。
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JP2007203943A JP4705614B2 (ja) | 2007-08-06 | 2007-08-06 | 樹脂封止型半導体装置 |
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JP2007203943A JP4705614B2 (ja) | 2007-08-06 | 2007-08-06 | 樹脂封止型半導体装置 |
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JP30701099A Division JP4018853B2 (ja) | 1999-10-28 | 1999-10-28 | ターミナルランドフレーム |
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JP5447928B2 (ja) * | 2009-06-17 | 2014-03-19 | 株式会社エレメント電子 | 実装基板およびそれを用いた薄型発光装置の製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH07226475A (ja) * | 1994-02-14 | 1995-08-22 | Fujitsu Ltd | 半導体装置及びその製造方法及びリードフレーム |
JPH08250641A (ja) * | 1995-03-09 | 1996-09-27 | Fujitsu Ltd | 半導体装置とその製造方法 |
JPH0936273A (ja) * | 1995-07-18 | 1997-02-07 | Nec Kyushu Ltd | 樹脂封止型半導体装置 |
JPH10504137A (ja) * | 1994-07-19 | 1998-04-14 | オリン コーポレイション | 一体的にバンプされた電子パッケージコンポーネント |
JPH11260950A (ja) * | 1998-03-10 | 1999-09-24 | Hitachi Ltd | 半導体装置及びその製造方法 |
JPH11274360A (ja) * | 1998-03-25 | 1999-10-08 | Hitachi Ltd | 半導体装置及びその製造方法 |
-
2007
- 2007-08-06 JP JP2007203943A patent/JP4705614B2/ja not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07226475A (ja) * | 1994-02-14 | 1995-08-22 | Fujitsu Ltd | 半導体装置及びその製造方法及びリードフレーム |
JPH10504137A (ja) * | 1994-07-19 | 1998-04-14 | オリン コーポレイション | 一体的にバンプされた電子パッケージコンポーネント |
JPH08250641A (ja) * | 1995-03-09 | 1996-09-27 | Fujitsu Ltd | 半導体装置とその製造方法 |
JPH0936273A (ja) * | 1995-07-18 | 1997-02-07 | Nec Kyushu Ltd | 樹脂封止型半導体装置 |
JPH11260950A (ja) * | 1998-03-10 | 1999-09-24 | Hitachi Ltd | 半導体装置及びその製造方法 |
JPH11274360A (ja) * | 1998-03-25 | 1999-10-08 | Hitachi Ltd | 半導体装置及びその製造方法 |
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