IT201700073501A1 - Prodotto a semiconduttore e corrispondente procedimento - Google Patents
Prodotto a semiconduttore e corrispondente procedimentoInfo
- Publication number
- IT201700073501A1 IT201700073501A1 IT102017000073501A IT201700073501A IT201700073501A1 IT 201700073501 A1 IT201700073501 A1 IT 201700073501A1 IT 102017000073501 A IT102017000073501 A IT 102017000073501A IT 201700073501 A IT201700073501 A IT 201700073501A IT 201700073501 A1 IT201700073501 A1 IT 201700073501A1
- Authority
- IT
- Italy
- Prior art keywords
- correspondent
- procedure
- semiconductor product
- semiconductor
- product
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
- H01L24/92—Specific sequence of method steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (2)
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IT102017000073501A IT201700073501A1 (it) | 2017-06-30 | 2017-06-30 | Prodotto a semiconduttore e corrispondente procedimento |
US16/020,757 US10535535B2 (en) | 2017-06-30 | 2018-06-27 | Semiconductor product and corresponding method |
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IT102017000073501A IT201700073501A1 (it) | 2017-06-30 | 2017-06-30 | Prodotto a semiconduttore e corrispondente procedimento |
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Families Citing this family (4)
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IT201900005156A1 (it) | 2019-04-05 | 2020-10-05 | St Microelectronics Srl | Procedimento per fabbricare leadframe per dispositivi a semiconduttore |
IT201900024292A1 (it) | 2019-12-17 | 2021-06-17 | St Microelectronics Srl | Procedimento per fabbricare dispositivi a semiconduttore e dispositivo a semiconduttore corrispondente |
DE102020112879A1 (de) | 2020-05-12 | 2021-11-18 | Lpkf Laser & Electronics Aktiengesellschaft | Verbundstruktur mit zumindest einer elektronischen Komponente sowie ein Verfahren zur Herstellung einer solchen Verbundstruktur |
DE102021104696A1 (de) | 2021-02-26 | 2022-09-01 | Infineon Technologies Ag | Verfahren zur verbindung eines elektrischen bauelementes mit einer bodeneinheit unter verwendung einer lötfreien verbindung |
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US10535535B2 (en) | 2020-01-14 |
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