JP3864952B2 - 振動子デバイス及びそれを備えた電子機器並びに振動子デバイスの製造方法 - Google Patents
振動子デバイス及びそれを備えた電子機器並びに振動子デバイスの製造方法 Download PDFInfo
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- JP3864952B2 JP3864952B2 JP2003401443A JP2003401443A JP3864952B2 JP 3864952 B2 JP3864952 B2 JP 3864952B2 JP 2003401443 A JP2003401443 A JP 2003401443A JP 2003401443 A JP2003401443 A JP 2003401443A JP 3864952 B2 JP3864952 B2 JP 3864952B2
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Description
この種の振動子デバイスとしては、AT振動子、音叉型振動子あるいはH型振動子などの各種振動子をAgペーストや導電シリコーンペーストで基体に支持するとともに電気的な接続を行った構造が一般的である。
ところが、Agペーストや導電シリコーンペーストは、接着力が高いため、振動子が基体に固定されてしまい、各方向への自由度が拘束されて振動が規制され、振動子の振動特性、発振特性に影響を与えてしまう。
ここで、安定した周波数特性を得る目的で、弾性表面波素子を吊り線によって吊り下げたSAWデバイスの構造が知られている(例えば、特許文献1参照)。
また、このSAWデバイスは、基板の表面に弾性表面波を生じさせるものであり、振動子デバイスのように、コリオリ力への自由度などを考慮し、振動子を全方向に振動させる構造を要するものとは、その構造が根本的に異なり、SAWデバイスにおける支持構造は、振動子デバイスに適さない。
このように、基体に対して振動子を宙づり状に支持したので、振動子の振動方向の自由度を高めることができ、振動特性、発振特性を大幅に向上させることができる。
このように、振動子をその重心部にてワイヤで支持するようにしたので、振動子が安定した状態に宙づりされた構造となる。
これにより、接続端子部におけるワイヤの接続高さを低く抑えて全体の薄型化を図りつつ、支持強度を高めることができる。
これにより、接続端子部を小さくして振動子自体の小型化を図りつつ、支持強度を高めることができる。
これにより、振動子との間で電気信号を送受信する別個の信号線を不要とすることができ、構造の簡略化を図ることができる。
これにより、振動子のグランド線を別個に設ける必要をなくすことができ、構造の簡略化を図ることができる。
このように、振動、発振特性に優れた振動子デバイスを備えることにより、性能の大幅な向上を図ることができる。
前記のワイヤボンディングによりワイヤを延ばして接続する工程では、前記振動子に設けられた接続端子部の一つに、複数の前記ワイヤの接続端を接続し、前記ワイヤを、少なくともその複数が前記振動子と電気的に接続する電気配線として機能させることを特徴とする。
図1は、本実施形態に係る振動子デバイスを説明する振動子デバイスの側面図、図2は、振動子デバイスを説明する振動子デバイスの平面図である。
図に示すように、振動子デバイス11は、基体である支持基板12と、この支持基板12に支持された平面視H型の振動子13とを有している。
振動子13は、その重心位置に、正方形状(矩形状)の支持部14を有しており、この支持部14は、その上面におけるそれぞれの角部に、接続端子部15を備えている。
つまり、この振動子デバイス11は、支持基板12上にワイヤ21によって振動子13を宙づり状態に支持した宙づり構造とされている。
また、図3に示すように、ワイヤ21は、その端部が振動子13の支持部14に形成された接続端子部15に、その面方向へ並列に接続されている。
次いで、ワイヤボンディングにより、支持端子部17と接続端子部15とに、ワイヤ21を延ばして接続し、その後、接着材を溶融させて除去する。
これにより、支持基板12に対して振動子13が宙づり状態に支持された宙づり構造の振動子デバイス11が得られる。
なお、製造時に用いる接着材としては、アクリル、エポキシなどの材質で、熱硬化、常温硬化、紫外線硬化のいずれかにより硬化するものを用いる。また、接着材の除去については、接着材が水溶性の場合には、ワイヤボンディング後に水で溶解してこれを除去し、接着材が非水溶性の場合には、ワイヤボンディング後にアセトン、グリコールエーテルなどで溶解してこれを除去する。
また、振動子デバイスの製造方法によれば、接着材によって支持基板12に仮支持させた振動子13の重心部と支持基板12との間に、ワイヤボンディングによりワイヤ21を延ばして接続し、その後、接着材を除去することにより、支持基板12に対して振動子13を、その重心部にて極めて容易に宙づり状で支持させることができる。そして、これにより振動子13の振動方向の自由度を高め、振動特性、発振特性が向上した振動子デバイス11を製造することができる。
さらに、ワイヤ21を、振動子13との間で電気信号を送受信する信号線としたりグランド線とすることにより、別個の信号線やグランド線を不要とすることができ、構造の簡略化を図ることができる。
このような振動子デバイス11を組み込んだ電子機器によれば、振動、発振特性に優れた振動子デバイス11を備えることにより、電子機器の性能の大幅な向上を図ることができ、これら電子機器における手ぶれ防止機能や位置検出機能の高性能化を実現することができる。
すなわち、薄型化のためにワイヤ21のループを低くしたい場合には、図3に示したように接続端子部15に面方向へ並列に接続し、接続端子部15の面積が狭く、またワイヤ21で振動子13の平面方向の自由振動が阻害されてしまう場合には、接続端子部15へ重ねて接続するのが良い。
また、接続端子部15に、ワイヤ21の接続端を複数段に重ねて接続することにより、接続端子部15を小さくして振動子13自体の小型化を図りつつ、支持強度を高めることができる。
図に示すように、このパッケージ31には、セラミックスあるいは缶体からなるパッケージ本体32に制御IC33が実装されており、この制御IC33は、ワイヤボンディングによってパッケージ本体32に接続されている。パッケージ本体32には、その内部における両側部に段部34が形成されており、この段部34には、接続端子35が形成されている。そして、振動子デバイス11は、そのリード部16が段部34上に配設され、この段部34の接続端子35に接続されたことにより、パッケージ本体32内に配設されている。
なお、パッケージ本体32は、その裏面に、パッケージ31を組み込む各種装置と電気的な接続を行うための電極32aを複数備えている。
そして、振動子デバイス11をパッケージ本体32内に収納してパッケージ31とするには、まず、パッケージ本体32内に、制御IC33をダイボンディングにより実装し、次いで、パッケージ本体32内に、振動子デバイス11を収納してリード部16と段部34の接続端子35とを接続する。その後、パッケージ本体32の開口部分にキャップ36を取り付け、内部と連通する図示しない孔から、パッケージ本体32内を真空引きあるいは窒素等の不活性ガスに置換する。
また、制御IC33の実装の仕方としては、ワイヤボンディングによる実装に限らずフリップチップ実装でも良い。
この支持基板12は、スルーホール12aを有し、このスルーホール12aを介して、下面側に形成された接続パターン12bと上面側の配線パターン18とが導通されている。ここで、支持基板12が金属等の導電性を有するものである場合は、支持基板12と配線パターン18、スルーホール12aまたは接続パターン12bとの間に絶縁層を設けておく。
なお、これら接続端子12b、35の接続は、例えば、Agペースト、加熱加圧あるいは超音波振動などにより行う。
このような構造のものを作製するには、まず、パッケージ本体32内に実装する制御IC33をフリップチップ実装する。そして、この制御IC33上に振動子13を接着材で接着し、その状態でワイヤボンディングによってパッケージ本体32と振動子13とをワイヤ21で接続する。その後、接着材を除去することで振動子13を宙づり状にする。このように、特に制御IC33の能動面を下側にするフリップチップ実装を採用することで、制御IC33の能動面に接着材を設ける必要がなくなり、したがって接着材による制御IC33の機能低下のおそれがなくなる。
また、上記の実施形態では、振動子13として、H型振動子を例にとって説明したが、振動子13としては、H型振動子に限定されることはない。
Claims (8)
- 基体に支持された振動子を有する振動子デバイスであって、
前記振動子は、ワイヤボンディングによって前記基体から延ばされたワイヤに接続されたことにより、前記基体に対して宙づり状態に支持され、
前記振動子に設けられた接続端子部の一つに、複数の前記ワイヤの接続端が接続され、
前記ワイヤは、少なくともその複数が前記振動子と電気的に接続する電気配線として機能していることを特徴とする振動子デバイス。 - 前記振動子は、その重心部で前記ワイヤに接続されていることを特徴とする請求項1に記載の振動子デバイス。
- 前記接続端子部に、前記ワイヤの接続端が面方向へ並列に接続されていることを特徴とする請求項1又は2に記載の振動子デバイス。
- 前記接続端子部に、前記ワイヤの接続端が複数段に重ねて接続されていることを特徴とする請求項1又は2に記載の振動子デバイス。
- 前記ワイヤは、前記振動子との間で電気信号を送受信する信号線であることを特徴とする請求項1から4のいずれか1項に記載の振動子デバイス。
- 前記ワイヤは、前記振動子のグランド線であることを特徴とする請求項1から4のいずれか1項に記載の振動子デバイス。
- 請求項1〜6のいずれか1項に記載の振動子デバイスを備えたことを特徴とする電子機器。
- 基体に支持された振動子を有する振動子デバイスの製造方法であって、
前記基体に接着材を介して前記振動子を仮支持させる工程と、
ワイヤボンディングにより前記基体と前記振動子との間にワイヤを延ばして接続する工程と、
その後、前記接着材を除去することにより、前記ワイヤによって前記振動子を前記基体に対して宙づり状態に支持させる工程とを備え、
前記のワイヤボンディングによりワイヤを延ばして接続する工程では、前記振動子に設けられた接続端子部の一つに、複数の前記ワイヤの接続端を接続し、前記ワイヤを、少なくともその複数が前記振動子と電気的に接続する電気配線として機能させることを特徴とする振動子デバイスの製造方法。
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CNA2004100952699A CN1625049A (zh) | 2003-12-01 | 2004-11-22 | 振动器件和具备其的电子仪器以及振动器件的制造方法 |
US10/996,380 US7145416B2 (en) | 2003-12-01 | 2004-11-23 | Resonator device, electronic equipment provided with resonator device and method of manufacturing resonator device |
KR1020040099121A KR100614717B1 (ko) | 2003-12-01 | 2004-11-30 | 진동자 장치 및 그것을 구비한 전자기기 및 진동자 장치의제조 방법 |
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US7302864B2 (en) * | 2005-09-23 | 2007-12-04 | Honeywell International Inc. | Torque sensor |
KR100731120B1 (ko) * | 2005-12-28 | 2007-06-22 | 동부일렉트로닉스 주식회사 | 씨모스 이미지 센서 및 그 제조방법 |
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JP2009130235A (ja) * | 2007-11-27 | 2009-06-11 | Panasonic Corp | 圧電デバイスとこれを用いた電子機器、及び自動車 |
JP5555974B2 (ja) * | 2007-11-27 | 2014-07-23 | パナソニック株式会社 | 圧電デバイスとこれを用いた電子機器、及び自動車 |
JP2010190706A (ja) * | 2009-02-18 | 2010-09-02 | Panasonic Corp | 慣性力センサ |
TWI420810B (zh) | 2010-12-17 | 2013-12-21 | Ind Tech Res Inst | 石英振盪器及其製造方法 |
JP2017102251A (ja) * | 2015-12-01 | 2017-06-08 | 三菱電機株式会社 | 光変調器モジュール |
CN113346856B (zh) * | 2021-05-12 | 2022-12-09 | 唐山国芯晶源电子有限公司 | 一种晶体谐振器生产用智能点胶设备及点胶方法 |
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