JP2000332091A5 - - Google Patents
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- Publication number
- JP2000332091A5 JP2000332091A5 JP1999145507A JP14550799A JP2000332091A5 JP 2000332091 A5 JP2000332091 A5 JP 2000332091A5 JP 1999145507 A JP1999145507 A JP 1999145507A JP 14550799 A JP14550799 A JP 14550799A JP 2000332091 A5 JP2000332091 A5 JP 2000332091A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- electrostatic chuck
- substrate
- dielectric
- electrostatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 description 128
- 238000001179 sorption measurement Methods 0.000 description 46
- 239000007789 gas Substances 0.000 description 33
- 238000010438 heat treatment Methods 0.000 description 18
- 238000001816 cooling Methods 0.000 description 17
- 239000011521 glass Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 11
- 238000012545 processing Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000007789 sealing Methods 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 8
- 230000005684 electric field Effects 0.000 description 7
- 238000003672 processing method Methods 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000002585 base Substances 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 230000003746 surface roughness Effects 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000012212 insulator Substances 0.000 description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 239000002156 adsorbate Substances 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 4
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 3
- 229910000423 chromium oxide Inorganic materials 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000000274 adsorptive effect Effects 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000000112 cooling gas Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000002294 plasma sputter deposition Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Priority Applications (16)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14550799A JP3805134B2 (ja) | 1999-05-25 | 1999-05-25 | 絶縁性基板吸着用静電チャック |
| TW089110073A TW508716B (en) | 1999-05-25 | 2000-05-24 | Electrostatic chuck and treatment device |
| EP00929866A EP1191581B1 (en) | 1999-05-25 | 2000-05-25 | Method for Electrostatically Attracting and Processing a Glass Insulative Substrate |
| PCT/JP2000/003355 WO2000072376A1 (en) | 1999-05-25 | 2000-05-25 | Electrostatic chuck and treating device |
| EP07013291.5A EP1852907B1 (en) | 1999-05-25 | 2000-05-25 | Method for holding and processing SOS or SOI wafers |
| CNB008108846A CN1179407C (zh) | 1999-05-25 | 2000-05-25 | 静电吸盘和处理装置 |
| KR1020077009029A KR100933727B1 (ko) | 1999-05-25 | 2000-05-25 | 절연성 기판 흡착용 정전 척 |
| CNA2004100855627A CN1595631A (zh) | 1999-05-25 | 2000-05-25 | 静电吸盘和处理装置 |
| US09/979,627 US6768627B1 (en) | 1999-05-25 | 2000-05-25 | Electrostatic chuck and processing apparatus for insulative substrate |
| KR1020087028422A KR20090003347A (ko) | 1999-05-25 | 2000-05-25 | 절연성 기판 흡착용 정전 척, 및 절연성 기판 가열냉각 처리장치 |
| CNB2004100855631A CN100375263C (zh) | 1999-05-25 | 2000-05-25 | 静电吸盘和处理装置 |
| KR1020097016855A KR20090100455A (ko) | 1999-05-25 | 2000-05-25 | 절연성 기판 흡착용 정전 척 |
| AU47813/00A AU4781300A (en) | 1999-05-25 | 2000-05-25 | Electrostatic chuck and treating device |
| DE60037885T DE60037885T2 (de) | 1999-05-25 | 2000-05-25 | Methode zur elektrostatischen Anziehung und Verarbeitung eines isolierneden Glassubstrates |
| KR1020017015040A KR20020019030A (ko) | 1999-05-25 | 2000-05-25 | 정전 척 및 처리장치 |
| US10/857,068 US7209339B2 (en) | 1999-05-25 | 2004-05-28 | Electrostatic chuck for an electrically insulative substrate, and a method of using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14550799A JP3805134B2 (ja) | 1999-05-25 | 1999-05-25 | 絶縁性基板吸着用静電チャック |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006004865A Division JP2006157032A (ja) | 2006-01-12 | 2006-01-12 | 静電チャック、静電吸着方法、加熱冷却処理装置、静電吸着処理装置 |
| JP2006106779A Division JP2006253703A (ja) | 2006-04-07 | 2006-04-07 | 静電チャック及び絶縁性基板静電吸着処理方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000332091A JP2000332091A (ja) | 2000-11-30 |
| JP2000332091A5 true JP2000332091A5 (enExample) | 2005-05-26 |
| JP3805134B2 JP3805134B2 (ja) | 2006-08-02 |
Family
ID=15386861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14550799A Expired - Lifetime JP3805134B2 (ja) | 1999-05-25 | 1999-05-25 | 絶縁性基板吸着用静電チャック |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US6768627B1 (enExample) |
| EP (2) | EP1852907B1 (enExample) |
| JP (1) | JP3805134B2 (enExample) |
| KR (4) | KR20090003347A (enExample) |
| CN (3) | CN1595631A (enExample) |
| AU (1) | AU4781300A (enExample) |
| DE (1) | DE60037885T2 (enExample) |
| TW (1) | TW508716B (enExample) |
| WO (1) | WO2000072376A1 (enExample) |
Families Citing this family (127)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001035907A (ja) | 1999-07-26 | 2001-02-09 | Ulvac Japan Ltd | 吸着装置 |
| TWI254403B (en) * | 2000-05-19 | 2006-05-01 | Ngk Insulators Ltd | Electrostatic clamper, and electrostatic attracting structures |
| JP4697833B2 (ja) * | 2000-06-14 | 2011-06-08 | キヤノンアネルバ株式会社 | 静電吸着機構及び表面処理装置 |
| JP3693895B2 (ja) * | 2000-07-24 | 2005-09-14 | 住友大阪セメント株式会社 | 可撓性フィルムの静電吸着装置、可撓性フィルムの静電吸着方法、可撓性フィルムの表面処理方法 |
| JP4156788B2 (ja) * | 2000-10-23 | 2008-09-24 | 日本碍子株式会社 | 半導体製造装置用サセプター |
| JP4548928B2 (ja) * | 2000-10-31 | 2010-09-22 | 京セラ株式会社 | 電極内蔵体及びこれを用いたウエハ支持部材 |
| KR100750835B1 (ko) * | 2001-01-19 | 2007-08-22 | 가부시키가이샤 알박 | 흡착장치 |
| KR20020064508A (ko) * | 2001-02-02 | 2002-08-09 | 삼성전자 주식회사 | 정전 척 |
| KR20020064507A (ko) * | 2001-02-02 | 2002-08-09 | 삼성전자 주식회사 | 정전 척과 그의 제조방법 |
| JP2005033221A (ja) * | 2001-02-08 | 2005-02-03 | Tokyo Electron Ltd | 基板載置台および処理装置 |
| JP2002270681A (ja) * | 2001-03-07 | 2002-09-20 | Anelva Corp | 基板処理用静電吸着機構 |
| JP4503196B2 (ja) * | 2001-03-07 | 2010-07-14 | 株式会社アルバック | 封着室、パネル保持台及び封着方法 |
| JP3408530B2 (ja) | 2001-04-26 | 2003-05-19 | 東京エレクトロン株式会社 | 半導体製造装置用部材およびその製造方法 |
| US6805968B2 (en) | 2001-04-26 | 2004-10-19 | Tocalo Co., Ltd. | Members for semiconductor manufacturing apparatus and method for producing the same |
| JP2002345273A (ja) * | 2001-05-18 | 2002-11-29 | Toto Ltd | 静電チャック |
| JP2003077994A (ja) * | 2001-08-30 | 2003-03-14 | Kyocera Corp | 静電チャック及びその製造方法 |
| JP4094262B2 (ja) * | 2001-09-13 | 2008-06-04 | 住友大阪セメント株式会社 | 吸着固定装置及びその製造方法 |
| TW561514B (en) * | 2002-04-25 | 2003-11-11 | Tokyo Electron Ltd | Member for semiconductor manufacturing system and its manufacturing method |
| EP1359466A1 (en) * | 2002-05-01 | 2003-11-05 | ASML Netherlands B.V. | Chuck, lithographic projection apparatus, method of manufacturing a chuck and device manufacturing method |
| EP1359469B1 (en) * | 2002-05-01 | 2011-03-02 | ASML Netherlands B.V. | Chuck, lithographic projection apparatus and device manufacturing method |
| US6660665B2 (en) * | 2002-05-01 | 2003-12-09 | Japan Fine Ceramics Center | Platen for electrostatic wafer clamping apparatus |
| KR100511854B1 (ko) | 2002-06-18 | 2005-09-02 | 아네르바 가부시키가이샤 | 정전 흡착 장치 |
| US7255775B2 (en) * | 2002-06-28 | 2007-08-14 | Toshiba Ceramics Co., Ltd. | Semiconductor wafer treatment member |
| JP2004228456A (ja) * | 2003-01-27 | 2004-08-12 | Canon Inc | 露光装置 |
| US7033443B2 (en) * | 2003-03-28 | 2006-04-25 | Axcelis Technologies, Inc. | Gas-cooled clamp for RTP |
| US20050042881A1 (en) * | 2003-05-12 | 2005-02-24 | Tokyo Electron Limited | Processing apparatus |
| JP3748559B2 (ja) * | 2003-06-30 | 2006-02-22 | キヤノン株式会社 | ステージ装置、露光装置、荷電ビーム描画装置、デバイス製造方法、基板電位測定方法及び静電チャック |
| EP1498777A1 (en) * | 2003-07-15 | 2005-01-19 | ASML Netherlands B.V. | Substrate holder and lithographic projection apparatus |
| US7072165B2 (en) * | 2003-08-18 | 2006-07-04 | Axcelis Technologies, Inc. | MEMS based multi-polar electrostatic chuck |
| US6947274B2 (en) * | 2003-09-08 | 2005-09-20 | Axcelis Technologies, Inc. | Clamping and de-clamping semiconductor wafers on an electrostatic chuck using wafer inertial confinement by applying a single-phase square wave AC clamping voltage |
| US7072166B2 (en) * | 2003-09-12 | 2006-07-04 | Axcelis Technologies, Inc. | Clamping and de-clamping semiconductor wafers on a J-R electrostatic chuck having a micromachined surface by using force delay in applying a single-phase square wave AC clamping voltage |
| US6905984B2 (en) * | 2003-10-10 | 2005-06-14 | Axcelis Technologies, Inc. | MEMS based contact conductivity electrostatic chuck |
| US6946403B2 (en) * | 2003-10-28 | 2005-09-20 | Axcelis Technologies, Inc. | Method of making a MEMS electrostatic chuck |
| US7663860B2 (en) | 2003-12-05 | 2010-02-16 | Tokyo Electron Limited | Electrostatic chuck |
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| JP4684222B2 (ja) * | 2004-03-19 | 2011-05-18 | 株式会社クリエイティブ テクノロジー | 双極型静電チャック |
| US7595972B2 (en) * | 2004-04-09 | 2009-09-29 | Varian Semiconductor Equipment Associates, Inc. | Clamp for use in processing semiconductor workpieces |
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| US7646581B2 (en) * | 2006-01-31 | 2010-01-12 | Sumitomo Osaka Cement Co., Ltd. | Electrostatic chuck |
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| JP4808149B2 (ja) * | 2006-03-29 | 2011-11-02 | 新光電気工業株式会社 | 静電チャック |
| US8226769B2 (en) | 2006-04-27 | 2012-07-24 | Applied Materials, Inc. | Substrate support with electrostatic chuck having dual temperature zones |
| JP5069452B2 (ja) * | 2006-04-27 | 2012-11-07 | アプライド マテリアルズ インコーポレイテッド | 二重温度帯を有する静電チャックをもつ基板支持体 |
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| KR101680787B1 (ko) | 2009-05-15 | 2016-11-29 | 엔테그리스, 아이엔씨. | 중합체 돌기들을 가지는 정전 척 |
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| JP5597695B2 (ja) * | 2010-03-26 | 2014-10-01 | 株式会社アルバック | 基板保持装置及び基板保持方法 |
| KR101134736B1 (ko) * | 2010-04-26 | 2012-04-13 | 가부시키가이샤 크리에이티브 테크놀러지 | 스페이서를 구비하는 정전 척 및 그 제조방법 |
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| JP5454803B2 (ja) * | 2010-08-11 | 2014-03-26 | Ｔｏｔｏ株式会社 | 静電チャック |
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| US9105705B2 (en) * | 2011-03-14 | 2015-08-11 | Plasma-Therm Llc | Method and apparatus for plasma dicing a semi-conductor wafer |
| US9859142B2 (en) | 2011-10-20 | 2018-01-02 | Lam Research Corporation | Edge seal for lower electrode assembly |
| US9869392B2 (en) | 2011-10-20 | 2018-01-16 | Lam Research Corporation | Edge seal for lower electrode assembly |
| JP5993568B2 (ja) * | 2011-11-09 | 2016-09-14 | 東京エレクトロン株式会社 | 基板載置システム、基板処理装置、静電チャック及び基板冷却方法 |
| US8902561B2 (en) * | 2012-02-02 | 2014-12-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Electrostatic chuck with multi-zone control |
| JP6196612B2 (ja) * | 2012-03-07 | 2017-09-13 | 日本特殊陶業株式会社 | 搬送装置およびセラミック部材 |
| US9030797B2 (en) * | 2012-06-01 | 2015-05-12 | Infineon Technologies Ag | Thin substrate electrostatic chuck system and method |
| JP5975755B2 (ja) | 2012-06-28 | 2016-08-23 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置およびプラズマ処理方法 |
| KR102032744B1 (ko) * | 2012-09-05 | 2019-11-11 | 삼성디스플레이 주식회사 | 기판 고정장치 및 이의 제조방법 |
| JP6016946B2 (ja) | 2012-12-20 | 2016-10-26 | キヤノンアネルバ株式会社 | 酸化処理装置、酸化方法、および電子デバイスの製造方法 |
| US10001713B2 (en) * | 2013-02-07 | 2018-06-19 | Asml Holding N.V. | Lithographic apparatus and method |
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