JP3805134B2 - 絶縁性基板吸着用静電チャック - Google Patents

絶縁性基板吸着用静電チャック Download PDF

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Publication number
JP3805134B2
JP3805134B2 JP14550799A JP14550799A JP3805134B2 JP 3805134 B2 JP3805134 B2 JP 3805134B2 JP 14550799 A JP14550799 A JP 14550799A JP 14550799 A JP14550799 A JP 14550799A JP 3805134 B2 JP3805134 B2 JP 3805134B2
Authority
JP
Japan
Prior art keywords
electrostatic chuck
insulating substrate
electrodes
dielectric
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP14550799A
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English (en)
Japanese (ja)
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JP2000332091A (ja
JP2000332091A5 (enExample
Inventor
徹夫 北林
裕明 堀
健志 内村
範昭 建野
耕 不破
謙 前平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP14550799A priority Critical patent/JP3805134B2/ja
Priority to TW089110073A priority patent/TW508716B/zh
Priority to CNB008108846A priority patent/CN1179407C/zh
Priority to PCT/JP2000/003355 priority patent/WO2000072376A1/ja
Priority to US09/979,627 priority patent/US6768627B1/en
Priority to DE60037885T priority patent/DE60037885T2/de
Priority to CNB2004100855631A priority patent/CN100375263C/zh
Priority to CNA2004100855627A priority patent/CN1595631A/zh
Priority to KR1020077009029A priority patent/KR100933727B1/ko
Priority to KR1020017015040A priority patent/KR20020019030A/ko
Priority to KR1020087028422A priority patent/KR20090003347A/ko
Priority to EP07013291.5A priority patent/EP1852907B1/en
Priority to KR1020097016855A priority patent/KR20090100455A/ko
Priority to AU47813/00A priority patent/AU4781300A/en
Priority to EP00929866A priority patent/EP1191581B1/en
Publication of JP2000332091A publication Critical patent/JP2000332091A/ja
Priority to US10/857,068 priority patent/US7209339B2/en
Publication of JP2000332091A5 publication Critical patent/JP2000332091A5/ja
Application granted granted Critical
Publication of JP3805134B2 publication Critical patent/JP3805134B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • B23Q3/154—Stationary devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
JP14550799A 1999-05-25 1999-05-25 絶縁性基板吸着用静電チャック Expired - Lifetime JP3805134B2 (ja)

Priority Applications (16)

Application Number Priority Date Filing Date Title
JP14550799A JP3805134B2 (ja) 1999-05-25 1999-05-25 絶縁性基板吸着用静電チャック
TW089110073A TW508716B (en) 1999-05-25 2000-05-24 Electrostatic chuck and treatment device
EP07013291.5A EP1852907B1 (en) 1999-05-25 2000-05-25 Method for holding and processing SOS or SOI wafers
US09/979,627 US6768627B1 (en) 1999-05-25 2000-05-25 Electrostatic chuck and processing apparatus for insulative substrate
DE60037885T DE60037885T2 (de) 1999-05-25 2000-05-25 Methode zur elektrostatischen Anziehung und Verarbeitung eines isolierneden Glassubstrates
CNB2004100855631A CN100375263C (zh) 1999-05-25 2000-05-25 静电吸盘和处理装置
CNA2004100855627A CN1595631A (zh) 1999-05-25 2000-05-25 静电吸盘和处理装置
KR1020077009029A KR100933727B1 (ko) 1999-05-25 2000-05-25 절연성 기판 흡착용 정전 척
CNB008108846A CN1179407C (zh) 1999-05-25 2000-05-25 静电吸盘和处理装置
KR1020087028422A KR20090003347A (ko) 1999-05-25 2000-05-25 절연성 기판 흡착용 정전 척, 및 절연성 기판 가열냉각 처리장치
PCT/JP2000/003355 WO2000072376A1 (en) 1999-05-25 2000-05-25 Electrostatic chuck and treating device
KR1020097016855A KR20090100455A (ko) 1999-05-25 2000-05-25 절연성 기판 흡착용 정전 척
AU47813/00A AU4781300A (en) 1999-05-25 2000-05-25 Electrostatic chuck and treating device
EP00929866A EP1191581B1 (en) 1999-05-25 2000-05-25 Method for Electrostatically Attracting and Processing a Glass Insulative Substrate
KR1020017015040A KR20020019030A (ko) 1999-05-25 2000-05-25 정전 척 및 처리장치
US10/857,068 US7209339B2 (en) 1999-05-25 2004-05-28 Electrostatic chuck for an electrically insulative substrate, and a method of using same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14550799A JP3805134B2 (ja) 1999-05-25 1999-05-25 絶縁性基板吸着用静電チャック

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2006004865A Division JP2006157032A (ja) 2006-01-12 2006-01-12 静電チャック、静電吸着方法、加熱冷却処理装置、静電吸着処理装置
JP2006106779A Division JP2006253703A (ja) 2006-04-07 2006-04-07 静電チャック及び絶縁性基板静電吸着処理方法

Publications (3)

Publication Number Publication Date
JP2000332091A JP2000332091A (ja) 2000-11-30
JP2000332091A5 JP2000332091A5 (enExample) 2005-05-26
JP3805134B2 true JP3805134B2 (ja) 2006-08-02

Family

ID=15386861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14550799A Expired - Lifetime JP3805134B2 (ja) 1999-05-25 1999-05-25 絶縁性基板吸着用静電チャック

Country Status (9)

Country Link
US (2) US6768627B1 (enExample)
EP (2) EP1191581B1 (enExample)
JP (1) JP3805134B2 (enExample)
KR (4) KR20020019030A (enExample)
CN (3) CN100375263C (enExample)
AU (1) AU4781300A (enExample)
DE (1) DE60037885T2 (enExample)
TW (1) TW508716B (enExample)
WO (1) WO2000072376A1 (enExample)

Families Citing this family (127)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001035907A (ja) 1999-07-26 2001-02-09 Ulvac Japan Ltd 吸着装置
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JP3693895B2 (ja) * 2000-07-24 2005-09-14 住友大阪セメント株式会社 可撓性フィルムの静電吸着装置、可撓性フィルムの静電吸着方法、可撓性フィルムの表面処理方法
JP4156788B2 (ja) * 2000-10-23 2008-09-24 日本碍子株式会社 半導体製造装置用サセプター
JP4548928B2 (ja) * 2000-10-31 2010-09-22 京セラ株式会社 電極内蔵体及びこれを用いたウエハ支持部材
KR100750835B1 (ko) * 2001-01-19 2007-08-22 가부시키가이샤 알박 흡착장치
KR20020064507A (ko) * 2001-02-02 2002-08-09 삼성전자 주식회사 정전 척과 그의 제조방법
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JP2005033221A (ja) * 2001-02-08 2005-02-03 Tokyo Electron Ltd 基板載置台および処理装置
JP4503196B2 (ja) * 2001-03-07 2010-07-14 株式会社アルバック 封着室、パネル保持台及び封着方法
JP2002270681A (ja) * 2001-03-07 2002-09-20 Anelva Corp 基板処理用静電吸着機構
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JP4094262B2 (ja) * 2001-09-13 2008-06-04 住友大阪セメント株式会社 吸着固定装置及びその製造方法
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CN1179407C (zh) 2004-12-08
CN100375263C (zh) 2008-03-12
CN1365518A (zh) 2002-08-21
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EP1191581A1 (en) 2002-03-27
JP2000332091A (ja) 2000-11-30
WO2000072376A1 (en) 2000-11-30
CN1595631A (zh) 2005-03-16
DE60037885T2 (de) 2009-01-15
CN1595632A (zh) 2005-03-16
US6768627B1 (en) 2004-07-27
AU4781300A (en) 2000-12-12
US7209339B2 (en) 2007-04-24
EP1852907A1 (en) 2007-11-07
KR20090100455A (ko) 2009-09-23
KR100933727B1 (ko) 2009-12-24
EP1852907B1 (en) 2013-07-03
DE60037885D1 (de) 2008-03-13
TW508716B (en) 2002-11-01
KR20090003347A (ko) 2009-01-09
EP1191581B1 (en) 2008-01-23
KR20070049689A (ko) 2007-05-11
US20040218340A1 (en) 2004-11-04

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