DE60037885T2 - Methode zur elektrostatischen Anziehung und Verarbeitung eines isolierneden Glassubstrates - Google Patents

Methode zur elektrostatischen Anziehung und Verarbeitung eines isolierneden Glassubstrates Download PDF

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Publication number
DE60037885T2
DE60037885T2 DE60037885T DE60037885T DE60037885T2 DE 60037885 T2 DE60037885 T2 DE 60037885T2 DE 60037885 T DE60037885 T DE 60037885T DE 60037885 T DE60037885 T DE 60037885T DE 60037885 T2 DE60037885 T2 DE 60037885T2
Authority
DE
Germany
Prior art keywords
electrodes
insulating substrate
providing
electrostatic
dielectric layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60037885T
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German (de)
English (en)
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DE60037885D1 (de
Inventor
Tetsuo Kita-kyushu-shi KITABAYASHI
Hiroaki Kita-kyushu-shi HORI
Takeshi Kita-kyushu-shi UCHIMURA
Noriaki Kita-kyushu-shi TATENO
Koh Chigasaki-shi FUWA
Ken Chigasaki-shi MAEHIRA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toto Ltd
Ulvac Inc
Original Assignee
Toto Ltd
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toto Ltd, Ulvac Inc filed Critical Toto Ltd
Publication of DE60037885D1 publication Critical patent/DE60037885D1/de
Application granted granted Critical
Publication of DE60037885T2 publication Critical patent/DE60037885T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • B23Q3/154—Stationary devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
DE60037885T 1999-05-25 2000-05-25 Methode zur elektrostatischen Anziehung und Verarbeitung eines isolierneden Glassubstrates Expired - Lifetime DE60037885T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP14550799A JP3805134B2 (ja) 1999-05-25 1999-05-25 絶縁性基板吸着用静電チャック
JP14550799 1999-05-25
PCT/JP2000/003355 WO2000072376A1 (en) 1999-05-25 2000-05-25 Electrostatic chuck and treating device

Publications (2)

Publication Number Publication Date
DE60037885D1 DE60037885D1 (de) 2008-03-13
DE60037885T2 true DE60037885T2 (de) 2009-01-15

Family

ID=15386861

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60037885T Expired - Lifetime DE60037885T2 (de) 1999-05-25 2000-05-25 Methode zur elektrostatischen Anziehung und Verarbeitung eines isolierneden Glassubstrates

Country Status (9)

Country Link
US (2) US6768627B1 (enExample)
EP (2) EP1852907B1 (enExample)
JP (1) JP3805134B2 (enExample)
KR (4) KR20020019030A (enExample)
CN (3) CN1595631A (enExample)
AU (1) AU4781300A (enExample)
DE (1) DE60037885T2 (enExample)
TW (1) TW508716B (enExample)
WO (1) WO2000072376A1 (enExample)

Families Citing this family (127)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001035907A (ja) 1999-07-26 2001-02-09 Ulvac Japan Ltd 吸着装置
TWI254403B (en) * 2000-05-19 2006-05-01 Ngk Insulators Ltd Electrostatic clamper, and electrostatic attracting structures
JP4697833B2 (ja) * 2000-06-14 2011-06-08 キヤノンアネルバ株式会社 静電吸着機構及び表面処理装置
JP3693895B2 (ja) * 2000-07-24 2005-09-14 住友大阪セメント株式会社 可撓性フィルムの静電吸着装置、可撓性フィルムの静電吸着方法、可撓性フィルムの表面処理方法
JP4156788B2 (ja) * 2000-10-23 2008-09-24 日本碍子株式会社 半導体製造装置用サセプター
JP4548928B2 (ja) * 2000-10-31 2010-09-22 京セラ株式会社 電極内蔵体及びこれを用いたウエハ支持部材
KR100750835B1 (ko) * 2001-01-19 2007-08-22 가부시키가이샤 알박 흡착장치
KR20020064507A (ko) * 2001-02-02 2002-08-09 삼성전자 주식회사 정전 척과 그의 제조방법
KR20020064508A (ko) * 2001-02-02 2002-08-09 삼성전자 주식회사 정전 척
JP2005033221A (ja) * 2001-02-08 2005-02-03 Tokyo Electron Ltd 基板載置台および処理装置
JP2002270681A (ja) * 2001-03-07 2002-09-20 Anelva Corp 基板処理用静電吸着機構
JP4503196B2 (ja) * 2001-03-07 2010-07-14 株式会社アルバック 封着室、パネル保持台及び封着方法
JP3408530B2 (ja) 2001-04-26 2003-05-19 東京エレクトロン株式会社 半導体製造装置用部材およびその製造方法
US6805968B2 (en) 2001-04-26 2004-10-19 Tocalo Co., Ltd. Members for semiconductor manufacturing apparatus and method for producing the same
JP2002345273A (ja) * 2001-05-18 2002-11-29 Toto Ltd 静電チャック
JP2003077994A (ja) * 2001-08-30 2003-03-14 Kyocera Corp 静電チャック及びその製造方法
JP4094262B2 (ja) * 2001-09-13 2008-06-04 住友大阪セメント株式会社 吸着固定装置及びその製造方法
WO2003092064A1 (en) * 2002-04-25 2003-11-06 Tokyo Electron Limited Member for semiconductor manufacturing system and its manufacturing method
US6660665B2 (en) * 2002-05-01 2003-12-09 Japan Fine Ceramics Center Platen for electrostatic wafer clamping apparatus
EP1359469B1 (en) * 2002-05-01 2011-03-02 ASML Netherlands B.V. Chuck, lithographic projection apparatus and device manufacturing method
EP1359466A1 (en) * 2002-05-01 2003-11-05 ASML Netherlands B.V. Chuck, lithographic projection apparatus, method of manufacturing a chuck and device manufacturing method
KR100511854B1 (ko) 2002-06-18 2005-09-02 아네르바 가부시키가이샤 정전 흡착 장치
US7255775B2 (en) 2002-06-28 2007-08-14 Toshiba Ceramics Co., Ltd. Semiconductor wafer treatment member
JP2004228456A (ja) * 2003-01-27 2004-08-12 Canon Inc 露光装置
US7033443B2 (en) * 2003-03-28 2006-04-25 Axcelis Technologies, Inc. Gas-cooled clamp for RTP
US20050042881A1 (en) * 2003-05-12 2005-02-24 Tokyo Electron Limited Processing apparatus
JP3748559B2 (ja) * 2003-06-30 2006-02-22 キヤノン株式会社 ステージ装置、露光装置、荷電ビーム描画装置、デバイス製造方法、基板電位測定方法及び静電チャック
EP1498777A1 (en) * 2003-07-15 2005-01-19 ASML Netherlands B.V. Substrate holder and lithographic projection apparatus
US7072165B2 (en) * 2003-08-18 2006-07-04 Axcelis Technologies, Inc. MEMS based multi-polar electrostatic chuck
US6947274B2 (en) * 2003-09-08 2005-09-20 Axcelis Technologies, Inc. Clamping and de-clamping semiconductor wafers on an electrostatic chuck using wafer inertial confinement by applying a single-phase square wave AC clamping voltage
US7072166B2 (en) * 2003-09-12 2006-07-04 Axcelis Technologies, Inc. Clamping and de-clamping semiconductor wafers on a J-R electrostatic chuck having a micromachined surface by using force delay in applying a single-phase square wave AC clamping voltage
US6905984B2 (en) * 2003-10-10 2005-06-14 Axcelis Technologies, Inc. MEMS based contact conductivity electrostatic chuck
US6946403B2 (en) * 2003-10-28 2005-09-20 Axcelis Technologies, Inc. Method of making a MEMS electrostatic chuck
KR100666039B1 (ko) 2003-12-05 2007-01-10 동경 엘렉트론 주식회사 정전척
JP4636807B2 (ja) * 2004-03-18 2011-02-23 キヤノン株式会社 基板保持装置およびそれを用いた露光装置
JP4684222B2 (ja) * 2004-03-19 2011-05-18 株式会社クリエイティブ テクノロジー 双極型静電チャック
US7595972B2 (en) * 2004-04-09 2009-09-29 Varian Semiconductor Equipment Associates, Inc. Clamp for use in processing semiconductor workpieces
KR101064872B1 (ko) * 2004-06-30 2011-09-16 주성엔지니어링(주) 정전척
US7544251B2 (en) 2004-10-07 2009-06-09 Applied Materials, Inc. Method and apparatus for controlling temperature of a substrate
JP2008027927A (ja) * 2004-10-29 2008-02-07 Shin-Etsu Engineering Co Ltd 真空貼り合わせ装置用静電チャック
CN100382275C (zh) * 2004-10-29 2008-04-16 东京毅力科创株式会社 基板载置台、基板处理装置及基板的温度控制方法
TWI271815B (en) * 2004-11-30 2007-01-21 Sanyo Electric Co Method for processing stuck object and electrostatic sticking method
JP2006332204A (ja) * 2005-05-24 2006-12-07 Toto Ltd 静電チャック
JP4783213B2 (ja) * 2005-06-09 2011-09-28 日本碍子株式会社 静電チャック
US20070139855A1 (en) 2005-12-21 2007-06-21 Asml Netherlands B.V. Lithographic apparatus and method of manufacturing an electrostatic clamp for a lithographic apparatus
US7646581B2 (en) * 2006-01-31 2010-01-12 Sumitomo Osaka Cement Co., Ltd. Electrostatic chuck
JP4707593B2 (ja) * 2006-03-23 2011-06-22 大日本スクリーン製造株式会社 熱処理装置と基板吸着方法
JP4808149B2 (ja) * 2006-03-29 2011-11-02 新光電気工業株式会社 静電チャック
JP5069452B2 (ja) * 2006-04-27 2012-11-07 アプライド マテリアルズ インコーポレイテッド 二重温度帯を有する静電チャックをもつ基板支持体
US8226769B2 (en) 2006-04-27 2012-07-24 Applied Materials, Inc. Substrate support with electrostatic chuck having dual temperature zones
WO2008082977A2 (en) * 2006-12-26 2008-07-10 Saint-Gobain Ceramics & Plastics, Inc. Electrostatic chuck and method of forming
US7983017B2 (en) 2006-12-26 2011-07-19 Saint-Gobain Ceramics & Plastics, Inc. Electrostatic chuck and method of forming
US7385799B1 (en) * 2007-02-07 2008-06-10 Axcelis Technology, Inc. Offset phase operation on a multiphase AC electrostatic clamp
KR101402880B1 (ko) * 2007-02-16 2014-06-03 엘아이지에이디피 주식회사 나뭇가지 형상의 전극 패턴을 가지는 바이폴라 정전척 및이를 이용한 기판 처리 방법
US20080259236A1 (en) * 2007-04-13 2008-10-23 Saint-Gobain Ceramics & Plastics, Inc. Electrostatic dissipative stage and effectors for use in forming lcd products
TW200912051A (en) * 2007-04-16 2009-03-16 Saint Gobain Ceramics & Amp Plastics Inc Process of cleaning a substrate for microelectronic applications including directing mechanical energy through a fluid bath and apparatus of same
JP4976911B2 (ja) * 2007-04-27 2012-07-18 新光電気工業株式会社 静電チャック
US7667944B2 (en) * 2007-06-29 2010-02-23 Praxair Technology, Inc. Polyceramic e-chuck
WO2009019749A1 (ja) * 2007-08-03 2009-02-12 Teoss Co., Ltd. シリコン支持装置およびこれを用いたシリコン加熱急冷装置
TWI475594B (zh) 2008-05-19 2015-03-01 Entegris Inc 靜電夾頭
JP5049891B2 (ja) 2008-06-13 2012-10-17 新光電気工業株式会社 基板温調固定装置
JP5025576B2 (ja) 2008-06-13 2012-09-12 新光電気工業株式会社 静電チャック及び基板温調固定装置
JP2011530833A (ja) * 2008-08-12 2011-12-22 アプライド マテリアルズ インコーポレイテッド 静電チャックアセンブリ
JP4611409B2 (ja) * 2008-09-03 2011-01-12 晃俊 沖野 プラズマ温度制御装置
US8139340B2 (en) * 2009-01-20 2012-03-20 Plasma-Therm Llc Conductive seal ring electrostatic chuck
US8861170B2 (en) 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
SG176059A1 (en) 2009-05-15 2011-12-29 Entegris Inc Electrostatic chuck with polymer protrusions
US8817449B2 (en) * 2010-03-26 2014-08-26 Ulvac, Inc. Substrate holding device
KR101134736B1 (ko) * 2010-04-26 2012-04-13 가부시키가이샤 크리에이티브 테크놀러지 스페이서를 구비하는 정전 척 및 그 제조방법
WO2011149918A2 (en) * 2010-05-28 2011-12-01 Entegris, Inc. High surface resistivity electrostatic chuck
JP5454803B2 (ja) * 2010-08-11 2014-03-26 Ｔｏｔｏ株式会社 静電チャック
CN102487029B (zh) * 2010-12-02 2014-03-19 北京北方微电子基地设备工艺研究中心有限责任公司 静电卡盘和具有它的等离子体装置
US9105705B2 (en) * 2011-03-14 2015-08-11 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
US9869392B2 (en) 2011-10-20 2018-01-16 Lam Research Corporation Edge seal for lower electrode assembly
US9859142B2 (en) 2011-10-20 2018-01-02 Lam Research Corporation Edge seal for lower electrode assembly
JP5993568B2 (ja) * 2011-11-09 2016-09-14 東京エレクトロン株式会社 基板載置システム、基板処理装置、静電チャック及び基板冷却方法
US8902561B2 (en) * 2012-02-02 2014-12-02 Taiwan Semiconductor Manufacturing Co., Ltd. Electrostatic chuck with multi-zone control
US9276504B2 (en) * 2012-03-07 2016-03-01 Ngk Spark Plug Co., Ltd. Carrier device and ceramic member
US9030797B2 (en) * 2012-06-01 2015-05-12 Infineon Technologies Ag Thin substrate electrostatic chuck system and method
JP5975755B2 (ja) 2012-06-28 2016-08-23 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法
KR102032744B1 (ko) * 2012-09-05 2019-11-11 삼성디스플레이 주식회사 기판 고정장치 및 이의 제조방법
JP6016946B2 (ja) * 2012-12-20 2016-10-26 キヤノンアネルバ株式会社 酸化処理装置、酸化方法、および電子デバイスの製造方法
JP6526575B2 (ja) * 2013-02-07 2019-06-05 エーエスエムエル ホールディング エヌ．ブイ． リソグラフィ装置及び方法
KR101986266B1 (ko) * 2013-03-29 2019-06-07 스미토모 오사카 세멘토 가부시키가이샤 정전 척 장치
JP5633766B2 (ja) * 2013-03-29 2014-12-03 Toto株式会社 静電チャック
CN104124127A (zh) * 2013-04-27 2014-10-29 北京北方微电子基地设备工艺研究中心有限责任公司 托盘及等离子体加工设备
WO2015013142A1 (en) 2013-07-22 2015-01-29 Applied Materials, Inc. An electrostatic chuck for high temperature process applications
KR101812666B1 (ko) * 2013-08-05 2017-12-27 어플라이드 머티어리얼스, 인코포레이티드 얇은 기판 취급을 위한 정전 캐리어
KR101876501B1 (ko) 2013-08-05 2018-07-10 어플라이드 머티어리얼스, 인코포레이티드 인-시츄 제거 가능한 정전 척
KR20180110213A (ko) 2013-08-06 2018-10-08 어플라이드 머티어리얼스, 인코포레이티드 국부적으로 가열되는 다-구역 기판 지지부
US10304713B2 (en) 2013-09-20 2019-05-28 Applied Materials, Inc. Substrate carrier with integrated electrostatic chuck
US9460950B2 (en) 2013-12-06 2016-10-04 Applied Materials, Inc. Wafer carrier for smaller wafers and wafer pieces
US9101038B2 (en) 2013-12-20 2015-08-04 Lam Research Corporation Electrostatic chuck including declamping electrode and method of declamping
US10090211B2 (en) 2013-12-26 2018-10-02 Lam Research Corporation Edge seal for lower electrode assembly
JP6219178B2 (ja) * 2014-01-20 2017-10-25 株式会社ディスコ プラズマエッチング装置
CN106165141B (zh) 2014-05-09 2019-01-15 应用材料公司 基板载体系统及使用它的方法
KR20170002603A (ko) 2014-05-09 2017-01-06 어플라이드 머티어리얼스, 인코포레이티드 보호 커버링을 갖는 기판 캐리어 시스템
US10832931B2 (en) 2014-05-30 2020-11-10 Applied Materials, Inc. Electrostatic chuck with embossed top plate and cooling channels
US9959961B2 (en) 2014-06-02 2018-05-01 Applied Materials, Inc. Permanent magnetic chuck for OLED mask chucking
US10002782B2 (en) 2014-10-17 2018-06-19 Lam Research Corporation ESC assembly including an electrically conductive gasket for uniform RF power delivery therethrough
CN104400298B (zh) * 2014-12-15 2017-01-25 天津科信磁性机械有限公司 水冷式磁力模块及其操作方法
US20160230269A1 (en) * 2015-02-06 2016-08-11 Applied Materials, Inc. Radially outward pad design for electrostatic chuck surface
US10332773B2 (en) 2015-06-04 2019-06-25 Applied Materials, Inc. Transparent electrostatic carrier
JP6510461B2 (ja) * 2016-05-25 2019-05-08 日本特殊陶業株式会社 基板保持装置
US10832936B2 (en) * 2016-07-27 2020-11-10 Lam Research Corporation Substrate support with increasing areal density and corresponding method of fabricating
US20180148835A1 (en) * 2016-11-29 2018-05-31 Lam Research Corporation Substrate support with varying depths of areas between mesas and corresponding temperature dependent method of fabricating
KR101871067B1 (ko) * 2016-11-30 2018-06-25 세메스 주식회사 기판을 지지하는 척 모듈 및 이를 구비하는 프로브 스테이션
US11955362B2 (en) * 2017-09-13 2024-04-09 Applied Materials, Inc. Substrate support for reduced damage substrate backside
US10497667B2 (en) 2017-09-26 2019-12-03 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for bond wave propagation control
WO2019187785A1 (ja) * 2018-03-26 2019-10-03 日本碍子株式会社 静電チャックヒータ
KR102427823B1 (ko) * 2018-06-11 2022-07-29 캐논 톡키 가부시키가이샤 정전척 시스템, 성막장치, 흡착방법, 성막방법 및 전자 디바이스의 제조방법
CN108673211B (zh) * 2018-07-27 2020-07-14 上海理工大学 一种装夹装置及使用方法
JP7145042B2 (ja) * 2018-11-08 2022-09-30 東京エレクトロン株式会社 基板支持器及びプラズマ処理装置
US11031273B2 (en) 2018-12-07 2021-06-08 Applied Materials, Inc. Physical vapor deposition (PVD) electrostatic chuck with improved thermal coupling for temperature sensitive processes
CN109449907B (zh) * 2018-12-11 2024-01-12 广东海拓创新技术有限公司 一种透明静电吸盘及其制备方法
TWI748304B (zh) * 2018-12-21 2021-12-01 日商Ｔｏｔｏ股份有限公司 靜電吸盤
CN109881184B (zh) * 2019-03-29 2022-03-25 拓荆科技股份有限公司 具有静电力抑制的基板承载装置
KR102573002B1 (ko) * 2019-06-28 2023-08-30 엔지케이 인슐레이터 엘티디 정전 척
JP7316181B2 (ja) * 2019-10-11 2023-07-27 日本特殊陶業株式会社 静電チャック
JP7370228B2 (ja) * 2019-11-22 2023-10-27 東京エレクトロン株式会社 プラズマ処理装置
JP7580191B2 (ja) * 2019-11-29 2024-11-11 日本特殊陶業株式会社 静電チャック
CN112234015B (zh) * 2020-10-12 2022-05-13 烟台睿瓷新材料技术有限公司 一种同心圆结构的静电吸盘电极图形结构
CN114664723A (zh) * 2020-12-23 2022-06-24 北京华卓精科科技股份有限公司 静电卡盘及其制造方法
TWI804819B (zh) * 2021-02-23 2023-06-11 台灣積體電路製造股份有限公司 移除微粒的方法
CN113903699A (zh) * 2021-09-22 2022-01-07 北京北方华创微电子装备有限公司 静电卡盘及半导体加工设备
KR102654902B1 (ko) * 2021-10-27 2024-04-29 피에스케이 주식회사 지지 유닛 및 이를 포함하는 기판 처리 장치
TWI891529B (zh) * 2024-10-08 2025-07-21 億鴻工業股份有限公司 玻璃基板電鍍夾具

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6059104B2 (ja) * 1982-02-03 1985-12-23 株式会社東芝 静電チヤツク板
JP2665242B2 (ja) * 1988-09-19 1997-10-22 東陶機器株式会社 静電チャック
US4962441A (en) 1989-04-10 1990-10-09 Applied Materials, Inc. Isolated electrostatic wafer blade clamp
JPH03145151A (ja) * 1989-10-31 1991-06-20 Toshiba Corp 静電チャック装置
JPH06737A (ja) * 1991-03-29 1994-01-11 Shin Etsu Chem Co Ltd 静電チャック基板
US5191506A (en) * 1991-05-02 1993-03-02 International Business Machines Corporation Ceramic electrostatic chuck
JPH0563062A (ja) 1991-08-30 1993-03-12 Toto Ltd 静電チヤツク
JP3084869B2 (ja) * 1991-12-10 2000-09-04 東陶機器株式会社 静電チャック
US5684669A (en) * 1995-06-07 1997-11-04 Applied Materials, Inc. Method for dechucking a workpiece from an electrostatic chuck
US5460684A (en) * 1992-12-04 1995-10-24 Tokyo Electron Limited Stage having electrostatic chuck and plasma processing apparatus using same
US5384681A (en) * 1993-03-01 1995-01-24 Toto Ltd. Electrostatic chuck
EP0635870A1 (en) * 1993-07-20 1995-01-25 Applied Materials, Inc. An electrostatic chuck having a grooved surface
US5463526A (en) * 1994-01-21 1995-10-31 Lam Research Corporation Hybrid electrostatic chuck
US5646814A (en) * 1994-07-15 1997-07-08 Applied Materials, Inc. Multi-electrode electrostatic chuck
US5671116A (en) * 1995-03-10 1997-09-23 Lam Research Corporation Multilayered electrostatic chuck and method of manufacture thereof
KR100214438B1 (ko) * 1995-03-17 1999-08-02 히가시 데쓰로 스테이지 장치
US5886863A (en) * 1995-05-09 1999-03-23 Kyocera Corporation Wafer support member
JPH0917770A (ja) * 1995-06-28 1997-01-17 Sony Corp プラズマ処理方法およびこれに用いるプラズマ装置
US5847918A (en) * 1995-09-29 1998-12-08 Lam Research Corporation Electrostatic clamping method and apparatus for dielectric workpieces in vacuum processors
US5838529A (en) 1995-12-22 1998-11-17 Lam Research Corporation Low voltage electrostatic clamp for substrates such as dielectric substrates
JPH09213777A (ja) * 1996-01-31 1997-08-15 Kyocera Corp 静電チャック
US5810933A (en) * 1996-02-16 1998-09-22 Novellus Systems, Inc. Wafer cooling device
US5761023A (en) * 1996-04-25 1998-06-02 Applied Materials, Inc. Substrate support with pressure zones having reduced contact area and temperature feedback
US5745332A (en) * 1996-05-08 1998-04-28 Applied Materials, Inc. Monopolar electrostatic chuck having an electrode in contact with a workpiece
CN1178392A (zh) * 1996-09-19 1998-04-08 株式会社日立制作所 静电吸盘和应用了静电吸盘的样品处理方法及装置
US5958813A (en) * 1996-11-26 1999-09-28 Kyocera Corporation Semi-insulating aluminum nitride sintered body
JP3527823B2 (ja) 1997-01-31 2004-05-17 京セラ株式会社 静電チャック
JPH10242256A (ja) * 1997-02-26 1998-09-11 Kyocera Corp 静電チャック
JPH118291A (ja) * 1997-06-18 1999-01-12 Hitachi Ltd 静電吸着装置
JP3623107B2 (ja) * 1997-07-31 2005-02-23 京セラ株式会社 静電チャック
WO1999025007A1 (en) * 1997-11-06 1999-05-20 Applied Materials, Inc. Multi-electrode electrostatic chuck having fuses in hollow cavities
JPH11163109A (ja) * 1997-12-01 1999-06-18 Kyocera Corp ウエハ保持装置
JP2000323558A (ja) * 1999-05-07 2000-11-24 Nikon Corp 静電吸着装置

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CN1595632A (zh) 2005-03-16
US6768627B1 (en) 2004-07-27
KR20070049689A (ko) 2007-05-11
EP1852907B1 (en) 2013-07-03
KR20090003347A (ko) 2009-01-09
KR20090100455A (ko) 2009-09-23
EP1191581B1 (en) 2008-01-23
KR20020019030A (ko) 2002-03-09
KR100933727B1 (ko) 2009-12-24
DE60037885D1 (de) 2008-03-13
CN1179407C (zh) 2004-12-08
CN1365518A (zh) 2002-08-21
TW508716B (en) 2002-11-01
JP3805134B2 (ja) 2006-08-02
EP1191581A4 (en) 2006-03-22
AU4781300A (en) 2000-12-12
CN100375263C (zh) 2008-03-12
US7209339B2 (en) 2007-04-24
WO2000072376A1 (en) 2000-11-30
JP2000332091A (ja) 2000-11-30
EP1191581A1 (en) 2002-03-27
CN1595631A (zh) 2005-03-16
EP1852907A1 (en) 2007-11-07

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