DE69904709T2 - Elektrostatische klemmvorrichtung zur halterung eines wafers, die eine niedrige partikelverschmutzung aufweist - Google Patents

Elektrostatische klemmvorrichtung zur halterung eines wafers, die eine niedrige partikelverschmutzung aufweist

Info

Publication number
DE69904709T2
DE69904709T2 DE69904709T DE69904709T DE69904709T2 DE 69904709 T2 DE69904709 T2 DE 69904709T2 DE 69904709 T DE69904709 T DE 69904709T DE 69904709 T DE69904709 T DE 69904709T DE 69904709 T2 DE69904709 T2 DE 69904709T2
Authority
DE
Germany
Prior art keywords
wafer
holding
clamping device
electrostatic clamping
low particulate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69904709T
Other languages
English (en)
Other versions
DE69904709D1 (de
Inventor
Kenji Larsen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Semiconductor Equipment Associates Inc
Original Assignee
Varian Semiconductor Equipment Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Semiconductor Equipment Associates Inc filed Critical Varian Semiconductor Equipment Associates Inc
Publication of DE69904709D1 publication Critical patent/DE69904709D1/de
Application granted granted Critical
Publication of DE69904709T2 publication Critical patent/DE69904709T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means
DE69904709T 1998-04-10 1999-04-08 Elektrostatische klemmvorrichtung zur halterung eines wafers, die eine niedrige partikelverschmutzung aufweist Expired - Fee Related DE69904709T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/058,944 US5969934A (en) 1998-04-10 1998-04-10 Electrostatic wafer clamp having low particulate contamination of wafers
PCT/US1999/007752 WO1999053603A1 (en) 1998-04-10 1999-04-08 Electrostatic wafer clamp having low particulate contamination of wafers

Publications (2)

Publication Number Publication Date
DE69904709D1 DE69904709D1 (de) 2003-02-06
DE69904709T2 true DE69904709T2 (de) 2003-11-13

Family

ID=22019869

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69904709T Expired - Fee Related DE69904709T2 (de) 1998-04-10 1999-04-08 Elektrostatische klemmvorrichtung zur halterung eines wafers, die eine niedrige partikelverschmutzung aufweist

Country Status (7)

Country Link
US (1) US5969934A (de)
EP (1) EP1070381B1 (de)
JP (1) JP2002511662A (de)
KR (1) KR100625712B1 (de)
DE (1) DE69904709T2 (de)
TW (1) TW410414B (de)
WO (1) WO1999053603A1 (de)

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US7948734B2 (en) * 2008-09-11 2011-05-24 Tel Epion Inc. Electrostatic chuck power supply
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US8861170B2 (en) 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
KR20120116923A (ko) * 2009-11-30 2012-10-23 램 리써치 코포레이션 각진 측벽을 가진 정전 척
US8840754B2 (en) * 2010-09-17 2014-09-23 Lam Research Corporation Polar regions for electrostatic de-chucking with lift pins
US9633885B2 (en) * 2014-02-12 2017-04-25 Axcelis Technologies, Inc. Variable electrode pattern for versatile electrostatic clamp operation
JP6497761B2 (ja) 2015-02-23 2019-04-10 エム キューブド テクノロジーズ，インコーポレーテッドＭ Ｃｕｂｅｄ Ｔｅｃｈｎｏｌｏｇｉｅｓ， Ｉｎｃ． 静電チャック用薄膜電極
JP7111727B2 (ja) * 2017-01-27 2022-08-02 ビーコ インストゥルメント インク 基板バイアスａｌｄ用電気絶縁改善チャックシステムおよび方法

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Also Published As

Publication number Publication date
KR100625712B1 (ko) 2006-09-20
US5969934A (en) 1999-10-19
DE69904709D1 (de) 2003-02-06
WO1999053603A1 (en) 1999-10-21
EP1070381B1 (de) 2003-01-02
KR20010042592A (ko) 2001-05-25
JP2002511662A (ja) 2002-04-16
TW410414B (en) 2000-11-01
EP1070381A1 (de) 2001-01-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee