JP4808149B2 - 静電チャック - Google Patents
静電チャック Download PDFInfo
- Publication number
- JP4808149B2 JP4808149B2 JP2006341355A JP2006341355A JP4808149B2 JP 4808149 B2 JP4808149 B2 JP 4808149B2 JP 2006341355 A JP2006341355 A JP 2006341355A JP 2006341355 A JP2006341355 A JP 2006341355A JP 4808149 B2 JP4808149 B2 JP 4808149B2
- Authority
- JP
- Japan
- Prior art keywords
- electrostatic chuck
- dielectric layer
- elastic layer
- adsorption
- adsorbed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
また、弾性層の比抵抗は1013Ω・cm以下が好ましく、それにより被吸着物の電荷を容易に放出可能として、速やかな離脱性と、電荷の蓄積によるセルやデバイスの破壊防止を実現することができる。
12 誘電層
14a、14b、14’ 電極
16 弾性層
18 架台
20a、20b、20’ 給電部
22 吸着面
Claims (6)
- 被吸着物を吸着する吸着面を有するとともに被吸着物の表面凹凸に追随して変形する誘電層、誘電層の変形を可能にする弾性層、及び誘電層の吸着面と弾性層との間に位置する、吸着に必要な静電荷を発生させるための電極を含み、弾性層の材料はシリコーンゴムであり、電極と弾性層との接着及び電極と誘電層との接着がシリコーン系接着剤でなされていることを特徴とする静電チャック。
- 誘電層が有機樹脂材料製である、請求項1記載の静電チャック。
- 有機樹脂材料の比誘電率が2以上である、請求項2記載の静電チャック。
- 有機樹脂材料がポリエステルである、請求項3記載の静電チャック。
- 弾性層材料のショアーA硬さが55以上である、請求項1から4までのいずれか1つに記載の静電チャック。
- 弾性層の比抵抗が1013Ω・cm以下である、請求項1から5までのいずれか1つに記載の静電チャック。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006341355A JP4808149B2 (ja) | 2006-03-29 | 2006-12-19 | 静電チャック |
KR1020070029275A KR20070098566A (ko) | 2006-03-29 | 2007-03-26 | 정전 척 |
TW096110483A TW200800478A (en) | 2006-03-29 | 2007-03-27 | Electrostatic chuck |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006090717 | 2006-03-29 | ||
JP2006090717 | 2006-03-29 | ||
JP2006341355A JP4808149B2 (ja) | 2006-03-29 | 2006-12-19 | 静電チャック |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007294852A JP2007294852A (ja) | 2007-11-08 |
JP2007294852A5 JP2007294852A5 (ja) | 2009-11-05 |
JP4808149B2 true JP4808149B2 (ja) | 2011-11-02 |
Family
ID=38765131
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006341355A Active JP4808149B2 (ja) | 2006-03-29 | 2006-12-19 | 静電チャック |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4808149B2 (ja) |
KR (1) | KR20070098566A (ja) |
TW (1) | TW200800478A (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010182866A (ja) * | 2009-02-05 | 2010-08-19 | Nikon Corp | 静電吸着保持装置、露光装置、露光方法及びデバイスの製造方法 |
JP5846186B2 (ja) * | 2010-01-29 | 2016-01-20 | 住友大阪セメント株式会社 | 静電チャック装置および静電チャック装置の製造方法 |
TWI560803B (en) * | 2014-06-13 | 2016-12-01 | Mobile electrostatic chuck and manufacturing method of the same | |
DE102015210736B3 (de) * | 2015-06-11 | 2016-10-27 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung mit folie zum elektrostatischen koppeln eines substrats mit einem substratträger |
JP6642170B2 (ja) * | 2016-03-23 | 2020-02-05 | 住友大阪セメント株式会社 | 静電チャック装置及びその製造方法 |
JP6808979B2 (ja) * | 2016-06-01 | 2021-01-06 | 株式会社リコー | 入力素子及び入力装置 |
US10899605B2 (en) * | 2018-03-05 | 2021-01-26 | Sharp Kabushiki Kaisha | MEMS device and manipulation method for micro-objects |
KR102093991B1 (ko) * | 2018-08-31 | 2020-04-23 | 이지스코 주식회사 | 고무 탄성체 다이아프램 타입 정전척 및 그 제조방법 |
KR102292501B1 (ko) * | 2019-01-24 | 2021-08-23 | 김순훈 | 정전척 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0422153A (ja) * | 1990-05-17 | 1992-01-27 | Tokyo Electron Ltd | 静電吸着装置 |
JP3805134B2 (ja) * | 1999-05-25 | 2006-08-02 | 東陶機器株式会社 | 絶縁性基板吸着用静電チャック |
JP3599634B2 (ja) * | 2000-04-10 | 2004-12-08 | 信越化学工業株式会社 | イオン注入機用静電チャック |
JP4684222B2 (ja) * | 2004-03-19 | 2011-05-18 | 株式会社クリエイティブ テクノロジー | 双極型静電チャック |
-
2006
- 2006-12-19 JP JP2006341355A patent/JP4808149B2/ja active Active
-
2007
- 2007-03-26 KR KR1020070029275A patent/KR20070098566A/ko not_active Application Discontinuation
- 2007-03-27 TW TW096110483A patent/TW200800478A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20070098566A (ko) | 2007-10-05 |
TW200800478A (en) | 2008-01-01 |
JP2007294852A (ja) | 2007-11-08 |
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