JP2501504C - - Google Patents

Info

Publication number

JP2501504C

JP2501504C JP2501504C JP 2501504 C JP2501504 C JP 2501504C JP 2501504 C JP2501504 C JP 2501504C

Authority

JP

Japan

Prior art keywords

dielectric layer

electrode

electrostatic chuck

insulating dielectric

wafer

Prior art date

1998-01-21

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired - Lifetime

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• 239000000919 ceramic Substances 0.000 claims description 33
• 238000010438 heat treatment Methods 0.000 claims description 31
• 239000011148 porous material Substances 0.000 claims description 22
• 229910052581 Si3N4 Inorganic materials 0.000 claims description 16
• HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 16
• 239000000758 substrate Substances 0.000 claims description 6
• LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 4
• CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 4
• PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
• 239000003990 capacitor Substances 0.000 claims description 2
• PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
• 239000000395 magnesium oxide Substances 0.000 claims description 2
• 229910052596 spinel Inorganic materials 0.000 claims description 2
• 239000011029 spinel Substances 0.000 claims description 2
• 229910010293 ceramic material Inorganic materials 0.000 claims 1
• 239000004065 semiconductor Substances 0.000 description 35
• 229910001220 stainless steel Inorganic materials 0.000 description 10
• 239000010935 stainless steel Substances 0.000 description 10
• 239000000463 material Substances 0.000 description 8
• 238000004519 manufacturing process Methods 0.000 description 7
• 230000007423 decrease Effects 0.000 description 5
• 238000000034 method Methods 0.000 description 5
• 238000012545 processing Methods 0.000 description 4
• 229920001721 polyimide Polymers 0.000 description 3
• 238000001179 sorption measurement Methods 0.000 description 3
• 239000002156 adsorbate Substances 0.000 description 2
• 230000015572 biosynthetic process Effects 0.000 description 2
• 230000015556 catabolic process Effects 0.000 description 2
• 238000004140 cleaning Methods 0.000 description 2
• 230000000052 comparative effect Effects 0.000 description 2
• 239000003989 dielectric material Substances 0.000 description 2
• 239000012528 membrane Substances 0.000 description 2
• BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
• 238000004544 sputter deposition Methods 0.000 description 2
• 238000002230 thermal chemical vapour deposition Methods 0.000 description 2
• 238000012546 transfer Methods 0.000 description 2
• 238000007088 Archimedes method Methods 0.000 description 1
• ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
• YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
• ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
• 238000005299 abrasion Methods 0.000 description 1
• 229910052801 chlorine Inorganic materials 0.000 description 1
• 239000000460 chlorine Substances 0.000 description 1
• 238000011109 contamination Methods 0.000 description 1
• 238000000151 deposition Methods 0.000 description 1
• 230000008021 deposition Effects 0.000 description 1
• 238000005530 etching Methods 0.000 description 1
• 238000002474 experimental method Methods 0.000 description 1
• 229910052731 fluorine Inorganic materials 0.000 description 1
• 239000011737 fluorine Substances 0.000 description 1
• 238000007689 inspection Methods 0.000 description 1
• 238000011089 mechanical engineering Methods 0.000 description 1
• 229910052750 molybdenum Inorganic materials 0.000 description 1
• 239000011733 molybdenum Substances 0.000 description 1
• 239000002245 particle Substances 0.000 description 1
• 230000002093 peripheral effect Effects 0.000 description 1
• 229910052697 platinum Inorganic materials 0.000 description 1
• 238000011160 research Methods 0.000 description 1
• 238000002791 soaking Methods 0.000 description 1
• WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical group [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
• 229910052721 tungsten Inorganic materials 0.000 description 1
• 239000010937 tungsten Substances 0.000 description 1