JP2000077723A - 発光半導体を備えた半導体装置 - Google Patents

発光半導体を備えた半導体装置

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Publication number
JP2000077723A
JP2000077723A JP24190199A JP24190199A JP2000077723A JP 2000077723 A JP2000077723 A JP 2000077723A JP 24190199 A JP24190199 A JP 24190199A JP 24190199 A JP24190199 A JP 24190199A JP 2000077723 A JP2000077723 A JP 2000077723A
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Japan
Prior art keywords
semiconductor
light
fluorescent material
layer
led
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JP4562828B2 (ja
JP2000077723A5 (ja
Inventor
Christopher Haydn Lowery
クリストファー・ハイドン・ロウリー
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HP Inc
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Hewlett Packard Co
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

(57)【要約】 【課題】一定して均一な白色光を生じる白色光ＬＥＤを
得る。 【解決手段】透明スペーサによって、ＬＥＤを蛍光材料
から分離する。

Description

【発明の詳細な説明】
【０００１】
【発明の属する技術分野】本発明は、一般に、発光ダイ
オードに関するものであり、とりわけ、蛍光材料(fluor
escent material)を利用する発光ダイオードに関するも
のである。
【０００２】
【従来の技術】現在、青色の発光ダイオードすなわちＬ
ＥＤは、白色光を放出するＬＥＤデバイスを得るため、
蛍光材料と組み合わせて用いられている。白色光は、一
般に、波長が４００〜６００ナノメートル（ｎｍ）の範
囲にわたって均一であるが、赤色、青色、及び、緑色の
組み合わせとして生じる光は、やはり白色に見える。Ｌ
ＥＤにインジウム・ガリウム窒化物を用いることによっ
て、強い青色光を生じることが可能である。一般に、よ
り強度の低い赤色及び緑色光、及び、より強度の高い青
色光を発生する蛍光物質(phosphor)を用いることによっ
て、白色に見える強い光を発生することが可能である。
基本的に、４７０ｎｍの青色光の大部分は、蛍光材料中
の蛍光物質にぶつかって、アップシフトされ(up-shifte
d)、二次緑色及び赤色光が、蛍光物質を通って脱出する
残りの青色光を補うことになる。これによって、人間の
目に白色に見える光の最終的組み合わせが得られる。
【０００３】あいにく、青色ＬＥＤ上に層をなす蛍光材
料を利用する従来のアプローチでは、明るい白色の中心
部が、黄色の環状リング、それに続く青色の環状リン
グ、それに続く黄色の最終環状リングで包囲された、Ｌ
ＥＤが得られることが分かっている。これらの環状リン
グは、必ずしも、ＬＥＤ毎に予測可能に生じるとは限ら
ないので、比較的均一な白色光を生じるＬＥＤもあれ
ば、環状リングに変動を生じるＬＥＤもある。
【０００４】これらのリングの原因を確認するのは困難
であり、従って、この問題を解決する方法を決定するの
は困難であった。顧客は、白色からの偏差（逸脱）をＬ
ＥＤの欠陥とみなすので、品質管理において、多数のＬ
ＥＤを廃棄しなければならない。
【０００５】以上の問題は、ＬＥＤランプ並びに表面実
装(surface-mount)ＬＥＤ灯の両方に生じる。
【０００６】
【発明が解決しようとする課題】本発明の目的は、上述
の問題点を解決し、一定して均一な白色光ＬＥＤが得ら
れるようにすることにある。
【０００７】
【課題を解決するための手段】本半導体灯は、透明スペ
ーサによって被われた発光ダイオードを備えている。蛍
光材料がより均一に照明されて、一定して均一な白色光
ＬＥＤが得られるように、透明スペーサによって、ＬＥ
Ｄが蛍光材料から分離されている。これによって、黄色
及び／または青色光を放出する、白色半導体灯に関する
前者の問題が解消される。
【０００８】本発明の利点については、当該技術者に
は、添付の図面と関連づけて考察すれば、以下の詳細な
説明を読むことによって明らかになるであろう。
【０００９】
【発明の実施の形態】次に、図１（先行技術）を参照す
ると、発光ダイオード（ＬＥＤ）・ランプが示されてい
る。ＬＥＤランプ１０は、ＬＥＤランプ１０に電力を供
給する第１と第２の端子、または、リード・フレーム１
２及び１４を備えている。リード・フレーム１２は、Ｌ
ＥＤ１８が配置された凹型反射領域１６を備えている。
ＬＥＤは、透明なサファイア基板上のインジウムをドー
プした(indium-doped)窒化ガリウムのエピタキシャル層
から造られている。適正な順電圧での直流電流によって
作動させると、インジウムをドープした窒化ガリウムの
ＬＥＤの上部表面には、波長が約４７０ｎｍの青色光が
生じる。
【００１０】ＬＥＤ１８は、ワイヤ・ボンド２０によっ
てリード・フレーム１２に接続され、ワイヤ・ボンド２
２によってリード・フレーム１４に接続されている。Ｌ
ＥＤ１８上には蛍光材料２４の層が配置されている。蛍
光材料２４は、一般に、ＹＡＧ／Ｇｄ：Ｃｅ蛍光物質の
粒子を含む透明なエポキシ樹脂である。アセンブリ全体
が、透明なカプセル封止(encapsulation)エポキシ樹脂
２６に埋め込まれている。
【００１１】図１（先行技術）には、環状青色リングの
光線を表した矢印２８及び３０も示されている。矢印３
２及び３４は、外側環状リングの光線を表し、矢印３６
及び３８は、内側黄色環状リングを表している。
【００１２】次に図２（先行技術）を参照すると、ＬＥ
Ｄ１８を保持するカップを形成する反射部分１６を備え
た、リード・フレーム１２が示されている。薄い領域４
０及び４２とより厚い領域４４を備えた蛍光材料２４の
層が、さらに拡大して示されている。簡略化のため、最
終的なカプセル封止エポキシ樹脂２６は示されていな
い。
【００１３】次に図３を参照すると、ＬＥＤ１８を保持
するリフレクタ１６を備えたリード・フレーム１２が示
されている。先行技術と同様の部品は、同じ番号で示さ
れている。ＬＥＤ１８をカプセル封止する透明なスペー
サ５０が示されており、透明スペーサ５０よりある高さ
だけ上方に配置された蛍光材料５２が示されている。最
終的なカプセル封止エポキシ樹脂２６は、簡略化のため
示されていない。
【００１４】次に図４を参照すると、表面実装装置の装
置基板６２に配置された表面実装ＬＥＤ灯６０が示され
ている。ＬＥＤ６０が、透明スペーサ６４にカプセル封
止されており、透明スペーサ６４は、さらに、蛍光材料
の層６６及び最終的な透明カプセル封止層６８によって
被われている。
【００１５】動作時、図１のＬＥＤランプ１０（先行技
術）は、ＬＥＤのどの部分がｐ接合で、どの部分がｎ接
合であるかに従って、リード・フレーム１２または１４
に電力が給与される。電力が給与されると、ＬＥＤ１８
の上部は、強い青色光を放出する。領域４４に、適正な
厚さの蛍光材料が与えられると、約４７０ｎｍの青色光
と、それぞれ、５００ｎｍと５５０ｎｍの緑色及び赤色
蛍光が適正に組み合わせられて、白色光が生じることに
なる。
【００１６】図２（先行技術）に示す領域４０及び４２
において、蛍光材料の層が比較的薄い場合、蛍光物質か
らの光の影響が不十分であるため、青色光は、一般に、
光線のライン２８及び３０に沿って青色環状リングを生
じることになる。環状青色リングの内側及び外側には、
光線３２及び３４と光線３６及び３８による黄色環状リ
ングが生じるが、この場合、蛍光物質は光の一部に影響
を及ぼすものの、均一な白色光を生じさせるには不十分
である。
【００１７】ＬＥＤ１８上の材料２４の表面張力によっ
て、ＬＥＤ１８のコーナに近い領域４０及び４２の厚さ
から、ＬＥＤの中心の上方における領域４４の厚さに及
ぶ、さまざまな厚さの領域が生じる。この結果、青色光
の不均一な再放射及び前述の環状リングが生じる。これ
は、蛍光材料２４の層が、ＬＥＤ１８の上及びまわりに
配置されている場合に固有のように思われる。
【００１８】図３に示す本発明の場合、ＬＥＤ１８の上
及びまわりに透明スペーサ５０を堆積させ、ＬＥＤ１８
からほぼ均一な厚さの蛍光材料の層５２を分離すること
によって、環状リングが排除されることが確認された。
また、蛍光材料の層５２がＬＥＤの上方で均一な厚さに
なるように、透明スペーサ５０とＬＥＤ１８の上部をち
ょうど同じ高さにすることも可能であり、これによっ
て、やはりこの問題が解消されることが確認されてい
る。しかし、この後者のアプローチは、円錐状反射領域
１６によって形成されるカップにおける透明スペーサ５
０のより慎重な体積配分が必要とされる。
【００１９】図４に示す表面実装ＬＥＤ灯の場合、表面
張力（ＬＥＤ１８のサイズでは、重力に比べて大きい）
と粘性の組み合わせを利用して、半球形一杯分の透明な
紫外線（ＵＶ）硬化樹脂をＬＥＤ１８の上に滴下させ、
透明スペーサ６０を形成することが可能である。この樹
脂は、全てのコーナを被覆し、その後、ＵＶ光を利用し
て硬化させられる。これに、やはり、粘性のＵＶ硬化樹
脂である、蛍光材料の層６６が後続する。透明スペーサ
６４の堆積によって、液滴としての半球が生じ、次に、
蛍光材料の層６６が流れて、透明スペーサ６４の半球形
状と同じ形状になり、最終カプセル封止６８及び硬化の
前に、硬化する。蛍光材料の層６６は、厚さが均一にな
るので、環状リングの問題は生じない。
【００２０】熱硬化性による粘性が通常の滴下では、小
さいサイズにもかかわらず、ほとんどの樹脂、通常エポ
キシ、がＬＥＤ１８から流れ出てしまうので、ＵＶ硬化
のような高速硬化を行うことが必要になる。その後で、
最終カプセル封止層６８を堆積させることが可能にな
る。
【００２１】特定の最良の態様に関連して、本発明の解
説を行ってきたが、もちろん、当該技術者には、以上の
説明に鑑みて、多くの代替、修正、及び、変更案が明ら
かになるであろう。従って、それは、付属の請求項の精
神及び範囲内にあるこうした全ての代替、修正、及び、
変更案を包含することを意図したものである。本明細書
に記載され、添付の図面に示された全ての事項は、例証
を意味するものであって、制限を意味するものではない
と解釈すべきである。
【００２２】以上、本発明の実施例について詳述した
が、以下、本発明の各実施態様の例を示す。
【００２３】（実施態様１）半導体装置であって、発光
半導体（１８、６０）と、前記発光半導体（１８、６
０）のまわりに配置された透明スペーサ（５０、６４）
と、前記発光半導体（１８、６０）及び前記透明スペー
サ（５０、６４）の上に配置された蛍光材料を含む層
（５２、６６）と、前記発光半導体（１８、６０）に接
続されて、前記発光半導体に付勢し、発光させる入力端
子（１２、１４、６２）とを有する半導体装置。
【００２４】（実施態様２）前記透明スペーサ（５０、
６４）が、前記発光半導体（１８、６０）の上に配置さ
れることと、前記蛍光材料を含む層（５２、６６）が、
前記透明スペーサ（５０、６４）によって、前記発光半
導体（１８、６０）から間隔をあけて配置されることを
特徴とする、実施態様１に記載の半導体装置。
【００２５】（実施態様３）前記蛍光材料を含む層（６
６、５２）の上に配置された保護層（６８、２６）が含
まれることを特徴とする、実施態様１に記載の半導体装
置。
【００２６】（実施態様４）前記入力端子（１２）の１
つが、前記発光半導体（１８）のリフレクタ（１６）を
形成することを特徴とする、実施態様１に記載の半導体
装置。
【００２７】（実施態様５）前記発光半導体（１８、６
０）が、前記蛍光材料を含む層（５２、６６）によって
部分的に別の波長に変換され、所定の波長の光を放出す
ることを特徴とする、実施態様１に記載の半導体装置。
【００２８】（実施態様６）前記発光半導体（１８、６
０）が、青色光を放出することと、前記蛍光材料を含む
層（５２、６６）に、前記青色光の大部分に反応して、
前記青色光の残りの部分と結合可能な光を発生し、それ
によって白色光が得られるようにする蛍光物質が含まれ
ていることとを特徴とする実施態様１に記載の半導体装
置。
【００２９】（実施態様７）半導体装置であって、発光
ダイオードと、前記発光ダイオードのまわりに配置され
た透明なカプセル封止樹脂と、前記発光ダイオード及び
前記透明なカプセル封止樹脂の上に配置された蛍光材料
を含む樹脂と、前記発光ダイオードに接続されて、前記
発光ダイオードに付勢し、発光させる入力端子とを有す
る半導体装置。
【００３０】（実施態様８）前記透明なカプセル封止樹
脂が、前記発光ダイオードの上に配置されることと、前
記蛍光材料を含む前記樹脂が、前記透明なカプセル封止
樹脂によって、前記発光ダイオードから間隔をあけて配
置されることと、前記蛍光材料を含む前記樹脂が、ほぼ
均一な厚さであることとを特徴とする、実施態様７に記
載の半導体装置。
【００３１】（実施態様９）前記蛍光材料を含む前記樹
脂の上に配置された保護樹脂層が含まれることを特徴と
する、実施態様７に記載の半導体装置。
【００３２】（実施態様１０）前記入力端子の１つが、
前記発光ダイオード用のリフレクタ、及び、前記樹脂用
のカップを形成することを特徴とする、実施態様７に記
載の半導体装置。
【００３３】（実施態様１１）前記発光ダイオードを配
置し、前記樹脂を滴下した装置基板が含まれていること
を特徴とする、実施態様７に記載の半導体装置。
【００３４】（実施態様１２）前記発光ダイオードが、
前記蛍光材料によって部分的に別の波長に変換されて、
均一な白色光を生じることになる、所定の波長の光を放
出することを特徴とする、実施態様７に記載の半導体装
置。
【００３５】（実施態様１３）前記発光ダイオードが、
青色光を放出することと、前記蛍光材料に、前記青色光
に反応して、緑色光を生じる第１の蛍光物質と、前記青
色光に反応して、赤色光を生じる第２の蛍光物質が含ま
れていることと、前記蛍光材料が、それを通る前記青色
光、及び、それから放出される前記赤色及び前記緑色光
から白に見える光を生じることを特徴とする、実施態様
７に記載の半導体装置。
【００３６】（実施態様１４）半導体装置であって、サ
ファイア基板と、前記サファイア層の上に配置されて、
発光ダイオードを形成する、インジウムをドープした窒
化ガリウムのエピタキシャル層と、前記サファイア基板
のまわりに配置された透明なカプセル封止樹脂と、前記
エピタキシャル層の上に配置される樹脂及び前記透明な
カプセル封止樹脂を含むＹＡＧ／Ｇｄ：Ｃｅ蛍光物質
と、前記エピタキシャル層に接続されて、前記エピタキ
シャル層に付勢し、光を放出させる入力端子が含まれて
いる、半導体装置。
【００３７】（実施態様１５）前記透明なカプセル封止
樹脂が、前記エピタキシャル層の上に配置され、樹脂を
含む前記蛍光物質が、前記透明なカプセル封止樹脂によ
って前記エピタキシャル層から間隔をあけて配置される
ことを特徴とする、実施態様１４に記載の半導体装置。
【００３８】（実施態様１６）前記蛍光物質を含む樹脂
の上に配置された保護層が含まれることを特徴とする、
実施態様１４に記載の半導体装置。
【００３９】（実施態様１７）前記入力端子の１つが、
前記サファイア基板上において前記エピタキシャル層用
のリフレクタを形成することを特徴とする、実施態様１
４に記載の半導体装置。
【００４０】（実施態様１８）前記サファイア基板を配
置した装置基板が含まれることを特徴とする、実施態様
１４に記載の半導体装置。
【００４１】（実施態様１９）前記エピタキシャル層
が、前記蛍光物質を含む樹脂によって部分的に別の波長
に変換されて、均一な白に見える光を生じることにな
る、所定の波長の光を放出することを特徴とする、実施
態様１４に記載の半導体装置。
【００４２】（実施態様２０）前記エピタキシャル層
が、青色光を生じることと、前記ＹＡＧ／Ｇｄ：Ｃｅ蛍
光物質を含む樹脂が、前記青色光の大部分に反応して、
緑色及び赤色光を放出することと、前記ＹＡＧ／Ｇｄ：
Ｃｅ蛍光物質を含む樹脂が、それから放出される前記緑
色及び赤色光と、それを通る前記残りの青色光から白に
見える光を生じることを特徴とする、実施態様１４に記
載の半導体装置。
【００４３】
【発明の効果】以上のように、本発明を用いると、透明
スペーサによって被われた発光ダイオードを備えている
ので、蛍光材料がより均一に照明され、一定して均一な
白色光ＬＥＤが得られる。これによって、黄色及び／ま
たは青色光を放出する、白色半導体灯に関する問題が解
消される。
【図面の簡単な説明】
【図１】従来のＬＥＤランプの断面図である。
【図２】先行技術によるＬＥＤ及びそのカプセル封止シ
ステムの拡大図である。
【図３】本発明のカプセル封止システムを備えたＬＥＤ
の拡大図である。
【図４】本発明のカプセル封止システムを利用した、表
面実装装置におけるＬＥＤの拡大図である。
【符号の説明】
１０：ＬＥＤランプ １２、１４：リード・フレーム １６：凹型反射領域 １８：ＬＥＤ ２０、２２：ワイヤ・ボンド ２４：蛍光材料 ２６：カプセル封止エポキシ樹脂 ２８、３０：環状青色リングの光線 ３２、３４：外側黄色環状リングの光線 ３６、３８：内側黄色環状リングの光線 ４０、４２：薄い領域 ４４：厚い領域 ５０：透明スペーサ ５２：蛍光材料 ６０：ＬＥＤ ６２：表面実装装置の装置基板 ６４：透明スペーサ ６６：蛍光材料の層 ６８：カプセル封止層

Claims (1)

    【特許請求の範囲】
  1. 【請求項１】半導体装置であって、 発光半導体と、 前記発光半導体のまわりに配置された透明スペーサと、 前記発光半導体及び前記透明スペーサの上に配置された
    蛍光材料を含む層と、 前記発光半導体に接続されて、前記発光半導体に付勢
    し、発光させる入力端子とを有する半導体装置。
JP24190199A 1998-09-01 1999-08-27 発光半導体を備えた半導体装置 Expired - Lifetime JP4562828B2 (ja)

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US09/144,744 US5959316A (en) 1998-09-01 1998-09-01 Multiple encapsulation of phosphor-LED devices
US144,744 1998-09-01

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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002084002A (ja) * 2000-09-06 2002-03-22 Nippon Leiz Co Ltd 光源装置
JP2002222996A (ja) * 2001-01-24 2002-08-09 Rohm Co Ltd Ｌｅｄ装置
JP2002252376A (ja) * 2001-02-23 2002-09-06 Seiwa Electric Mfg Co Ltd 表面実装型発光ダイオード及びその製造方法
JP2004087812A (ja) * 2002-08-27 2004-03-18 Sanyo Electric Co Ltd 発光体
JP2004288760A (ja) * 2003-03-20 2004-10-14 Stanley Electric Co Ltd 多層ｌｅｄ
EP1589591A2 (en) 2004-04-23 2005-10-26 Stanley Electric Co., Ltd. Semiconductor light emitting device and method of manufacturing the same
JP2006202962A (ja) * 2005-01-20 2006-08-03 Toyoda Gosei Co Ltd 発光装置
US7105857B2 (en) 2002-07-08 2006-09-12 Nichia Corporation Nitride semiconductor device comprising bonded substrate and fabrication method of the same
JP2007504972A (ja) * 2003-09-09 2007-03-08 クリー　インコーポレイテッド 燐光体を内部に分散させた透明なプラスチック製シェル（ｓｈｅｌｌ）を具備する透過型光学要素およびその製造方法
US7301175B2 (en) 2001-10-12 2007-11-27 Nichia Corporation Light emitting apparatus and method of manufacturing the same
WO2008105428A1 (ja) 2007-02-27 2008-09-04 Kyocera Corporation 発光装置
JP2010161423A (ja) * 1998-09-01 2010-07-22 Philips Lumileds Lightng Co Llc 発光半導体を備えた半導体装置
JP2012134564A (ja) * 2004-09-10 2012-07-12 Seoul Semiconductor Co Ltd 発光素子及びその製造方法
US8294160B2 (en) 2005-01-20 2012-10-23 Toyoda Gosei Co., Ltd. Light emitting device including a sealing portion, and method of making the same
JP2013202305A (ja) * 2012-03-29 2013-10-07 Olympus Medical Systems Corp 光源装置

Families Citing this family (557)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6600175B1 (en) * 1996-03-26 2003-07-29 Advanced Technology Materials, Inc. Solid state white light emitter and display using same
DE19638667C2 (de) * 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
BRPI9715293B1 (pt) 1996-06-26 2016-11-01 Osram Ag elemento de cobertura para um elemento de construção optoeletrônico
TW383508B (en) * 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
US6613247B1 (en) 1996-09-20 2003-09-02 Osram Opto Semiconductors Gmbh Wavelength-converting casting composition and white light-emitting semiconductor component
US6441943B1 (en) 1997-04-02 2002-08-27 Gentex Corporation Indicators and illuminators using a semiconductor radiation emitter package
EP1014455B1 (en) 1997-07-25 2006-07-12 Nichia Corporation Nitride semiconductor device
US6022124A (en) * 1997-08-19 2000-02-08 Ppt Vision, Inc. Machine-vision ring-reflector illumination system and method
US20030133292A1 (en) 1999-11-18 2003-07-17 Mueller George G. Methods and apparatus for generating and modulating white light illumination conditions
US7161313B2 (en) * 1997-08-26 2007-01-09 Color Kinetics Incorporated Light emitting diode based products
US7014336B1 (en) 1999-11-18 2006-03-21 Color Kinetics Incorporated Systems and methods for generating and modulating illumination conditions
US6469322B1 (en) 1998-02-06 2002-10-22 General Electric Company Green emitting phosphor for use in UV light emitting diodes
US6252254B1 (en) * 1998-02-06 2001-06-26 General Electric Company Light emitting device with phosphor composition
JP3785820B2 (ja) * 1998-08-03 2006-06-14 豊田合成株式会社 発光装置
US6335548B1 (en) 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
US6404125B1 (en) 1998-10-21 2002-06-11 Sarnoff Corporation Method and apparatus for performing wavelength-conversion using phosphors with light emitting diodes
US6366018B1 (en) 1998-10-21 2002-04-02 Sarnoff Corporation Apparatus for performing wavelength-conversion using phosphors with light emitting diodes
US6299338B1 (en) 1998-11-30 2001-10-09 General Electric Company Decorative lighting apparatus with light source and luminescent material
DE19859274A1 (de) 1998-12-22 2000-06-29 Schlafhorst & Co W Vorrichtung zur Erkennung von Fremdstoffen in strangförmigen textilen Material
US6671397B1 (en) * 1998-12-23 2003-12-30 M.V. Research Limited Measurement system having a camera with a lens and a separate sensor
JP3770014B2 (ja) 1999-02-09 2006-04-26 日亜化学工業株式会社 窒化物半導体素子
WO2000052796A1 (fr) 1999-03-04 2000-09-08 Nichia Corporation Element de laser semiconducteur au nitrure
US6521916B2 (en) 1999-03-15 2003-02-18 Gentex Corporation Radiation emitter device having an encapsulant with different zones of thermal conductivity
US6788411B1 (en) * 1999-07-08 2004-09-07 Ppt Vision, Inc. Method and apparatus for adjusting illumination angle
JP2001144331A (ja) 1999-09-02 2001-05-25 Toyoda Gosei Co Ltd 発光装置
US6504301B1 (en) 1999-09-03 2003-01-07 Lumileds Lighting, U.S., Llc Non-incandescent lightbulb package using light emitting diodes
US6696703B2 (en) 1999-09-27 2004-02-24 Lumileds Lighting U.S., Llc Thin film phosphor-converted light emitting diode device
US6686691B1 (en) 1999-09-27 2004-02-03 Lumileds Lighting, U.S., Llc Tri-color, white light LED lamps
WO2001024284A1 (en) 1999-09-27 2001-04-05 Lumileds Lighting, U.S., Llc A light emitting diode device that produces white light by performing complete phosphor conversion
US6299498B1 (en) * 1999-10-27 2001-10-09 Shin Lung Liu White-light emitting diode structure and manufacturing method
US20020176259A1 (en) 1999-11-18 2002-11-28 Ducharme Alfred D. Systems and methods for converting illumination
US8829546B2 (en) * 1999-11-19 2014-09-09 Cree, Inc. Rare earth doped layer or substrate for light conversion
US7202506B1 (en) 1999-11-19 2007-04-10 Cree, Inc. Multi element, multi color solid state LED/laser
US6614056B1 (en) 1999-12-01 2003-09-02 Cree Lighting Company Scalable led with improved current spreading structures
US6513949B1 (en) * 1999-12-02 2003-02-04 Koninklijke Philips Electronics N.V. LED/phosphor-LED hybrid lighting systems
US6350041B1 (en) 1999-12-03 2002-02-26 Cree Lighting Company High output radial dispersing lamp using a solid state light source
EP1113506A3 (en) * 1999-12-28 2005-03-16 Toyoda Gosei Co., Ltd. Light emitting diode
JP4406490B2 (ja) * 2000-03-14 2010-01-27 株式会社朝日ラバー 発光ダイオード
US6604971B1 (en) 2000-05-02 2003-08-12 General Electric Company Fabrication of LED lamps by controlled deposition of a suspension media
US7320632B2 (en) * 2000-06-15 2008-01-22 Lednium Pty Limited Method of producing a lamp
AUPQ818100A0 (en) 2000-06-15 2000-07-06 Arlec Australia Limited Led lamp
JP2002190622A (ja) * 2000-12-22 2002-07-05 Sanken Electric Co Ltd 発光ダイオード用透光性蛍光カバー
JP4926337B2 (ja) * 2000-06-28 2012-05-09 アバゴ・テクノロジーズ・ジェネラル・アイピー（シンガポール）プライベート・リミテッド 光源
US6747406B1 (en) * 2000-08-07 2004-06-08 General Electric Company LED cross-linkable phospor coating
US7129638B2 (en) * 2000-08-09 2006-10-31 Avago Technologies General Ip (Singapore) Pte. Ltd. Light emitting devices with a phosphor coating having evenly dispersed phosphor particles and constant thickness
US6635363B1 (en) * 2000-08-21 2003-10-21 General Electric Company Phosphor coating with self-adjusting distance from LED chip
EP1187226B1 (en) * 2000-09-01 2012-12-26 Citizen Electronics Co., Ltd. Surface-mount type light emitting diode and method of manufacturing same
ATE412978T1 (de) * 2000-09-20 2008-11-15 Unity Opto Technology Co Ltd Herstellungsverfahren für eine led mit einer phosphor enthaltenden isolierschicht
US6650044B1 (en) * 2000-10-13 2003-11-18 Lumileds Lighting U.S., Llc Stenciling phosphor layers on light emitting diodes
JP2002176202A (ja) * 2000-12-11 2002-06-21 Rohm Co Ltd 光学装置、それを備えたフォトインタラプタ、および光学装置の製造方法
AT410266B (de) * 2000-12-28 2003-03-25 Tridonic Optoelectronics Gmbh Lichtquelle mit einem lichtemittierenden element
US20020084745A1 (en) 2000-12-29 2002-07-04 Airma Optoelectronics Corporation Light emitting diode with light conversion by dielectric phosphor powder
US6639360B2 (en) 2001-01-31 2003-10-28 Gentex Corporation High power radiation emitter device and heat dissipating package for electronic components
US7075112B2 (en) * 2001-01-31 2006-07-11 Gentex Corporation High power radiation emitter device and heat dissipating package for electronic components
US6417019B1 (en) 2001-04-04 2002-07-09 Lumileds Lighting, U.S., Llc Phosphor converted light emitting diode
US6576488B2 (en) 2001-06-11 2003-06-10 Lumileds Lighting U.S., Llc Using electrophoresis to produce a conformally coated phosphor-converted light emitting semiconductor
US6642652B2 (en) 2001-06-11 2003-11-04 Lumileds Lighting U.S., Llc Phosphor-converted light emitting device
JP4114331B2 (ja) * 2001-06-15 2008-07-09 豊田合成株式会社 発光装置
JP2003017751A (ja) * 2001-06-28 2003-01-17 Toyoda Gosei Co Ltd 発光ダイオード
JP4055503B2 (ja) 2001-07-24 2008-03-05 日亜化学工業株式会社 半導体発光素子
KR100991829B1 (ko) * 2001-12-29 2010-11-04 항조우 후양 신잉 띠앤즈 리미티드 Ｌｅｄ 및 ｌｅｄ램프
JP3707688B2 (ja) * 2002-05-31 2005-10-19 スタンレー電気株式会社 発光装置およびその製造方法
US6870311B2 (en) * 2002-06-07 2005-03-22 Lumileds Lighting U.S., Llc Light-emitting devices utilizing nanoparticles
JP2005530349A (ja) * 2002-06-13 2005-10-06 クリー　インコーポレイテッド 飽和変換材料を有するエミッタパッケージ
WO2003107423A1 (en) * 2002-06-14 2003-12-24 Lednium Pty. Ltd. A lamp and method of producing a lamp
US6841802B2 (en) 2002-06-26 2005-01-11 Oriol, Inc. Thin film light emitting diode
US7262074B2 (en) * 2002-07-08 2007-08-28 Micron Technology, Inc. Methods of fabricating underfilled, encapsulated semiconductor die assemblies
US6905237B2 (en) * 2002-08-26 2005-06-14 William Alan Jacobs Fiber optic lighting radial arrangement and method for forming the same
US10309587B2 (en) * 2002-08-30 2019-06-04 GE Lighting Solutions, LLC Light emitting diode component
US7800121B2 (en) * 2002-08-30 2010-09-21 Lumination Llc Light emitting diode component
EP1930959B1 (en) 2002-08-30 2019-05-08 GE Lighting Solutions, LLC Phosphor-coated light emitting diode with improved efficiency
US10340424B2 (en) * 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
KR100622209B1 (ko) * 2002-08-30 2006-09-19 젤코어 엘엘씨 개선된 효율을 갖는 코팅된 발광다이오드
US7264378B2 (en) * 2002-09-04 2007-09-04 Cree, Inc. Power surface mount light emitting die package
US7775685B2 (en) 2003-05-27 2010-08-17 Cree, Inc. Power surface mount light emitting die package
US7244965B2 (en) * 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
JP2006500767A (ja) * 2002-09-19 2006-01-05 クリー　インコーポレイテッド 発光ダイオード及びその製造方法
US6682331B1 (en) * 2002-09-20 2004-01-27 Agilent Technologies, Inc. Molding apparatus for molding light emitting diode lamps
JP4280050B2 (ja) * 2002-10-07 2009-06-17 シチズン電子株式会社 白色発光装置
CN100383573C (zh) * 2002-12-02 2008-04-23 3M创新有限公司 多光源照明系统
US7692206B2 (en) * 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
US6897486B2 (en) * 2002-12-06 2005-05-24 Ban P. Loh LED package die having a small footprint
DE10261908B4 (de) * 2002-12-27 2010-12-30 Osa Opto Light Gmbh Verfahren zur Herstellung eines konversionslichtemittierenden Elementes auf der Basis von Halbleiterlichtquellen
US6917057B2 (en) * 2002-12-31 2005-07-12 Gelcore Llc Layered phosphor coatings for LED devices
US6765237B1 (en) * 2003-01-15 2004-07-20 Gelcore, Llc White light emitting device based on UV LED and phosphor blend
US20040145289A1 (en) * 2003-01-27 2004-07-29 3M Innovative Properties Company Phosphor based light sources having a non-planar short pass reflector and method of making
WO2004068603A2 (en) * 2003-01-27 2004-08-12 3M Innovative Properties Company Phosphor based light source component and method of making
US20040159900A1 (en) * 2003-01-27 2004-08-19 3M Innovative Properties Company Phosphor based light sources having front illumination
US6936857B2 (en) 2003-02-18 2005-08-30 Gelcore, Llc White light LED device
CA2517009A1 (en) 2003-02-26 2004-09-10 Cree, Inc. White light source using emitting diode and phosphor and method of fabrication
EP1455398A3 (en) * 2003-03-03 2011-05-25 Toyoda Gosei Co., Ltd. Light emitting device comprising a phosphor layer and method of making same
NZ542269A (en) * 2003-03-12 2008-03-28 Lednium Technology Pty Ltd A lamp assembly and a process for producing a lamp assembly
US20040183081A1 (en) * 2003-03-20 2004-09-23 Alexander Shishov Light emitting diode package with self dosing feature and methods of forming same
US20040252488A1 (en) * 2003-04-01 2004-12-16 Innovalight Light-emitting ceiling tile
US7279832B2 (en) * 2003-04-01 2007-10-09 Innovalight, Inc. Phosphor materials and illumination devices made therefrom
US7125501B2 (en) * 2003-04-21 2006-10-24 Sarnoff Corporation High efficiency alkaline earth metal thiogallate-based phosphors
US7368179B2 (en) * 2003-04-21 2008-05-06 Sarnoff Corporation Methods and devices using high efficiency alkaline earth metal thiogallate-based phosphors
KR101148332B1 (ko) 2003-04-30 2012-05-25 크리, 인코포레이티드 콤팩트 광학 특성을 지닌 높은 전력의 발광 소자 패키지
US7005679B2 (en) * 2003-05-01 2006-02-28 Cree, Inc. Multiple component solid state white light
US7633093B2 (en) * 2003-05-05 2009-12-15 Lighting Science Group Corporation Method of making optical light engines with elevated LEDs and resulting product
US7777235B2 (en) 2003-05-05 2010-08-17 Lighting Science Group Corporation Light emitting diodes with improved light collimation
US7528421B2 (en) * 2003-05-05 2009-05-05 Lamina Lighting, Inc. Surface mountable light emitting diode assemblies packaged for high temperature operation
US7157745B2 (en) * 2004-04-09 2007-01-02 Blonder Greg E Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them
US7108386B2 (en) 2003-05-12 2006-09-19 Illumitech Inc. High-brightness LED-phosphor coupling
US6803607B1 (en) * 2003-06-13 2004-10-12 Cotco Holdings Limited Surface mountable light emitting device
AT412928B (de) 2003-06-18 2005-08-25 Guenther Dipl Ing Dr Leising Verfahren zur herstellung einer weissen led sowie weisse led-lichtquelle
US7088038B2 (en) * 2003-07-02 2006-08-08 Gelcore Llc Green phosphor for general illumination applications
US20050006659A1 (en) * 2003-07-09 2005-01-13 Ng Kee Yean Light emitting diode utilizing a discrete wavelength-converting layer for color conversion
US20050104072A1 (en) 2003-08-14 2005-05-19 Slater David B.Jr. Localized annealing of metal-silicon carbide ohmic contacts and devices so formed
EP1658642B1 (en) 2003-08-28 2014-02-26 Panasonic Corporation Semiconductor light emitting device, light emitting module, lighting apparatus, display element and manufacturing method of semiconductor light emitting device
US7183587B2 (en) * 2003-09-09 2007-02-27 Cree, Inc. Solid metal block mounting substrates for semiconductor light emitting devices
US7915085B2 (en) * 2003-09-18 2011-03-29 Cree, Inc. Molded chip fabrication method
WO2005043637A1 (ja) * 2003-10-31 2005-05-12 Toyoda Gosei Co., Ltd. 発光装置
US6933535B2 (en) * 2003-10-31 2005-08-23 Lumileds Lighting U.S., Llc Light emitting devices with enhanced luminous efficiency
US20050099808A1 (en) * 2003-11-12 2005-05-12 Cheng Tzu C. Light-emitting device
WO2005067064A1 (en) * 2003-11-25 2005-07-21 Shichao Ge Light emitting diode and light emitting diode lamp
US20050116235A1 (en) * 2003-12-02 2005-06-02 Schultz John C. Illumination assembly
US7329887B2 (en) * 2003-12-02 2008-02-12 3M Innovative Properties Company Solid state light device
US7403680B2 (en) * 2003-12-02 2008-07-22 3M Innovative Properties Company Reflective light coupler
US20050116635A1 (en) * 2003-12-02 2005-06-02 Walson James E. Multiple LED source and method for assembling same
US7456805B2 (en) 2003-12-18 2008-11-25 3M Innovative Properties Company Display including a solid state light device and method using same
DE10361650A1 (de) * 2003-12-30 2005-08-04 Osram Opto Semiconductors Gmbh Optoelektronisches Modul und Verfahren zu dessen Herstellung
KR100593161B1 (ko) 2004-03-08 2006-06-26 서울반도체 주식회사 백색 발광 다이오드 및 그 제조 방법
US7239080B2 (en) * 2004-03-11 2007-07-03 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd LED display with overlay
JP4504056B2 (ja) * 2004-03-22 2010-07-14 スタンレー電気株式会社 半導体発光装置の製造方法
US7355284B2 (en) 2004-03-29 2008-04-08 Cree, Inc. Semiconductor light emitting devices including flexible film having therein an optical element
US7517728B2 (en) * 2004-03-31 2009-04-14 Cree, Inc. Semiconductor light emitting devices including a luminescent conversion element
JP4229447B2 (ja) * 2004-03-31 2009-02-25 スタンレー電気株式会社 半導体発光装置及び製造方法
US7326583B2 (en) 2004-03-31 2008-02-05 Cree, Inc. Methods for packaging of a semiconductor light emitting device
US7279346B2 (en) * 2004-03-31 2007-10-09 Cree, Inc. Method for packaging a light emitting device by one dispense then cure step followed by another
US20050227394A1 (en) * 2004-04-03 2005-10-13 Bor-Jen Wu Method for forming die protecting layer
US7462086B2 (en) * 2004-04-21 2008-12-09 Philips Lumileds Lighting Company, Llc Phosphor for phosphor-converted semiconductor light emitting device
DE102005020695B4 (de) * 2004-04-30 2006-06-22 Optotransmitter-Umweltschutz-Technologie E.V. Vorrichtung zur Emission von Strahlung mit einstellbarer Spektraleigenschaft
US7837348B2 (en) 2004-05-05 2010-11-23 Rensselaer Polytechnic Institute Lighting system using multiple colored light emitting sources and diffuser element
AU2005240186B2 (en) * 2004-05-05 2011-02-03 Rensselaer Polytechnic Institute High efficiency light source using solid-state emitter and down-conversion material
US7280288B2 (en) * 2004-06-04 2007-10-09 Cree, Inc. Composite optical lens with an integrated reflector
US7456499B2 (en) 2004-06-04 2008-11-25 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
US7553683B2 (en) * 2004-06-09 2009-06-30 Philips Lumiled Lighting Co., Llc Method of forming pre-fabricated wavelength converting elements for semiconductor light emitting devices
CN100401536C (zh) * 2004-06-18 2008-07-09 江苏稳润光电有限公司 白光发光二极管的制造方法
US7534633B2 (en) * 2004-07-02 2009-05-19 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
US7427366B2 (en) * 2004-07-06 2008-09-23 Sarnoff Corporation Efficient, green-emitting phosphors, and combinations with red-emitting phosphors
US7750352B2 (en) 2004-08-10 2010-07-06 Pinion Technologies, Inc. Light strips for lighting and backlighting applications
EP1800054A2 (en) * 2004-09-10 2007-06-27 Color Kinetics Incorporated Lighting zone control methods and apparatus
US7217583B2 (en) * 2004-09-21 2007-05-15 Cree, Inc. Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension
US7081667B2 (en) * 2004-09-24 2006-07-25 Gelcore, Llc Power LED package
TWI256149B (en) * 2004-09-27 2006-06-01 Advanced Optoelectronic Tech Light apparatus having adjustable color light and manufacturing method thereof
JP4756841B2 (ja) * 2004-09-29 2011-08-24 スタンレー電気株式会社 半導体発光装置の製造方法
US20060097385A1 (en) * 2004-10-25 2006-05-11 Negley Gerald H Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same
US8816369B2 (en) 2004-10-29 2014-08-26 Led Engin, Inc. LED packages with mushroom shaped lenses and methods of manufacturing LED light-emitting devices
US7670872B2 (en) * 2004-10-29 2010-03-02 LED Engin, Inc. (Cayman) Method of manufacturing ceramic LED packages
US9929326B2 (en) 2004-10-29 2018-03-27 Ledengin, Inc. LED package having mushroom-shaped lens with volume diffuser
US8324641B2 (en) * 2007-06-29 2012-12-04 Ledengin, Inc. Matrix material including an embedded dispersion of beads for a light-emitting device
US7772609B2 (en) * 2004-10-29 2010-08-10 Ledengin, Inc. (Cayman) LED package with structure and materials for high heat dissipation
US7473933B2 (en) * 2004-10-29 2009-01-06 Ledengin, Inc. (Cayman) High power LED package with universal bonding pads and interconnect arrangement
US8134292B2 (en) * 2004-10-29 2012-03-13 Ledengin, Inc. Light emitting device with a thermal insulating and refractive index matching material
US7344902B2 (en) * 2004-11-15 2008-03-18 Philips Lumileds Lighting Company, Llc Overmolded lens over LED die
US7671529B2 (en) * 2004-12-10 2010-03-02 Philips Lumileds Lighting Company, Llc Phosphor converted light emitting device
US7322732B2 (en) * 2004-12-23 2008-01-29 Cree, Inc. Light emitting diode arrays for direct backlighting of liquid crystal displays
US7564180B2 (en) * 2005-01-10 2009-07-21 Cree, Inc. Light emission device and method utilizing multiple emitters and multiple phosphors
US8125137B2 (en) 2005-01-10 2012-02-28 Cree, Inc. Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US7821023B2 (en) 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US7195944B2 (en) * 2005-01-11 2007-03-27 Semileds Corporation Systems and methods for producing white-light emitting diodes
US8680534B2 (en) 2005-01-11 2014-03-25 Semileds Corporation Vertical light emitting diodes (LED) having metal substrate and spin coated phosphor layer for producing white light
US7646033B2 (en) * 2005-01-11 2010-01-12 Semileds Corporation Systems and methods for producing white-light light emitting diodes
US7304694B2 (en) * 2005-01-12 2007-12-04 Cree, Inc. Solid colloidal dispersions for backlighting of liquid crystal displays
US7777247B2 (en) * 2005-01-14 2010-08-17 Cree, Inc. Semiconductor light emitting device mounting substrates including a conductive lead extending therein
US7939842B2 (en) * 2005-01-27 2011-05-10 Cree, Inc. Light emitting device packages, light emitting diode (LED) packages and related methods
US7602116B2 (en) * 2005-01-27 2009-10-13 Advanced Optoelectronic Technology, Inc. Light apparatus capable of emitting light of multiple wavelengths using nanometer fluorescent material, light device and manufacturing method thereof
US7358542B2 (en) * 2005-02-02 2008-04-15 Lumination Llc Red emitting phosphor materials for use in LED and LCD applications
US7648649B2 (en) * 2005-02-02 2010-01-19 Lumination Llc Red line emitting phosphors for use in led applications
US20070114562A1 (en) * 2005-11-22 2007-05-24 Gelcore, Llc Red and yellow phosphor-converted LEDs for signal applications
US7497973B2 (en) * 2005-02-02 2009-03-03 Lumination Llc Red line emitting phosphor materials for use in LED applications
US8070329B1 (en) 2005-02-11 2011-12-06 Gentex Corporation Light emitting optical systems and assemblies and systems incorporating the same
US8748923B2 (en) * 2005-03-14 2014-06-10 Philips Lumileds Lighting Company Llc Wavelength-converted semiconductor light emitting device
US7341878B2 (en) * 2005-03-14 2008-03-11 Philips Lumileds Lighting Company, Llc Wavelength-converted semiconductor light emitting device
US7274045B2 (en) * 2005-03-17 2007-09-25 Lumination Llc Borate phosphor materials for use in lighting applications
US7276183B2 (en) * 2005-03-25 2007-10-02 Sarnoff Corporation Metal silicate-silica-based polymorphous phosphors and lighting devices
EP1900013A4 (en) * 2005-06-01 2010-09-01 Univ California TECHNOLOGY FOR GROWTH AND MANUFACTURE OF SEMIPOLARS (GA, AL, IN, B) N THIN FILMS, HETEROSTRUCTURES AND COMPONENTS
US8718437B2 (en) 2006-03-07 2014-05-06 Qd Vision, Inc. Compositions, optical component, system including an optical component, devices, and other products
WO2007103310A2 (en) 2006-03-07 2007-09-13 Qd Vision, Inc. An article including semiconductor nanocrystals
EP1890343A4 (en) * 2005-06-07 2014-04-23 Fujikura Ltd SUBSTRATE ON ILLUMINATING ELEMENT INSTALLATION, ILLUMINATING ELEMENT MODULE, ILLUMINATION DEVICE, DISPLAY AND TRAFFIC SIGNALING DEVICE
US8272758B2 (en) 2005-06-07 2012-09-25 Oree, Inc. Illumination apparatus and methods of forming the same
US8215815B2 (en) 2005-06-07 2012-07-10 Oree, Inc. Illumination apparatus and methods of forming the same
WO2006131924A2 (en) 2005-06-07 2006-12-14 Oree, Advanced Illumination Solutions Inc. Illumination apparatus
US9412926B2 (en) 2005-06-10 2016-08-09 Cree, Inc. High power solid-state lamp
US8669572B2 (en) * 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
US7980743B2 (en) 2005-06-14 2011-07-19 Cree, Inc. LED backlighting for displays
TWM284076U (en) * 2005-06-17 2005-12-21 Arima Optoelectronics Corp The structure of the base of the package of a semiconductor device
AU2006262152B2 (en) * 2005-06-23 2011-04-21 Rensselaer Polytechnic Institute Package design for producing white light with short-wavelength leds and down-conversion materials
US7294861B2 (en) * 2005-06-30 2007-11-13 3M Innovative Properties Company Phosphor tape article
US20070001182A1 (en) * 2005-06-30 2007-01-04 3M Innovative Properties Company Structured phosphor tape article
US20070007542A1 (en) * 2005-07-07 2007-01-11 Sumitomo Electric Industries,Ltd. White-Light Emitting Device
DE102005038698A1 (de) * 2005-07-08 2007-01-18 Tridonic Optoelectronics Gmbh Optoelektronische Bauelemente mit Haftvermittler
US8563339B2 (en) * 2005-08-25 2013-10-22 Cree, Inc. System for and method for closed loop electrophoretic deposition of phosphor materials on semiconductor devices
US7815355B2 (en) * 2005-08-27 2010-10-19 3M Innovative Properties Company Direct-lit backlight having light recycling cavity with concave transflector
US20070047228A1 (en) * 2005-08-27 2007-03-01 3M Innovative Properties Company Methods of forming direct-lit backlights having light recycling cavity with concave transflector
US7537374B2 (en) * 2005-08-27 2009-05-26 3M Innovative Properties Company Edge-lit backlight having light recycling cavity with concave transflector
US20070047219A1 (en) * 2005-08-27 2007-03-01 3M Innovative Properties Company Direct-lit backlight having light sources with bifunctional diverters
JP5290755B2 (ja) * 2005-08-27 2013-09-18 スリーエム イノベイティブ プロパティズ カンパニー 照明アセンブリおよびシステム
US7952108B2 (en) * 2005-10-18 2011-05-31 Finisar Corporation Reducing thermal expansion effects in semiconductor packages
US7765792B2 (en) 2005-10-21 2010-08-03 Honeywell International Inc. System for particulate matter sensor signal processing
US20070096139A1 (en) * 2005-11-02 2007-05-03 3M Innovative Properties Company Light emitting diode encapsulation shape control
EP1949765B1 (en) * 2005-11-18 2017-07-12 Cree, Inc. Solid state lighting panels with variable voltage boost current sources
US7926300B2 (en) 2005-11-18 2011-04-19 Cree, Inc. Adaptive adjustment of light output of solid state lighting panels
WO2007061758A1 (en) * 2005-11-18 2007-05-31 Cree, Inc. Tiles for solid state lighting
US8514210B2 (en) 2005-11-18 2013-08-20 Cree, Inc. Systems and methods for calibrating solid state lighting panels using combined light output measurements
US20070125984A1 (en) * 2005-12-01 2007-06-07 Sarnoff Corporation Phosphors protected against moisture and LED lighting devices
US8906262B2 (en) * 2005-12-02 2014-12-09 Lightscape Materials, Inc. Metal silicate halide phosphors and LED lighting devices using the same
KR101332139B1 (ko) 2005-12-21 2013-11-21 크리, 인코포레이티드 조명 장치 및 조명 방법
EP1963743B1 (en) 2005-12-21 2016-09-07 Cree, Inc. Lighting device
US20070145879A1 (en) * 2005-12-22 2007-06-28 Abramov Vladimir S Light emitting halogen-silicate photophosphor compositions and systems
EP1969633B1 (en) 2005-12-22 2018-08-29 Cree, Inc. Lighting device
US7798678B2 (en) * 2005-12-30 2010-09-21 3M Innovative Properties Company LED with compound encapsulant lens
US7569406B2 (en) * 2006-01-09 2009-08-04 Cree, Inc. Method for coating semiconductor device using droplet deposition
US8441179B2 (en) 2006-01-20 2013-05-14 Cree, Inc. Lighting devices having remote lumiphors that are excited by lumiphor-converted semiconductor excitation sources
US8264138B2 (en) 2006-01-20 2012-09-11 Cree, Inc. Shifting spectral content in solid state light emitters by spatially separating lumiphor films
US20090008655A1 (en) * 2006-01-31 2009-01-08 Koninklijke Philips Electronics N.V. White Light Source
EP1985884B1 (en) * 2006-02-08 2012-10-24 Hitachi, Ltd. Electric brake
US9874674B2 (en) 2006-03-07 2018-01-23 Samsung Electronics Co., Ltd. Compositions, optical component, system including an optical component, devices, and other products
US7808004B2 (en) * 2006-03-17 2010-10-05 Edison Opto Corporation Light emitting diode package structure and method of manufacturing the same
US7675145B2 (en) * 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US8969908B2 (en) * 2006-04-04 2015-03-03 Cree, Inc. Uniform emission LED package
US9084328B2 (en) * 2006-12-01 2015-07-14 Cree, Inc. Lighting device and lighting method
US8513875B2 (en) 2006-04-18 2013-08-20 Cree, Inc. Lighting device and lighting method
EP2052589A4 (en) 2006-04-18 2012-09-19 Cree Inc LIGHTING DEVICE AND METHOD
CN101449099A (zh) 2006-04-20 2009-06-03 科锐Led照明科技公司 照明装置及照明方法
JP2009534866A (ja) 2006-04-24 2009-09-24 クリー， インコーポレイティッド 横向き平面実装白色ｌｅｄ
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US11210971B2 (en) 2009-07-06 2021-12-28 Cree Huizhou Solid State Lighting Company Limited Light emitting diode display with tilted peak emission pattern
US7635915B2 (en) * 2006-04-26 2009-12-22 Cree Hong Kong Limited Apparatus and method for use in mounting electronic elements
US7655486B2 (en) * 2006-05-17 2010-02-02 3M Innovative Properties Company Method of making light emitting device with multilayer silicon-containing encapsulant
US7718991B2 (en) * 2006-05-23 2010-05-18 Cree Led Lighting Solutions, Inc. Lighting device and method of making
KR20090031370A (ko) 2006-05-23 2009-03-25 크리 엘이디 라이팅 솔루션즈, 인크. 조명 장치
US8008676B2 (en) 2006-05-26 2011-08-30 Cree, Inc. Solid state light emitting device and method of making same
CN101454613A (zh) * 2006-05-31 2009-06-10 科锐Led照明科技公司 具有颜色控制的照明装置及其照明方法
BRPI0712439B1 (pt) 2006-05-31 2019-11-05 Cree Led Lighting Solutions Inc dispositivo de iluminação e método de iluminação
US7703945B2 (en) * 2006-06-27 2010-04-27 Cree, Inc. Efficient emitting LED package and method for efficiently emitting light
US20080074583A1 (en) * 2006-07-06 2008-03-27 Intematix Corporation Photo-luminescence color liquid crystal display
US8947619B2 (en) 2006-07-06 2015-02-03 Intematix Corporation Photoluminescence color display comprising quantum dots material and a wavelength selective filter that allows passage of excitation radiation and prevents passage of light generated by photoluminescence materials
US8735920B2 (en) * 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US7943952B2 (en) * 2006-07-31 2011-05-17 Cree, Inc. Method of uniform phosphor chip coating and LED package fabricated using method
JP4937845B2 (ja) * 2006-08-03 2012-05-23 日立マクセル株式会社 照明装置および表示装置
US20080029720A1 (en) * 2006-08-03 2008-02-07 Intematix Corporation LED lighting arrangement including light emitting phosphor
US8367945B2 (en) * 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US7763478B2 (en) 2006-08-21 2010-07-27 Cree, Inc. Methods of forming semiconductor light emitting device packages by liquid injection molding
CN101554089A (zh) * 2006-08-23 2009-10-07 科锐Led照明科技公司 照明装置和照明方法
US7703942B2 (en) * 2006-08-31 2010-04-27 Rensselaer Polytechnic Institute High-efficient light engines using light emitting diodes
US7842960B2 (en) 2006-09-06 2010-11-30 Lumination Llc Light emitting packages and methods of making same
US20080064131A1 (en) * 2006-09-12 2008-03-13 Mutual-Tek Industries Co., Ltd. Light emitting apparatus and method for the same
US20100224890A1 (en) * 2006-09-18 2010-09-09 Cree, Inc. Light emitting diode chip with electrical insulation element
KR101497104B1 (ko) * 2006-10-03 2015-02-27 라이트스케이프 머티어리얼스, 인코포레이티드 금속 실리케이트 할라이드 형광체 및 이를 이용한 ｌｅｄ 조명 디바이스
US9018619B2 (en) 2006-10-09 2015-04-28 Cree, Inc. Quantum wells for light conversion
JP4984824B2 (ja) * 2006-10-26 2012-07-25 豊田合成株式会社 発光装置
US7808013B2 (en) * 2006-10-31 2010-10-05 Cree, Inc. Integrated heat spreaders for light emitting devices (LEDs) and related assemblies
US8029155B2 (en) 2006-11-07 2011-10-04 Cree, Inc. Lighting device and lighting method
US10295147B2 (en) * 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
US7889421B2 (en) 2006-11-17 2011-02-15 Rensselaer Polytechnic Institute High-power white LEDs and manufacturing method thereof
US9441793B2 (en) 2006-12-01 2016-09-13 Cree, Inc. High efficiency lighting device including one or more solid state light emitters, and method of lighting
US9310026B2 (en) 2006-12-04 2016-04-12 Cree, Inc. Lighting assembly and lighting method
CN101622493A (zh) * 2006-12-04 2010-01-06 科锐Led照明科技公司 照明装置和照明方法
JP5153783B2 (ja) 2006-12-07 2013-02-27 クリー インコーポレイテッド 照明デバイスおよび照明方法
US9178121B2 (en) 2006-12-15 2015-11-03 Cree, Inc. Reflective mounting substrates for light emitting diodes
US8836212B2 (en) 2007-01-11 2014-09-16 Qd Vision, Inc. Light emissive printed article printed with quantum dot ink
US9024349B2 (en) * 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US8232564B2 (en) * 2007-01-22 2012-07-31 Cree, Inc. Wafer level phosphor coating technique for warm light emitting diodes
US9159888B2 (en) 2007-01-22 2015-10-13 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9196799B2 (en) * 2007-01-22 2015-11-24 Cree, Inc. LED chips having fluorescent substrates with microholes and methods for fabricating
US8021904B2 (en) * 2007-02-01 2011-09-20 Cree, Inc. Ohmic contacts to nitrogen polarity GaN
US7781783B2 (en) * 2007-02-07 2010-08-24 SemiLEDs Optoelectronics Co., Ltd. White light LED device
US7709853B2 (en) * 2007-02-12 2010-05-04 Cree, Inc. Packaged semiconductor light emitting devices having multiple optical elements
US9061450B2 (en) 2007-02-12 2015-06-23 Cree, Inc. Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding
US20080192458A1 (en) 2007-02-12 2008-08-14 Intematix Corporation Light emitting diode lighting system
US9711703B2 (en) * 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
KR20090115803A (ko) * 2007-02-13 2009-11-06 쓰리엠 이노베이티브 프로퍼티즈 컴파니 렌즈를 갖는 ｌｅｄ 소자 및 그 제조 방법
TW200834968A (en) * 2007-02-13 2008-08-16 Harvatek Corp Method of making light-emitting diode structure with high heat dissipation effect and structure made thereby
US8456388B2 (en) * 2007-02-14 2013-06-04 Cree, Inc. Systems and methods for split processor control in a solid state lighting panel
US20080197369A1 (en) * 2007-02-20 2008-08-21 Cree, Inc. Double flip semiconductor device and method for fabrication
US20080198572A1 (en) 2007-02-21 2008-08-21 Medendorp Nicholas W LED lighting systems including luminescent layers on remote reflectors
JP5476128B2 (ja) 2007-02-22 2014-04-23 クリー インコーポレイテッド 照明装置、照明方法、光フィルタ、および光をフィルタリングする方法
US7972030B2 (en) 2007-03-05 2011-07-05 Intematix Corporation Light emitting diode (LED) based lighting systems
US8203260B2 (en) * 2007-04-13 2012-06-19 Intematix Corporation Color temperature tunable white light source
US20080258130A1 (en) * 2007-04-23 2008-10-23 Bergmann Michael J Beveled LED Chip with Transparent Substrate
TWI350012B (en) * 2007-05-04 2011-10-01 Lite On Technology Corp White light emitting diode and base thereof
US7910944B2 (en) * 2007-05-04 2011-03-22 Cree, Inc. Side mountable semiconductor light emitting device packages and panels
US7703943B2 (en) * 2007-05-07 2010-04-27 Intematix Corporation Color tunable light source
US8038317B2 (en) 2007-05-08 2011-10-18 Cree, Inc. Lighting device and lighting method
EP2142843B1 (en) * 2007-05-08 2016-12-14 Cree, Inc. Lighting device and lighting method
US7781779B2 (en) * 2007-05-08 2010-08-24 Luminus Devices, Inc. Light emitting devices including wavelength converting material
BRPI0811561A2 (pt) 2007-05-08 2015-06-16 Cree Led Lighting Solutions Dispositivo de iluminação e método de iluminação
EP2142844B1 (en) * 2007-05-08 2017-08-23 Cree, Inc. Lighting device and lighting method
EP2153112B1 (en) 2007-05-08 2016-05-04 Cree, Inc. Lighting device and lighting method
JP5006102B2 (ja) * 2007-05-18 2012-08-22 株式会社東芝 発光装置およびその製造方法
US7712917B2 (en) 2007-05-21 2010-05-11 Cree, Inc. Solid state lighting panels with limited color gamut and methods of limiting color gamut in solid state lighting panels
EP2158429A2 (en) * 2007-05-29 2010-03-03 Oree, Advanced Illumination Solutions INC. Method and device for providing circumferential illumination
US7999283B2 (en) * 2007-06-14 2011-08-16 Cree, Inc. Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes
US7942556B2 (en) * 2007-06-18 2011-05-17 Xicato, Inc. Solid state illumination device
CN101345273B (zh) * 2007-07-09 2011-03-23 上海威廉照明电气有限公司 发光二极管及其制作方法
US9401461B2 (en) * 2007-07-11 2016-07-26 Cree, Inc. LED chip design for white conversion
US10505083B2 (en) * 2007-07-11 2019-12-10 Cree, Inc. Coating method utilizing phosphor containment structure and devices fabricated using same
TWI347687B (en) * 2007-07-13 2011-08-21 Lite On Technology Corp Light-emitting device with open-loop control
WO2009012301A2 (en) * 2007-07-16 2009-01-22 Lumination Llc Red line emitting complex fluoride phosphors activated with mn4+
JP5431320B2 (ja) 2007-07-17 2014-03-05 クリー インコーポレイテッド 内部光学機能を備えた光学素子およびその製造方法
WO2009014707A2 (en) 2007-07-23 2009-01-29 Qd Vision, Inc. Quantum dot light enhancement substrate and lighting device including same
US20090033612A1 (en) * 2007-07-31 2009-02-05 Roberts John K Correction of temperature induced color drift in solid state lighting displays
EP2434554B1 (en) * 2007-08-03 2018-05-30 Panasonic Intellectual Property Management Co., Ltd. Wavelength-converted light-emitting device with uniform emission
US7863635B2 (en) 2007-08-07 2011-01-04 Cree, Inc. Semiconductor light emitting devices with applied wavelength conversion materials
US8829820B2 (en) * 2007-08-10 2014-09-09 Cree, Inc. Systems and methods for protecting display components from adverse operating conditions
CN101369619B (zh) * 2007-08-14 2011-01-05 富士迈半导体精密工业（上海）有限公司 表面贴装型发光二极管组件及发光二极管背光模组
US11114594B2 (en) 2007-08-24 2021-09-07 Creeled, Inc. Light emitting device packages using light scattering particles of different size
US8128249B2 (en) 2007-08-28 2012-03-06 Qd Vision, Inc. Apparatus for selectively backlighting a material
JP5044329B2 (ja) * 2007-08-31 2012-10-10 株式会社東芝 発光装置
US8866185B2 (en) * 2007-09-06 2014-10-21 SemiLEDs Optoelectronics Co., Ltd. White light LED with multiple encapsulation layers
US20090065792A1 (en) 2007-09-07 2009-03-12 3M Innovative Properties Company Method of making an led device having a dome lens
US8783887B2 (en) 2007-10-01 2014-07-22 Intematix Corporation Color tunable light emitting device
BRPI0818048B1 (pt) 2007-10-10 2018-11-21 Cree Led Lighting Solutions Inc dispositivo de iluminação
US9012937B2 (en) 2007-10-10 2015-04-21 Cree, Inc. Multiple conversion material light emitting diode package and method of fabricating same
US9086213B2 (en) 2007-10-17 2015-07-21 Xicato, Inc. Illumination device with light emitting diodes
US7984999B2 (en) 2007-10-17 2011-07-26 Xicato, Inc. Illumination device with light emitting diodes and moveable light adjustment member
US7915627B2 (en) 2007-10-17 2011-03-29 Intematix Corporation Light emitting device with phosphor wavelength conversion
KR101525274B1 (ko) * 2007-10-26 2015-06-02 크리, 인코포레이티드 하나 이상의 루미퍼를 갖는 조명 장치, 및 이의 제조 방법
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
USD615504S1 (en) 2007-10-31 2010-05-11 Cree, Inc. Emitter package
US8376577B2 (en) * 2007-11-05 2013-02-19 Xicato, Inc. Modular solid state lighting device
TWI401820B (zh) * 2007-11-07 2013-07-11 Ind Tech Res Inst 發光元件及其製作方法
US8946987B2 (en) 2007-11-07 2015-02-03 Industrial Technology Research Institute Light emitting device and fabricating method thereof
US8536584B2 (en) * 2007-11-14 2013-09-17 Cree, Inc. High voltage wire bond free LEDS
US8368100B2 (en) * 2007-11-14 2013-02-05 Cree, Inc. Semiconductor light emitting diodes having reflective structures and methods of fabricating same
US9634191B2 (en) 2007-11-14 2017-04-25 Cree, Inc. Wire bond free wafer level LED
US8866410B2 (en) * 2007-11-28 2014-10-21 Cree, Inc. Solid state lighting devices and methods of manufacturing the same
US9431589B2 (en) * 2007-12-14 2016-08-30 Cree, Inc. Textured encapsulant surface in LED packages
USD633631S1 (en) 2007-12-14 2011-03-01 Cree Hong Kong Limited Light source of light emitting diode
US9041285B2 (en) 2007-12-14 2015-05-26 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US8167674B2 (en) * 2007-12-14 2012-05-01 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US8823630B2 (en) * 2007-12-18 2014-09-02 Cree, Inc. Systems and methods for providing color management control in a lighting panel
US8550684B2 (en) 2007-12-19 2013-10-08 Oree, Inc. Waveguide-based packaging structures and methods for discrete lighting elements
US20090159915A1 (en) * 2007-12-19 2009-06-25 Shaul Branchevsky Led insert module and multi-layer lens
US7929816B2 (en) 2007-12-19 2011-04-19 Oree, Inc. Waveguide sheet containing in-coupling, propagation, and out-coupling regions
USD634863S1 (en) 2008-01-10 2011-03-22 Cree Hong Kong Limited Light source of light emitting diode
US8878219B2 (en) * 2008-01-11 2014-11-04 Cree, Inc. Flip-chip phosphor coating method and devices fabricated utilizing method
US8940561B2 (en) * 2008-01-15 2015-01-27 Cree, Inc. Systems and methods for application of optical materials to optical elements
US8058088B2 (en) 2008-01-15 2011-11-15 Cree, Inc. Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating
US20090309114A1 (en) * 2008-01-16 2009-12-17 Luminus Devices, Inc. Wavelength converting light-emitting devices and methods of making the same
US8040070B2 (en) * 2008-01-23 2011-10-18 Cree, Inc. Frequency converted dimming signal generation
US10008637B2 (en) 2011-12-06 2018-06-26 Cree, Inc. Light emitter devices and methods with reduced dimensions and improved light output
JP2009176661A (ja) * 2008-01-28 2009-08-06 Nec Lighting Ltd Ｌｅｄ照明装置
US8231237B2 (en) 2008-03-05 2012-07-31 Oree, Inc. Sub-assembly and methods for forming the same
US8567973B2 (en) * 2008-03-07 2013-10-29 Intematix Corporation Multiple-chip excitation systems for white light emitting diodes (LEDs)
US8740400B2 (en) 2008-03-07 2014-06-03 Intematix Corporation White light illumination system with narrow band green phosphor and multiple-wavelength excitation
KR100998009B1 (ko) * 2008-03-12 2010-12-03 삼성엘이디 주식회사 발광 다이오드 패키지 및 그 제조 방법
US8637883B2 (en) 2008-03-19 2014-01-28 Cree, Inc. Low index spacer layer in LED devices
US8877524B2 (en) * 2008-03-31 2014-11-04 Cree, Inc. Emission tuning methods and devices fabricated utilizing methods
US7859000B2 (en) * 2008-04-10 2010-12-28 Cree, Inc. LEDs using single crystalline phosphor and methods of fabricating same
US9207385B2 (en) 2008-05-06 2015-12-08 Qd Vision, Inc. Lighting systems and devices including same
WO2009137053A1 (en) 2008-05-06 2009-11-12 Qd Vision, Inc. Optical components, systems including an optical component, and devices
WO2009151515A1 (en) 2008-05-06 2009-12-17 Qd Vision, Inc. Solid state lighting devices including quantum confined semiconductor nanoparticles
TWI362769B (en) 2008-05-09 2012-04-21 Univ Nat Chiao Tung Light emitting device and fabrication method therefor
US8049230B2 (en) * 2008-05-16 2011-11-01 Cree Huizhou Opto Limited Apparatus and system for miniature surface mount devices
KR101495071B1 (ko) * 2008-06-24 2015-02-25 삼성전자 주식회사 서브 마운트 및 이를 이용한 발광 장치, 상기 서브마운트의 제조 방법 및 이를 이용한 발광 장치의 제조 방법
US8240875B2 (en) 2008-06-25 2012-08-14 Cree, Inc. Solid state linear array modules for general illumination
US20090321758A1 (en) * 2008-06-25 2009-12-31 Wen-Huang Liu Led with improved external light extraction efficiency
EP2312658B1 (en) 2008-07-03 2018-06-27 Samsung Electronics Co., Ltd. A wavelength-converting light emitting diode (led) chip and method for fabrication of an led device equipped with this chip
US8297786B2 (en) 2008-07-10 2012-10-30 Oree, Inc. Slim waveguide coupling apparatus and method
US8301002B2 (en) 2008-07-10 2012-10-30 Oree, Inc. Slim waveguide coupling apparatus and method
US7928458B2 (en) * 2008-07-15 2011-04-19 Visera Technologies Company Limited Light-emitting diode device and method for fabricating the same
US20100027293A1 (en) * 2008-07-30 2010-02-04 Intematix Corporation Light Emitting Panel
US8384115B2 (en) * 2008-08-01 2013-02-26 Cree, Inc. Bond pad design for enhancing light extraction from LED chips
US7942540B2 (en) * 2008-08-08 2011-05-17 Xicato, Inc. Color tunable light source
JP5284006B2 (ja) * 2008-08-25 2013-09-11 シチズン電子株式会社 発光装置
US20100060462A1 (en) * 2008-09-09 2010-03-11 Revere Supply Co., Inc. Led rescue light
US8075165B2 (en) 2008-10-14 2011-12-13 Ledengin, Inc. Total internal reflection lens and mechanical retention and locating device
US8822954B2 (en) * 2008-10-23 2014-09-02 Intematix Corporation Phosphor based authentication system
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
US20100109025A1 (en) * 2008-11-05 2010-05-06 Koninklijke Philips Electronics N.V. Over the mold phosphor lens for an led
US20100117106A1 (en) * 2008-11-07 2010-05-13 Ledengin, Inc. Led with light-conversion layer
US8791471B2 (en) * 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US20100119839A1 (en) * 2008-11-13 2010-05-13 Maven Optronics Corp. System and Method for Forming a Thin-Film Phosphor Layer for Phosphor-Converted Light Emitting Devices
TWI608760B (zh) 2008-11-13 2017-12-11 行家光電有限公司 形成螢光粉轉換發光元件之方法
US8220971B2 (en) * 2008-11-21 2012-07-17 Xicato, Inc. Light emitting diode module with three part color matching
US8288785B2 (en) * 2008-12-03 2012-10-16 Seoul Semiconductor Co., Ltd. Lead frame having light-reflecting layer, light emitting diode having the lead frame, and backlight unit having the light emitting diode
US7897419B2 (en) 2008-12-23 2011-03-01 Cree, Inc. Color correction for wafer level white LEDs
US8507300B2 (en) * 2008-12-24 2013-08-13 Ledengin, Inc. Light-emitting diode with light-conversion layer
US8390193B2 (en) * 2008-12-31 2013-03-05 Intematix Corporation Light emitting device with phosphor wavelength conversion
US8368112B2 (en) * 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US8563963B2 (en) * 2009-02-06 2013-10-22 Evergrand Holdings Limited Light-emitting diode die packages and methods for producing same
TWI463708B (zh) * 2009-02-24 2014-12-01 Advanced Optoelectronic Tech 側面出光型發光元件封裝結構及其製造方法
RU2011137495A (ru) * 2009-03-23 2013-04-27 Ибериус, Ллс Улучшенный измеритель волос и одноразовый картридж
US8624527B1 (en) 2009-03-27 2014-01-07 Oree, Inc. Independently controllable illumination device
US8476668B2 (en) * 2009-04-06 2013-07-02 Cree, Inc. High voltage low current surface emitting LED
US9093293B2 (en) 2009-04-06 2015-07-28 Cree, Inc. High voltage low current surface emitting light emitting diode
CN101894901B (zh) 2009-04-08 2013-11-20 硅谷光擎 用于多个发光二极管的封装
US8598793B2 (en) 2011-05-12 2013-12-03 Ledengin, Inc. Tuning of emitter with multiple LEDs to a single color bin
US7985000B2 (en) * 2009-04-08 2011-07-26 Ledengin, Inc. Lighting apparatus having multiple light-emitting diodes with individual light-conversion layers
US8741715B2 (en) * 2009-04-29 2014-06-03 Cree, Inc. Gate electrodes for millimeter-wave operation and methods of fabrication
US20100320904A1 (en) 2009-05-13 2010-12-23 Oree Inc. LED-Based Replacement Lamps for Incandescent Fixtures
US8337030B2 (en) 2009-05-13 2012-12-25 Cree, Inc. Solid state lighting devices having remote luminescent material-containing element, and lighting methods
US8921876B2 (en) 2009-06-02 2014-12-30 Cree, Inc. Lighting devices with discrete lumiphor-bearing regions within or on a surface of remote elements
US8651692B2 (en) * 2009-06-18 2014-02-18 Intematix Corporation LED based lamp and light emitting signage
KR100963743B1 (ko) * 2009-06-23 2010-06-14 한국광기술원 파장변환물질층을 구비하는 발광 다이오드 및 이의 제조방법
WO2010150202A2 (en) 2009-06-24 2010-12-29 Oree, Advanced Illumination Solutions Inc. Illumination apparatus with high conversion efficiency and methods of forming the same
US8415692B2 (en) * 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
US20110031516A1 (en) * 2009-08-07 2011-02-10 Koninklijke Philips Electronics N.V. Led with silicone layer and laminated remote phosphor layer
US8598809B2 (en) 2009-08-19 2013-12-03 Cree, Inc. White light color changing solid state lighting and methods
US9293667B2 (en) * 2010-08-19 2016-03-22 Soraa, Inc. System and method for selected pump LEDs with multiple phosphors
US8455910B2 (en) * 2009-09-21 2013-06-04 Walsin Lihwa Corporation Method of manufacturing light emitting diode packaging lens and light emitting diode package
EP2480816A1 (en) 2009-09-25 2012-08-01 Cree, Inc. Lighting device with low glare and high light level uniformity
US8593040B2 (en) 2009-10-02 2013-11-26 Ge Lighting Solutions Llc LED lamp with surface area enhancing fins
US20110110095A1 (en) * 2009-10-09 2011-05-12 Intematix Corporation Solid-state lamps with passive cooling
TWI403005B (zh) * 2009-10-12 2013-07-21 Intematix Technology Ct Corp 發光二極體及其製作方法
KR101034054B1 (ko) * 2009-10-22 2011-05-12 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
US20110101409A1 (en) * 2009-11-02 2011-05-05 Akron Brass Company LED Lamp Package with Integral Driver
US8779685B2 (en) * 2009-11-19 2014-07-15 Intematix Corporation High CRI white light emitting devices and drive circuitry
TWI381563B (zh) * 2009-11-20 2013-01-01 Everlight Electronics Co Ltd 發光二極體封裝及其製作方法
US8303141B2 (en) * 2009-12-17 2012-11-06 Ledengin, Inc. Total internal reflection lens with integrated lamp cover
US20110149548A1 (en) * 2009-12-22 2011-06-23 Intematix Corporation Light emitting diode based linear lamps
US20110176301A1 (en) * 2010-01-21 2011-07-21 Dsem Holdings Sdn. Bhd. Method to produce homogeneous light output by shaping the light conversion material in multichip module
US20110215348A1 (en) * 2010-02-03 2011-09-08 Soraa, Inc. Reflection Mode Package for Optical Devices Using Gallium and Nitrogen Containing Materials
US8771577B2 (en) 2010-02-16 2014-07-08 Koninklijke Philips N.V. Light emitting device with molded wavelength converting layer
US8420415B2 (en) 2010-03-02 2013-04-16 Micron Technology, Inc. Method for forming a light conversion material
US8562161B2 (en) 2010-03-03 2013-10-22 Cree, Inc. LED based pedestal-type lighting structure
US9275979B2 (en) 2010-03-03 2016-03-01 Cree, Inc. Enhanced color rendering index emitter through phosphor separation
US8632196B2 (en) * 2010-03-03 2014-01-21 Cree, Inc. LED lamp incorporating remote phosphor and diffuser with heat dissipation features
US8104908B2 (en) 2010-03-04 2012-01-31 Xicato, Inc. Efficient LED-based illumination module with high color rendering index
US20110220920A1 (en) * 2010-03-09 2011-09-15 Brian Thomas Collins Methods of forming warm white light emitting devices having high color rendering index values and related light emitting devices
US8858022B2 (en) 2011-05-05 2014-10-14 Ledengin, Inc. Spot TIR lens system for small high-power emitter
US9080729B2 (en) 2010-04-08 2015-07-14 Ledengin, Inc. Multiple-LED emitter for A-19 lamps
US9345095B2 (en) 2010-04-08 2016-05-17 Ledengin, Inc. Tunable multi-LED emitter module
US8651703B2 (en) 2010-04-09 2014-02-18 Intellectual Discovery Co., Ltd. Light emitting device using filter element
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
EP2706292A1 (en) 2010-04-26 2014-03-12 Xicato, Inc. Led-based illumination module attachment to a light fixture
US8329482B2 (en) 2010-04-30 2012-12-11 Cree, Inc. White-emitting LED chips and method for making same
US8237381B2 (en) 2010-05-04 2012-08-07 Xicato, Inc. Flexible electrical connection of an LED-based illumination device to a light fixture
US8450770B2 (en) * 2010-05-11 2013-05-28 Advanced Semiconductor Engineering, Inc. Light emitting package structure
CN101876407A (zh) * 2010-05-17 2010-11-03 中山大学佛山研究院 一种led光源模组
US8807799B2 (en) 2010-06-11 2014-08-19 Intematix Corporation LED-based lamps
US8888318B2 (en) 2010-06-11 2014-11-18 Intematix Corporation LED spotlight
MX346857B (es) 2010-06-18 2017-04-03 Xicato Inc Modulo de iluminacion de diodo fotoemisor con diagnostico integrado.
US10546846B2 (en) 2010-07-23 2020-01-28 Cree, Inc. Light transmission control for masking appearance of solid state light sources
US10451251B2 (en) 2010-08-02 2019-10-22 Ideal Industries Lighting, LLC Solid state lamp with light directing optics and diffuser
US8946998B2 (en) 2010-08-09 2015-02-03 Intematix Corporation LED-based light emitting systems and devices with color compensation
JP5242641B2 (ja) * 2010-08-25 2013-07-24 シャープ株式会社 発光装置の製造方法
US20120051045A1 (en) 2010-08-27 2012-03-01 Xicato, Inc. Led Based Illumination Module Color Matched To An Arbitrary Light Source
US8297767B2 (en) 2010-09-07 2012-10-30 Xicato, Inc. LED-based illumination modules with PTFE color converting surfaces
US9070851B2 (en) 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
US8610341B2 (en) 2010-10-05 2013-12-17 Intematix Corporation Wavelength conversion component
US8957585B2 (en) 2010-10-05 2015-02-17 Intermatix Corporation Solid-state light emitting devices with photoluminescence wavelength conversion
US8604678B2 (en) 2010-10-05 2013-12-10 Intematix Corporation Wavelength conversion component with a diffusing layer
TW201215817A (en) 2010-10-05 2012-04-16 Advanced Connectek Inc Complementary color light source device
WO2012047937A1 (en) 2010-10-05 2012-04-12 Intematix Corporation Solid-state light emitting devices and signage with photoluminescence wavelength conversion
US9546765B2 (en) 2010-10-05 2017-01-17 Intematix Corporation Diffuser component having scattering particles
US8614539B2 (en) 2010-10-05 2013-12-24 Intematix Corporation Wavelength conversion component with scattering particles
US9140429B2 (en) 2010-10-14 2015-09-22 Cree, Inc. Optical element edge treatment for lighting device
US8455882B2 (en) 2010-10-15 2013-06-04 Cree, Inc. High efficiency LEDs
TWI447969B (zh) * 2010-10-20 2014-08-01 Interlight Optotech Corp 發光二極體封裝結構
US9648673B2 (en) 2010-11-05 2017-05-09 Cree, Inc. Lighting device with spatially segregated primary and secondary emitters
US8772817B2 (en) 2010-12-22 2014-07-08 Cree, Inc. Electronic device submounts including substrates with thermally conductive vias
US8425065B2 (en) 2010-12-30 2013-04-23 Xicato, Inc. LED-based illumination modules with thin color converting layers
US9166126B2 (en) 2011-01-31 2015-10-20 Cree, Inc. Conformally coated light emitting devices and methods for providing the same
US9508904B2 (en) 2011-01-31 2016-11-29 Cree, Inc. Structures and substrates for mounting optical elements and methods and devices for providing the same background
US9234655B2 (en) 2011-02-07 2016-01-12 Cree, Inc. Lamp with remote LED light source and heat dissipating elements
US9068701B2 (en) 2012-01-26 2015-06-30 Cree, Inc. Lamp structure with remote LED light source
US11251164B2 (en) 2011-02-16 2022-02-15 Creeled, Inc. Multi-layer conversion material for down conversion in solid state lighting
RU2456712C1 (ru) * 2011-03-02 2012-07-20 Федеральное государственное бюджетное учреждение науки Институт физики твердого тела Российской академии наук (ИФТТ РАН) Источник белого света
KR101251738B1 (ko) 2011-03-22 2013-04-05 엘지이노텍 주식회사 표시장치
KR101241511B1 (ko) 2011-03-22 2013-03-11 엘지이노텍 주식회사 광 변환 부재 및 이를 포함하는 표시장치
US8899767B2 (en) 2011-03-31 2014-12-02 Xicato, Inc. Grid structure on a transmissive layer of an LED-based illumination module
US9004705B2 (en) * 2011-04-13 2015-04-14 Intematix Corporation LED-based light sources for light emitting devices and lighting arrangements with photoluminescence wavelength conversion
US8513900B2 (en) 2011-05-12 2013-08-20 Ledengin, Inc. Apparatus for tuning of emitter with multiple LEDs to a single color bin
US9069380B2 (en) 2011-06-10 2015-06-30 Aliphcom Media device, application, and content management using sensory input
US20120313296A1 (en) * 2011-06-10 2012-12-13 Aliphcom Component protective overmolding
US10211380B2 (en) 2011-07-21 2019-02-19 Cree, Inc. Light emitting devices and components having improved chemical resistance and related methods
TW201312807A (zh) 2011-07-21 2013-03-16 Cree Inc 光發射器元件封裝與部件及改良化學抵抗性的方法與相關方法
US10686107B2 (en) 2011-07-21 2020-06-16 Cree, Inc. Light emitter devices and components with improved chemical resistance and related methods
US8403529B2 (en) 2011-08-02 2013-03-26 Xicato, Inc. LED-based illumination module with preferentially illuminated color converting surfaces
US8449129B2 (en) 2011-08-02 2013-05-28 Xicato, Inc. LED-based illumination device with color converting surfaces
US8558252B2 (en) 2011-08-26 2013-10-15 Cree, Inc. White LEDs with emission wavelength correction
US8485692B2 (en) 2011-09-09 2013-07-16 Xicato, Inc. LED-based light source with sharply defined field angle
US8410508B1 (en) * 2011-09-12 2013-04-02 SemiLEDs Optoelectronics Co., Ltd. Light emitting diode (LED) package having wavelength conversion member and wafer level fabrication method
US8992051B2 (en) 2011-10-06 2015-03-31 Intematix Corporation Solid-state lamps with improved radial emission and thermal performance
US20130088848A1 (en) 2011-10-06 2013-04-11 Intematix Corporation Solid-state lamps with improved radial emission and thermal performance
US9365766B2 (en) 2011-10-13 2016-06-14 Intematix Corporation Wavelength conversion component having photo-luminescence material embedded into a hermetic material for remote wavelength conversion
US9115868B2 (en) 2011-10-13 2015-08-25 Intematix Corporation Wavelength conversion component with improved protective characteristics for remote wavelength conversion
US8884508B2 (en) 2011-11-09 2014-11-11 Cree, Inc. Solid state lighting device including multiple wavelength conversion materials
US8591072B2 (en) 2011-11-16 2013-11-26 Oree, Inc. Illumination apparatus confining light by total internal reflection and methods of forming the same
US8564004B2 (en) 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
US8858045B2 (en) 2011-12-05 2014-10-14 Xicato, Inc. Reflector attachment to an LED-based illumination module
US9496466B2 (en) 2011-12-06 2016-11-15 Cree, Inc. Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction
US8820951B2 (en) 2012-02-06 2014-09-02 Xicato, Inc. LED-based light source with hybrid spot and general lighting characteristics
US9240530B2 (en) 2012-02-13 2016-01-19 Cree, Inc. Light emitter devices having improved chemical and physical resistance and related methods
US8957580B2 (en) 2012-02-13 2015-02-17 Cree, Inc. Lighting device including multiple wavelength conversion material layers
US8946747B2 (en) 2012-02-13 2015-02-03 Cree, Inc. Lighting device including multiple encapsulant material layers
US9343441B2 (en) 2012-02-13 2016-05-17 Cree, Inc. Light emitter devices having improved light output and related methods
US8779687B2 (en) 2012-02-13 2014-07-15 Xicato, Inc. Current routing to multiple LED circuits
US11032884B2 (en) 2012-03-02 2021-06-08 Ledengin, Inc. Method for making tunable multi-led emitter module
US9488359B2 (en) 2012-03-26 2016-11-08 Cree, Inc. Passive phase change radiators for LED lamps and fixtures
US9897284B2 (en) 2012-03-28 2018-02-20 Ledengin, Inc. LED-based MR16 replacement lamp
US10043952B2 (en) 2012-03-30 2018-08-07 Lumileds Llc Light emitting device with wavelength converting side coat
CN102629649B (zh) * 2012-03-30 2014-11-26 广东科立盈光电技术有限公司 高亮度led灯中荧光粉的填充方法
EP2842176B1 (en) 2012-04-26 2018-11-07 Intematix Corporation Methods and apparatus for implementing color consistency in remote wavelength conversion
TW201344979A (zh) * 2012-04-27 2013-11-01 Delta Electronics Inc 發光裝置及其製造方法
CN103378274A (zh) * 2012-04-27 2013-10-30 台达电子工业股份有限公司 发光装置及其制造方法
US9500355B2 (en) 2012-05-04 2016-11-22 GE Lighting Solutions, LLC Lamp with light emitting elements surrounding active cooling device
US8680785B2 (en) 2012-05-18 2014-03-25 Xicato, Inc. Variable master current mirror
US9685585B2 (en) 2012-06-25 2017-06-20 Cree, Inc. Quantum dot narrow-band downconverters for high efficiency LEDs
WO2014006501A1 (en) 2012-07-03 2014-01-09 Yosi Shani Planar remote phosphor illumination apparatus
US8994056B2 (en) 2012-07-13 2015-03-31 Intematix Corporation LED-based large area display
CN102810537B (zh) * 2012-08-17 2016-03-09 江苏脉锐光电科技有限公司 白光led发光装置
US20140003044A1 (en) 2012-09-06 2014-01-02 Xicato, Inc. Integrated led based illumination device
CN104968997A (zh) 2012-09-19 2015-10-07 温特斯科技有限公司 用于散射光的装置
US20140159084A1 (en) 2012-12-12 2014-06-12 Cree, Inc. Led dome with improved color spatial uniformity
US8845380B2 (en) 2012-12-17 2014-09-30 Xicato, Inc. Automated color tuning of an LED based illumination device
US20140185269A1 (en) 2012-12-28 2014-07-03 Intermatix Corporation Solid-state lamps utilizing photoluminescence wavelength conversion components
US8870617B2 (en) 2013-01-03 2014-10-28 Xicato, Inc. Color tuning of a multi-color LED based illumination device
US9217543B2 (en) 2013-01-28 2015-12-22 Intematix Corporation Solid-state lamps with omnidirectional emission patterns
US9234801B2 (en) 2013-03-15 2016-01-12 Ledengin, Inc. Manufacturing method for LED emitter with high color consistency
US9587790B2 (en) 2013-03-15 2017-03-07 Cree, Inc. Remote lumiphor solid state lighting devices with enhanced light extraction
US8770800B1 (en) 2013-03-15 2014-07-08 Xicato, Inc. LED-based light source reflector with shell elements
CN105121951A (zh) 2013-03-15 2015-12-02 英特曼帝克司公司 光致发光波长转换组件
CN104124327B (zh) * 2013-04-26 2017-06-20 展晶科技(深圳)有限公司 发光二极管封装结构
CN104241262B (zh) 2013-06-14 2020-11-06 惠州科锐半导体照明有限公司 发光装置以及显示装置
US9596737B2 (en) 2013-07-02 2017-03-14 Xicato, Inc. Multi-port LED-based lighting communications gateway
US9591726B2 (en) 2013-07-02 2017-03-07 Xicato, Inc. LED-based lighting control network communication
WO2015042193A2 (en) 2013-09-17 2015-03-26 Xicato, Inc. Led based illumination device with integrated output window
US9425896B2 (en) 2013-12-31 2016-08-23 Xicato, Inc. Color modulated LED-based illumination
US9406654B2 (en) 2014-01-27 2016-08-02 Ledengin, Inc. Package for high-power LED devices
US9360188B2 (en) 2014-02-20 2016-06-07 Cree, Inc. Remote phosphor element filled with transparent material and method for forming multisection optical elements
US9788379B2 (en) 2014-03-28 2017-10-10 Xicato, Inc. Deep dimming of an LED-based illumination device
CN103943618A (zh) * 2014-04-18 2014-07-23 江苏新广联绿色照明工程有限公司 可调色温和显指的led光源模块
US9781799B2 (en) 2014-05-05 2017-10-03 Xicato, Inc. LED-based illumination device reflector having sense and communication capability
US9318670B2 (en) 2014-05-21 2016-04-19 Intematix Corporation Materials for photoluminescence wavelength converted solid-state light emitting devices and arrangements
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
WO2016086180A1 (en) 2014-11-26 2016-06-02 Ledengin, Inc. Compact emitter for warm dimming and color tunable lamp
US9530943B2 (en) 2015-02-27 2016-12-27 Ledengin, Inc. LED emitter packages with high CRI
US9788397B2 (en) 2015-02-27 2017-10-10 Xicato, Inc. Lighting communication advertising packets
US9853730B2 (en) 2015-02-27 2017-12-26 Xicato, Inc. Lighting based authentication of a mobile electronic device
US9960848B2 (en) 2015-02-27 2018-05-01 Xicato, Inc. Commissioning of devices on a lighting communications network
US9930741B2 (en) 2015-02-27 2018-03-27 Xicato, Inc. Synchronized light control over a wireless network
EP3274765A4 (en) 2015-03-23 2018-10-17 Intematix Corporation Photoluminescence color display
US9781798B2 (en) 2015-04-08 2017-10-03 Xicato, Inc. LED-based illumination systems having sense and communication capability
US9943042B2 (en) 2015-05-18 2018-04-17 Biological Innovation & Optimization Systems, LLC Grow light embodying power delivery and data communications features
US10009980B2 (en) 2015-05-18 2018-06-26 Xicato, Inc. Lighting communications gateway
US9788387B2 (en) 2015-09-15 2017-10-10 Biological Innovation & Optimization Systems, LLC Systems and methods for controlling the spectral content of LED lighting devices
US9844116B2 (en) 2015-09-15 2017-12-12 Biological Innovation & Optimization Systems, LLC Systems and methods for controlling the spectral content of LED lighting devices
US9750092B2 (en) 2015-10-01 2017-08-29 Xicato, Inc. Power management of an LED-based illumination device
US10193031B2 (en) 2016-03-11 2019-01-29 Rohinni, LLC Method for applying phosphor to light emitting diodes and apparatus thereof
CN205944139U (zh) 2016-03-30 2017-02-08 首尔伟傲世有限公司 紫外线发光二极管封装件以及包含此的发光二极管模块
US10595376B2 (en) 2016-09-13 2020-03-17 Biological Innovation & Optimization Systems, LLC Systems and methods for controlling the spectral content of LED lighting devices
US10219345B2 (en) 2016-11-10 2019-02-26 Ledengin, Inc. Tunable LED emitter with continuous spectrum
WO2019019495A1 (zh) * 2017-07-26 2019-01-31 卢旋坤 一种led造型荧光软胶灯
US10575374B2 (en) 2018-03-09 2020-02-25 Ledengin, Inc. Package for flip-chip LEDs with close spacing of LED chips
CN208385406U (zh) * 2018-05-25 2019-01-15 深圳市瑞丰光电子股份有限公司 一种led模组
US11313671B2 (en) 2019-05-28 2022-04-26 Mitutoyo Corporation Chromatic confocal range sensing system with enhanced spectrum light source configuration
US11592166B2 (en) 2020-05-12 2023-02-28 Feit Electric Company, Inc. Light emitting device having improved illumination and manufacturing flexibility
US11876042B2 (en) 2020-08-03 2024-01-16 Feit Electric Company, Inc. Omnidirectional flexible light emitting device

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49122677A (ja) * 1973-03-23 1974-11-22
JPS49122292A (ja) * 1973-03-22 1974-11-22
JPS5920286A (ja) * 1982-07-01 1984-02-01 フア−ミタリア・カルロ・エルバ・ソシエタ・ペル・アツイオ−ニ β−ラクタム抗生物質の新規なカルボン酸エステル類
US5379186A (en) * 1993-07-06 1995-01-03 Motorola, Inc. Encapsulated electronic component having a heat diffusing layer
JPH10190065A (ja) * 1996-12-27 1998-07-21 Nichia Chem Ind Ltd 発光装置及びそれを用いたｌｅｄ表示器
JPH10200165A (ja) * 1997-01-14 1998-07-31 Sanken Electric Co Ltd 半導体発光装置
JPH11500584A (ja) * 1996-09-20 1999-01-12 シーメンス アクチエンゲゼルシヤフト 波長変換する注型材料、その使用方法及びその製造方法
JPH1187778A (ja) * 1997-09-02 1999-03-30 Toshiba Corp 半導体発光素子、半導体発光装置およびその製造方法
JP2000031532A (ja) * 1998-07-14 2000-01-28 Toshiba Electronic Engineering Corp 半導体発光装置
JP2000031547A (ja) * 1998-07-09 2000-01-28 Stanley Electric Co Ltd 面状光源

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3787684A (en) * 1970-12-30 1974-01-22 S Isenberg Beta activated ultraviolet radiation source surrounded by a visible light producing fluorescent agent
JPS4985068U (ja) * 1972-11-10 1974-07-23
JPH0799345A (ja) * 1993-09-28 1995-04-11 Nichia Chem Ind Ltd 発光ダイオード
JPH07335790A (ja) * 1994-06-06 1995-12-22 Toray Dow Corning Silicone Co Ltd 半導体素子保護用組成物および半導体装置
JP3261922B2 (ja) * 1994-07-26 2002-03-04 株式会社村田製作所 圧電共振部品の製造方法
JPH0927642A (ja) * 1995-07-13 1997-01-28 Clarion Co Ltd 照明装置
BRPI9715293B1 (pt) * 1996-06-26 2016-11-01 Osram Ag elemento de cobertura para um elemento de construção optoeletrônico
US5729029A (en) * 1996-09-06 1998-03-17 Hewlett-Packard Company Maximizing electrical doping while reducing material cracking in III-V nitride semiconductor devices
JP2868085B2 (ja) * 1997-05-20 1999-03-10 日亜化学工業株式会社 面状光源
US5813753A (en) * 1997-05-27 1998-09-29 Philips Electronics North America Corporation UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light
JP3266072B2 (ja) * 1997-10-14 2002-03-18 富士電機株式会社 多色発光有機エレクトロルミネッセンス素子の製造方法
DE29804149U1 (de) * 1998-03-09 1998-06-18 Chen Hsing Leuchtdiode (LED) mit verbesserter Struktur
US5959316A (en) * 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49122292A (ja) * 1973-03-22 1974-11-22
JPS49122677A (ja) * 1973-03-23 1974-11-22
JPS5920286A (ja) * 1982-07-01 1984-02-01 フア−ミタリア・カルロ・エルバ・ソシエタ・ペル・アツイオ−ニ β−ラクタム抗生物質の新規なカルボン酸エステル類
US5379186A (en) * 1993-07-06 1995-01-03 Motorola, Inc. Encapsulated electronic component having a heat diffusing layer
JPH11500584A (ja) * 1996-09-20 1999-01-12 シーメンス アクチエンゲゼルシヤフト 波長変換する注型材料、その使用方法及びその製造方法
JPH10190065A (ja) * 1996-12-27 1998-07-21 Nichia Chem Ind Ltd 発光装置及びそれを用いたｌｅｄ表示器
JPH10200165A (ja) * 1997-01-14 1998-07-31 Sanken Electric Co Ltd 半導体発光装置
JPH1187778A (ja) * 1997-09-02 1999-03-30 Toshiba Corp 半導体発光素子、半導体発光装置およびその製造方法
JP2000031547A (ja) * 1998-07-09 2000-01-28 Stanley Electric Co Ltd 面状光源
JP2000031532A (ja) * 1998-07-14 2000-01-28 Toshiba Electronic Engineering Corp 半導体発光装置

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010161423A (ja) * 1998-09-01 2010-07-22 Philips Lumileds Lightng Co Llc 発光半導体を備えた半導体装置
JP2002084002A (ja) * 2000-09-06 2002-03-22 Nippon Leiz Co Ltd 光源装置
JP2002222996A (ja) * 2001-01-24 2002-08-09 Rohm Co Ltd Ｌｅｄ装置
JP2002252376A (ja) * 2001-02-23 2002-09-06 Seiwa Electric Mfg Co Ltd 表面実装型発光ダイオード及びその製造方法
JP4673986B2 (ja) * 2001-02-23 2011-04-20 星和電機株式会社 表面実装方発光ダイオードの製造方法
US7390684B2 (en) 2001-10-12 2008-06-24 Nichia Corporation Light emitting apparatus and method of manufacturing the same
US7301175B2 (en) 2001-10-12 2007-11-27 Nichia Corporation Light emitting apparatus and method of manufacturing the same
US7105857B2 (en) 2002-07-08 2006-09-12 Nichia Corporation Nitride semiconductor device comprising bonded substrate and fabrication method of the same
US7378334B2 (en) 2002-07-08 2008-05-27 Nichia Corporation Nitride semiconductor device comprising bonded substrate and fabrication method of the same
JP2004087812A (ja) * 2002-08-27 2004-03-18 Sanyo Electric Co Ltd 発光体
JP2004288760A (ja) * 2003-03-20 2004-10-14 Stanley Electric Co Ltd 多層ｌｅｄ
JP4674318B2 (ja) * 2003-09-09 2011-04-20 クリー インコーポレイテッド 燐光体を内部に分散させた透明なプラスチック製シェル（ｓｈｅｌｌ）を具備する透過型光学要素およびその製造方法
JP2007504972A (ja) * 2003-09-09 2007-03-08 クリー　インコーポレイテッド 燐光体を内部に分散させた透明なプラスチック製シェル（ｓｈｅｌｌ）を具備する透過型光学要素およびその製造方法
CN100414725C (zh) * 2004-04-23 2008-08-27 斯坦雷电气株式会社 半导体发光装置
EP1589591A2 (en) 2004-04-23 2005-10-26 Stanley Electric Co., Ltd. Semiconductor light emitting device and method of manufacturing the same
US8884315B2 (en) 2004-04-23 2014-11-11 Stanley Electric Co., Ltd. Semiconductor light emitting device and method of manufacturing the same
JP2012134564A (ja) * 2004-09-10 2012-07-12 Seoul Semiconductor Co Ltd 発光素子及びその製造方法
JP2006202962A (ja) * 2005-01-20 2006-08-03 Toyoda Gosei Co Ltd 発光装置
US8294160B2 (en) 2005-01-20 2012-10-23 Toyoda Gosei Co., Ltd. Light emitting device including a sealing portion, and method of making the same
WO2008105428A1 (ja) 2007-02-27 2008-09-04 Kyocera Corporation 発光装置
JP2013202305A (ja) * 2012-03-29 2013-10-07 Olympus Medical Systems Corp 光源装置

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