CN100414725C - 半导体发光装置 - Google Patents
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Abstract
本发明提供一种半导体发光装置,包括设有用于收纳LED芯片(3)和树脂间隔物的腔的基体(2),该树脂间隔物至少由透明树脂间隔物(4)和波长转换间隔板(6)这两层间隔物构成,波长转换间隔板(6)为混合有荧光体(6a)并具有大致一定厚度的间隔物;在波长转换间隔板(6)的内部配置有一部分与基体(2)连接的金属制散热用网(7)或散热用线材(5)。由此,可解决在以往的白色发光的半导体装置(1)中,在通过使LED芯片大型化、增加驱动电流来实现光量的增加时,因进行颜色转换的荧光体的温度上升等而产生的效率降低,光量降低等问题。并且,通过降低波长转换间隔板内的荧光体所产生的热,可实现发光效率更高的半导体发光装置。
Description
技术领域
本发明涉及一种LED灯管,具体涉及一种采用射出蓝色光的LED芯片,并在所述LED芯片所射出光的光路上配置有受蓝色光激励而发出黄色光的荧光体,向外部射出由从LED芯片发出的蓝色光和荧光体所发出的黄色光混合而成的白色光的所谓白色发光LED灯管的结构。
背景技术
以往,在使用进行蓝色发光的LED芯片和受来自该LED芯片的光的激励而进行黄色发光的荧光体来得到白色发光时,是将所述LED芯片嵌装在设置于基体上的呈凹孔状的腔内,在进行了必要的金导线的布线后,以一定的深度模制在透明树脂中,由此构成透明间隔物,并且,在所述透明间隔物上流式涂敷均匀分散有荧光体的树脂并使其形成均匀的厚度,在适当的方向上形成含有荧光体的层并将其作为第二层。
这样,由LED芯片发出的蓝色光射向所有方向,并透过厚度大致相同的第二层。因此,在所述第二层的任何部分,蓝色光直接透过的光量与转换为黄色光的光量的比例大致相同,所以,整个第二层观察起来为大致均匀的白色,可以得到不产生彩色相位不匀的质量高的发光。
【专利文献1】特开2000-77723号公报
然而,近年来,对被称之为白色发光的LED灯管的需求,例如作为便携用照明器具用等有逐渐扩大的趋势,与此同时,还要求其实现大功率化。所以,推动了所述LED芯片向大型化和大功率驱动方向的发展,照射所述第二层的荧光体并激励该荧光体发光的蓝色光的密度将呈现越来越高的趋势。
在此,照射在所述荧光体上的蓝色光不会全部转换为黄色光,并且照射光的密度越高、波长转换效率就越低。而且,没有转换成规定颜色光的剩余能量被转换为热能。这时,一般的荧光体有温度越高、发光效率越低的温度特性。
所以,在如专利文献1所公开的以往结构的LED灯管中,越是通过采用大型化的LED灯管、或增大对LED芯片的驱动功率来增加照射到荧光体上的LED芯片所发出的光线的密度,换言之,越是增加对LED灯管的耗电,则光量就越趋于饱和,当然就会产生效率降低的现象。另外,在同时使用多个LED灯管时,发热也成为不容忽视的问题。
发明内容
本发明作为用于解决所述问题的具体装置,提供一种半导体发光装置,具有:基体,设有用于收纳LED芯片和树脂间隔物的腔;所述树脂间隔物至少由透明树脂间隔物和波长转换间隔板这两层间隔物构成,所述波长转换间隔板为混合有荧光体并形成为具有一定厚度的间隔物;其特征在于,在所述波长转换间隔板的内部配置有金属制散热用网或散热用线材。由此,利用所述散热用网或散热用线材可以抑制所述波长转换间隔板中的荧光体的温度上升。
根据本发明,通过在波长转换间隔板中配置用散热性好的金属形成的散热用网或散热用线材,在如上述的进行基于不同波长的光的激励时,把不能全被转换为所希望的波长的光中的转换为热的部分,利用所述散热用网或散热用线材均匀扩散到荧光体中,由此,抑制了局部高温等,可防止转换效率降低。
所以,所述波长转换间隔板可以维持在整体温度大致相同的状态,可以防止因局部温度变高使得该部分的转换效率降低产生局部的暗的部分,即所谓的光不匀的状态,破坏作为半导体发光装置的美观性。另外,由于一部分热通过散热用网散热到基体中,所以可进一步降低荧光体温度、防止转换效率的降低。
附图说明
图1是表示作为本发明的半导体发光装置的主要部分的基体的剖面图。
图2是表示在本发明的半导体发光装置的第一实施方式中的在基体上安装LED芯片和透明树脂间隔物的安装工序的说明图。
图3是表示在本发明的半导体发光装置的第一实施方式中的散热用线材的安装工序的说明图。
图4是表示在本发明的半导体发光装置的第一实施方式中的波长转换间隔板的安装工序的说明图。
图5是表示本发明的半导体发光装置的第二实施方式的剖面图。
图6是表示在将根据本发明的设有散热用网(或,散热用线材)的半导体发光装置与以往例的半导体发光装置进行比较时,相对驱动功率的不同光量的图表。
标号说明
1-半导体发光装置;2-基体;2a-第一腔;2b-阶梯部;2c-第二腔;3-LED芯片;3a-布线;4-透明树脂间隔物;5-散热用线材;6-波长转换间隔板;6a-荧光体;7-散热用网;8-焊盘。
具体实施方式
下面,根据附图所示的实施方式详细说明本发明。图1和图2所示的是用于形成本发明的半导体发光装置1的基体2,在该基体2上,设有呈大致钵状的凹部的第一腔2a,在该第一腔2a内例如嵌装有作为蓝色光发光源的LED芯片3,并且,在所述LED芯片3的周围填充有用于防潮的透明树脂间隔物4。
而且,在所述第一腔2a的上方,形成与所述第一腔2a为同心圆的具有适宜深度的凹孔状第二腔2c,该第2腔的直径比第一腔2a的最大直径还要大,由此在与第1腔2a之间形成阶梯部,在该第二腔2c和第一腔2a之间产生阶梯部2b。另外,所述基体2最好使用热传导性好的材料形成,以使来自所安装的LED芯片3的发热能够迅速发散出去。另外,虽然对实施方式中的一部分省略了图示,但是在所述基体2的适当部分上设有焊盘8,其用于对所述LED芯片3实施布线9。
图2是表示本发明的第一实施方式中的安装所述LED芯片3和在所述第一腔2a中填充透明树脂间隔物4的安装工序的说明图,首先,将所述LED芯片3焊接到设置于基体2上的第一腔2a的底面上,利用金导线进行适当的布线3a后,向所述第一腔2a内进行注入并注满,通过加热等适当的方法使其固化。另外,在该情况下,最好使所述阶梯部2b不被透明树脂间隔物4覆盖,而露出基体2面。
图3是表示沿着如上述那样进行了注入后的透明树脂间隔物4的表面、将多个散热用线材5设置成平行状的状态的说明图,将铁、铜、或铝制线材作为散热用线材5,利用所述阶梯部2b并通过导线焊接等适当的方法安装多根线材。另外,在所采用散热用线材5为铁、铜的情况下,由于其颜色不同于该半导体发光装置1的发光色的白色,因此例如可以通过铝蒸镀等使颜色接近白色。
这时,所述散热用线材5虽然可以在所述透明树脂间隔物4的表面纵横安装,但由于散热用线材5的两端与基体2紧密相连,将热传导至基体2侧,所以,如图3所示,仅向一个方向安装也能够达到相应的效果。并且,如图4所示,安装波长转换间隔板6,其覆盖所述透明树脂间隔物4和散热用线材5,主要成分为由蓝色光激励发出黄色光的荧光体6a。
另外,此时所述波长转换间隔板6最好是,在荧光体6a中混合适当的树脂、粘接剂等,使其在最初具有适当的粘度,然后通过安装后的加热或重力所导致的下垂等,将所述散热用线材5嵌入在波长转换间隔板6中。并且,在上述加热后的经过一段时间后再进行固化会达到更好的效果。
这样,确实明显抑制了波长转换间隔板6中的荧光体6a的温度上升,但是在透明树脂间隔物4或波长转换间隔板6中存在不透明的散热用线材5,只有在该部分光被遮挡没有透过,因此,担心在视觉上形成所谓的阴影。
在此,对发明者的试制结果进行阐述,所述波长转换间隔板6中的荧光体6a为颗粒状,并且由于被激励其自身进行发光,所以来自波长转换间隔板6的光是大致完全扩散的光,波长转换间隔板6是由作为这些颗粒的集合的荧光体6a呈层状形成的,利用适量的荧光体,其用量和来自所述LED芯片的蓝色光能够得到白色光,并且,如果没有将所述散热用线材5配置在波长转换间隔板6的表面附近等的不适当的结构,实质上不会看出散热用线材5呈阴影状。
图5是本发明的半导体发光装置的第二实施方式,在该第二实施方式中,也采用设有第一腔2a和阶梯部2b,以及第二腔2c的基体2,其形状与第一实施方式大致相同。但是,虽在以后进行说明,由于在阶梯部2b部分安装有预先形成的呈略圆形的网状的散热用网7,因而经由阶梯部2b部分对用于向LED芯片3供电的线材进行布线变得困难,所以最好在基体2的底面侧设置用于该用途的焊盘8等。
另外,在该第二实施方式中,形成半导体发光装置1时的步骤与第一实施方式大致相同,首先,作为最初的工序为在基体2的第一腔2a的底面上固定LED芯片3,然后,在其周围注入透明树脂间隔物4。
此时,所述透明树脂间隔物4的注入量最好与前一实施例相同使阶梯部2b为露出状态,通过这样做,利用点焊等适当的方法能够实现所述散热用网7的安装,使第一腔2a的上部被覆盖,并且由于散热用网7和所述基体2的接触面积增大,所以两者间的热传导性变好。
然后,覆盖所述散热用网7,通过注入等方法安装由必需量的荧光体形成的波长转换间隔板6,并通过进行加热固化等将其固定在规定位置上。另外,此时所述波长转换间隔板6在固化前通过加热而被暂时软化,进入到散热用网7中间,或者,使其在初始具有适当的粘度,在重力的作用下下垂、进入到散热用网7的格子之间等。
另外,关于形成所述散热用网7,近年,可以利用在生产半导体用图案等时被采用的、能够得到非常高的精度的光抗蚀剂等的蚀刻工序形成,或者,也可以通过能够得到同样的高精度的微型机械(MEMS)加工等形成。
图6表示,如上所述在根据本发明在将散热用线材5或散热用网7埋入所述波长转换间隔板6的同时,通过将该散热用线材5或散热用网7的一部分连接到基体2上,散热用网7将通过激励发光而产生的发热扩散到热容量更大,散热更容易的基体2中进行冷却,可以解决作为荧光体特性之一的温度上升时发光效率降低的问题。
即,如图中曲线N所示,在波长转换间隔板6中没有设置散热用线材5的情况下,开始时亮度(光量)也与施加到LED芯片3上的驱动电流的量大致成比例地(随着驱动电流增加)增加,但是从驱动电流超过80%时开始,驱动电流和光量的增加不成比例,在光量侧明显有降低的趋势。
并且,驱动电流在100~110%的范围内,在光量侧饱和的趋势非常明显,在驱动电流变为120%的状态下,确认有减少的趋势。另外,此时,在目视波长转换间隔板6的状态下,由于温度过度上升,中央部明显变暗,可观察到波长转换间隔板6整体产生发光不匀。
另一方面,如图中曲线Y所示,在波长转换间隔板6中安装有散热用线材5或散热用网7的状态下的半导体发光装置1中,驱动电流在大致120%以下的范围内,光量也以大致的比例上升。然后,在130~140%的范围内,光量示出饱和的趋势,并未表现出降低的趋势。所以,当然不会在波长转换间隔板6产生光不匀。
如上所述,根据本发明,在使用了大致相同的基体2、大致相同的LED芯片3和大致相同的波长转换间隔板6的半导体发光装置1中,仅仅附加了尤其重点对波长转换间隔板6的部分进行散热的散热用网7(或散热用线材5),与不附加的情况相比,即使增加大致为120~130%左右的驱动功率,其光量也会随之增加,从而能够以相同的尺寸实现多出大约20%左右光量的半导体发光装置1。
另外,此时,由于所述散热用网7使得波长转换间隔板6的温度更低,并且,能够把整体保持为均匀的温度,所以,发光面不会产生光不匀,提高了作为半导体发光装置1的质量。
Claims (5)
1. 一种半导体发光装置,具有:基体,设有用于收纳LED芯片和树脂间隔物的腔;所述树脂间隔物至少由透明树脂间隔物和波长转换间隔板这两层间隔物构成,所述波长转换间隔板为混合有荧光体并形成为具有一定厚度的间隔物;其特征在于,在所述波长转换间隔板的内部配置有金属制散热用网或散热用线材。
2. 根据权利要求1所述的半导体发光装置,其特征在于,所述散热用网或散热用线材具有与所述基体机械性连接的部分。
3. 根据权利要求1所述的半导体发光装置,其特征在于,所述散热用网或散热用线材由铁、铝、铜的任意一种构成。
4. 根据权利要求2所述的半导体发光装置,其特征在于,所述散热用网通过蚀刻加工而形成。
5. 根据权利要求1或2所述的半导体发光装置,其特征在于,所述散热用网通过微型机械加工而形成。
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2005
- 2005-04-11 US US11/102,929 patent/US8884315B2/en not_active Expired - Fee Related
- 2005-04-15 EP EP05008294.0A patent/EP1589591B1/en active Active
- 2005-04-22 CN CNB2005100663621A patent/CN100414725C/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2310388Y (zh) * | 1997-08-14 | 1999-03-10 | 陈兴 | 发光二极管 |
JP2000077723A (ja) * | 1998-09-01 | 2000-03-14 | Hewlett Packard Co <Hp> | 発光半導体を備えた半導体装置 |
Also Published As
Publication number | Publication date |
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CN1691360A (zh) | 2005-11-02 |
EP1589591A2 (en) | 2005-10-26 |
JP2005311170A (ja) | 2005-11-04 |
EP1589591B1 (en) | 2017-07-26 |
EP1589591A3 (en) | 2009-04-08 |
JP4471356B2 (ja) | 2010-06-02 |
US8884315B2 (en) | 2014-11-11 |
US20050253153A1 (en) | 2005-11-17 |
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