FR2761808B1 - Transistor en couche mince et son procede de fabrication - Google Patents
Transistor en couche mince et son procede de fabricationInfo
- Publication number
- FR2761808B1 FR2761808B1 FR9802396A FR9802396A FR2761808B1 FR 2761808 B1 FR2761808 B1 FR 2761808B1 FR 9802396 A FR9802396 A FR 9802396A FR 9802396 A FR9802396 A FR 9802396A FR 2761808 B1 FR2761808 B1 FR 2761808B1
- Authority
- FR
- France
- Prior art keywords
- manufacturing
- thin film
- film transistor
- transistor
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42384—Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4908—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66765—Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78636—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device with supplementary region or layer for improving the flatness of the device
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019970007010A KR100248123B1 (ko) | 1997-03-04 | 1997-03-04 | 박막트랜지스터및그의제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2761808A1 FR2761808A1 (fr) | 1998-10-09 |
FR2761808B1 true FR2761808B1 (fr) | 2003-01-31 |
Family
ID=19498627
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9802396A Expired - Lifetime FR2761808B1 (fr) | 1997-03-04 | 1998-02-27 | Transistor en couche mince et son procede de fabrication |
Country Status (6)
Country | Link |
---|---|
US (8) | US5905274A (fr) |
JP (3) | JPH10256561A (fr) |
KR (1) | KR100248123B1 (fr) |
DE (1) | DE19808989B4 (fr) |
FR (1) | FR2761808B1 (fr) |
GB (1) | GB2322968B (fr) |
Families Citing this family (29)
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KR100248123B1 (ko) * | 1997-03-04 | 2000-03-15 | 구본준 | 박막트랜지스터및그의제조방법 |
KR100392909B1 (ko) | 1997-08-26 | 2004-03-22 | 엘지.필립스 엘시디 주식회사 | 박막트랜지스터및그의제조방법 |
JPH10335669A (ja) * | 1997-05-30 | 1998-12-18 | Mitsubishi Electric Corp | 薄膜トランジスタおよびその製法 |
KR100276442B1 (ko) * | 1998-02-20 | 2000-12-15 | 구본준 | 액정표시장치 제조방법 및 그 제조방법에 의한 액정표시장치 |
US6104042A (en) * | 1999-06-10 | 2000-08-15 | Chi Mei Optoelectronics Corp. | Thin film transistor with a multi-metal structure a method of manufacturing the same |
TW451447B (en) * | 1999-12-31 | 2001-08-21 | Samsung Electronics Co Ltd | Contact structures of wirings and methods for manufacturing the same, and thin film transistor array panels including the same and methods for manufacturing the same |
KR100422808B1 (ko) * | 2000-12-30 | 2004-03-12 | 한국전자통신연구원 | 매우 얇은 활성층을 가지는 박막 트랜지스터의 제조방법 |
JP3901460B2 (ja) * | 2001-02-19 | 2007-04-04 | 株式会社日立製作所 | 薄膜トランジスタの製造方法 |
US6444513B1 (en) * | 2001-03-19 | 2002-09-03 | Advanced Micro Devices, Inc. | Metal gate stack with etch stop layer having implanted metal species |
KR100415700B1 (ko) * | 2001-04-06 | 2004-01-24 | 테크노세미켐 주식회사 | 박막트랜지스터용 액정표시장치의 소스 및 드레인 전극용식각액 조성물 |
JP4723787B2 (ja) * | 2002-07-09 | 2011-07-13 | シャープ株式会社 | 電界効果型トランジスタ、その製造方法及び画像表示装置 |
US6800510B2 (en) * | 2002-11-06 | 2004-10-05 | Hannstar Display Corporation | Method of controlling storage capacitor's capacitance of thin film transistor liquid crystal display |
KR100997963B1 (ko) * | 2003-06-30 | 2010-12-02 | 삼성전자주식회사 | 박막 트랜지스터 표시판 및 그의 제조 방법 |
US7190000B2 (en) * | 2003-08-11 | 2007-03-13 | Samsung Electronics Co., Ltd. | Thin film transistor array panel and manufacturing method thereof |
JP4093147B2 (ja) * | 2003-09-04 | 2008-06-04 | 三菱電機株式会社 | エッチング液及びエッチング方法 |
KR100654022B1 (ko) * | 2004-05-04 | 2006-12-04 | 네오폴리((주)) | 금속유도측면결정화법을 이용한 박막 트랜지스터 제조방법 |
KR101061850B1 (ko) * | 2004-09-08 | 2011-09-02 | 삼성전자주식회사 | 박막 트랜지스터 표시판 및 그 제조방법 |
KR20060059565A (ko) * | 2004-11-29 | 2006-06-02 | 삼성전자주식회사 | 다층 배선, 이의 제조 방법 및 이를 갖는 박막트랜지스터 |
JP2008166334A (ja) * | 2006-12-27 | 2008-07-17 | Mitsubishi Electric Corp | 表示装置及びその製造方法 |
WO2010131502A1 (fr) * | 2009-05-12 | 2010-11-18 | シャープ株式会社 | Transistor à film mince et son procédé de fabrication |
WO2011105343A1 (fr) * | 2010-02-26 | 2011-09-01 | シャープ株式会社 | Dispositif à semi-conducteurs, son procédé de fabrication et dispositif d'affichage |
JPWO2011161714A1 (ja) * | 2010-06-21 | 2013-08-19 | パナソニック株式会社 | シリコン薄膜の結晶化方法およびシリコンtft装置の製造方法 |
US8709920B2 (en) * | 2011-02-24 | 2014-04-29 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
US8728861B2 (en) | 2011-10-12 | 2014-05-20 | The United States Of America As Represented By The Secretary Of The Air Force | Fabrication method for ZnO thin film transistors using etch-stop layer |
CN102983157B (zh) * | 2012-11-29 | 2016-03-23 | 昆山工研院新型平板显示技术中心有限公司 | 一种制备铝栅极的方法和薄膜晶体管 |
US8936973B1 (en) * | 2013-11-14 | 2015-01-20 | Cbrite Inc. | Anodization of gate with laser vias and cuts |
KR102427675B1 (ko) * | 2015-04-20 | 2022-08-02 | 삼성디스플레이 주식회사 | 박막 트랜지스터 어레이 기판, 및 이를 포함하는 유기 발광 표시 장치 |
CN104934110A (zh) * | 2015-06-26 | 2015-09-23 | 合肥京东方光电科技有限公司 | 导电结构及其制作方法、阵列基板、显示装置 |
KR20200116576A (ko) | 2019-04-01 | 2020-10-13 | 삼성디스플레이 주식회사 | 디스플레이 패널 및 이를 포함한 디스플레이 장치 |
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JPH1120068A (ja) | 1998-06-08 | 1999-01-26 | Toto Ltd | 光触媒機能を有する部材及びその製造方法 |
JP2001222448A (ja) | 2000-02-10 | 2001-08-17 | Nec Corp | 自己書き換えプログラムのキャッシュ同期不正を検出する命令レベルシミュレータ |
JP2004097531A (ja) | 2002-09-10 | 2004-04-02 | Kanea Trading:Kk | ピアス兼イヤリング |
JP4097531B2 (ja) | 2003-01-10 | 2008-06-11 | 三洋電機株式会社 | 物理量の検出装置 |
JP2005315615A (ja) | 2004-04-27 | 2005-11-10 | Star Technologies Inc | テストカード |
JP4426414B2 (ja) | 2004-10-01 | 2010-03-03 | 三菱樹脂株式会社 | ストレッチフィルム |
JP4488424B2 (ja) | 2005-03-31 | 2010-06-23 | 富士重工業株式会社 | ワイパ装置のヘッドカバー取付け構造 |
JP4621570B2 (ja) | 2005-09-15 | 2011-01-26 | ユニタイト株式会社 | パイル締結構造およびそれに使用する締結具 |
JP2008095083A (ja) | 2006-09-11 | 2008-04-24 | Mitsui Chemicals Inc | 雑貨成形体 |
JP5315615B2 (ja) | 2007-02-08 | 2013-10-16 | 日産自動車株式会社 | 燃料電池及びセパレータ |
JP2008254680A (ja) | 2007-04-09 | 2008-10-23 | Denso Corp | 車両用表示装置 |
KR100954593B1 (ko) | 2009-09-18 | 2010-04-26 | 보라시스(주) | 음성패킷망 품질측정 방법 |
-
1997
- 1997-03-04 KR KR1019970007010A patent/KR100248123B1/ko not_active IP Right Cessation
- 1997-08-27 US US08/918,119 patent/US5905274A/en not_active Expired - Lifetime
-
1998
- 1998-02-19 JP JP10037670A patent/JPH10256561A/ja active Pending
- 1998-02-27 FR FR9802396A patent/FR2761808B1/fr not_active Expired - Lifetime
- 1998-03-02 GB GB9804417A patent/GB2322968B/en not_active Expired - Lifetime
- 1998-03-03 DE DE19808989A patent/DE19808989B4/de not_active Expired - Lifetime
-
1999
- 1999-02-02 US US09/243,556 patent/US6340610B1/en not_active Expired - Lifetime
-
2001
- 2001-08-29 US US09/940,504 patent/US20020009838A1/en not_active Abandoned
-
2002
- 2002-05-28 US US10/154,955 patent/US6548829B2/en not_active Expired - Lifetime
-
2003
- 2003-03-04 US US10/377,732 patent/US6815321B2/en not_active Ceased
-
2004
- 2004-06-22 US US10/872,527 patent/US7176489B2/en not_active Expired - Lifetime
-
2009
- 2009-07-24 JP JP2009173049A patent/JP2009290223A/ja active Pending
-
2010
- 2010-02-05 JP JP2010024490A patent/JP2010147494A/ja active Pending
-
2012
- 2012-10-05 US US13/646,603 patent/USRE45841E1/en not_active Expired - Fee Related
- 2012-10-05 US US13/646,594 patent/USRE45579E1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH10256561A (ja) | 1998-09-25 |
GB2322968B (en) | 1999-09-29 |
US20020009838A1 (en) | 2002-01-24 |
USRE45841E1 (en) | 2016-01-12 |
US20030164520A1 (en) | 2003-09-04 |
US6340610B1 (en) | 2002-01-22 |
US7176489B2 (en) | 2007-02-13 |
USRE45579E1 (en) | 2015-06-23 |
DE19808989A1 (de) | 1998-09-10 |
KR19980072296A (ko) | 1998-11-05 |
KR100248123B1 (ko) | 2000-03-15 |
US6548829B2 (en) | 2003-04-15 |
US20040229413A1 (en) | 2004-11-18 |
US20020140034A1 (en) | 2002-10-03 |
JP2010147494A (ja) | 2010-07-01 |
DE19808989B4 (de) | 2004-07-01 |
US5905274A (en) | 1999-05-18 |
GB9804417D0 (en) | 1998-04-29 |
US6815321B2 (en) | 2004-11-09 |
JP2009290223A (ja) | 2009-12-10 |
FR2761808A1 (fr) | 1998-10-09 |
GB2322968A (en) | 1998-09-09 |
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