EP1441361A3 - Dispositif de mémoire à semiconducteurs non volatile - Google Patents
Dispositif de mémoire à semiconducteurs non volatile Download PDFInfo
- Publication number
- EP1441361A3 EP1441361A3 EP03257638A EP03257638A EP1441361A3 EP 1441361 A3 EP1441361 A3 EP 1441361A3 EP 03257638 A EP03257638 A EP 03257638A EP 03257638 A EP03257638 A EP 03257638A EP 1441361 A3 EP1441361 A3 EP 1441361A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- memory cell
- resistive element
- selection transistor
- variable resistive
- column direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0007—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising metal oxide memory material, e.g. perovskites
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
- G11C11/15—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0023—Address circuits or decoders
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0069—Writing or programming circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0069—Writing or programming circuits or methods
- G11C2013/009—Write using potential difference applied between cell electrodes
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/30—Resistive cell, memory material aspects
- G11C2213/31—Material having complex metal oxide, e.g. perovskite structure
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/79—Array wherein the access device being a transistor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002353734A JP2004185755A (ja) | 2002-12-05 | 2002-12-05 | 不揮発性半導体記憶装置 |
JP2002353734 | 2002-12-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1441361A2 EP1441361A2 (fr) | 2004-07-28 |
EP1441361A3 true EP1441361A3 (fr) | 2006-11-02 |
Family
ID=32588091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03257638A Withdrawn EP1441361A3 (fr) | 2002-12-05 | 2003-12-04 | Dispositif de mémoire à semiconducteurs non volatile |
Country Status (6)
Country | Link |
---|---|
US (1) | US7016222B2 (fr) |
EP (1) | EP1441361A3 (fr) |
JP (1) | JP2004185755A (fr) |
KR (1) | KR100692262B1 (fr) |
CN (1) | CN100392758C (fr) |
TW (1) | TWI235382B (fr) |
Families Citing this family (85)
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US20060068099A1 (en) * | 2004-09-30 | 2006-03-30 | Sharp Laboratories Of America, Inc. | Grading PrxCa1-xMnO3 thin films by metalorganic chemical vapor deposition |
WO2006035326A1 (fr) * | 2004-09-30 | 2006-04-06 | Koninklijke Philips Electronics N.V. | Circuit integre pourvu de cellules de memoires comprenant une resistance programmable et procede d'adressage de cellules de memoire comprenant une resistance programmable |
US7339813B2 (en) * | 2004-09-30 | 2008-03-04 | Sharp Laboratories Of America, Inc. | Complementary output resistive memory cell |
JP2006114087A (ja) * | 2004-10-13 | 2006-04-27 | Sony Corp | 記憶装置及び半導体装置 |
US20060081466A1 (en) * | 2004-10-15 | 2006-04-20 | Makoto Nagashima | High uniformity 1-D multiple magnet magnetron source |
US20060081467A1 (en) * | 2004-10-15 | 2006-04-20 | Makoto Nagashima | Systems and methods for magnetron deposition |
US7425504B2 (en) * | 2004-10-15 | 2008-09-16 | 4D-S Pty Ltd. | Systems and methods for plasma etching |
US7935958B2 (en) | 2004-10-22 | 2011-05-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US7781758B2 (en) | 2004-10-22 | 2010-08-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP2006148088A (ja) * | 2004-10-22 | 2006-06-08 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
JP5030131B2 (ja) | 2004-12-28 | 2012-09-19 | エスケーハイニックス株式会社 | ナンドフラッシュメモリ素子 |
US7170775B2 (en) * | 2005-01-06 | 2007-01-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | MRAM cell with reduced write current |
US7289350B2 (en) * | 2005-04-05 | 2007-10-30 | Infineon Technologies Ag | Electronic device with a memory cell |
US7269044B2 (en) * | 2005-04-22 | 2007-09-11 | Micron Technology, Inc. | Method and apparatus for accessing a memory array |
KR100937564B1 (ko) | 2005-06-20 | 2010-01-19 | 후지쯔 가부시끼가이샤 | 비휘발성 반도체 기억 장치 및 그 기입 방법 |
WO2006137111A1 (fr) * | 2005-06-20 | 2006-12-28 | Fujitsu Limited | Memoire a semi-conducteurs non volatile et procede d'ecriture pour une telle memoire |
US7426128B2 (en) * | 2005-07-11 | 2008-09-16 | Sandisk 3D Llc | Switchable resistive memory with opposite polarity write pulses |
US20070084716A1 (en) * | 2005-10-16 | 2007-04-19 | Makoto Nagashima | Back-biased face target sputtering based high density non-volatile data storage |
US20070084717A1 (en) * | 2005-10-16 | 2007-04-19 | Makoto Nagashima | Back-biased face target sputtering based high density non-volatile caching data storage |
US7286395B2 (en) * | 2005-10-27 | 2007-10-23 | Grandis, Inc. | Current driven switched magnetic storage cells having improved read and write margins and magnetic memories using such cells |
US7355889B2 (en) * | 2005-12-19 | 2008-04-08 | Sandisk Corporation | Method for programming non-volatile memory with reduced program disturb using modified pass voltages |
KR100735525B1 (ko) | 2006-01-04 | 2007-07-04 | 삼성전자주식회사 | 상변화 메모리 장치 |
JP2007184063A (ja) | 2006-01-10 | 2007-07-19 | Renesas Technology Corp | 不揮発性半導体記憶装置 |
US8395199B2 (en) | 2006-03-25 | 2013-03-12 | 4D-S Pty Ltd. | Systems and methods for fabricating self-aligned memory cell |
EP1850378A3 (fr) * | 2006-04-28 | 2013-08-07 | Semiconductor Energy Laboratory Co., Ltd. | Dispositif à mémoire et dispositif à semi-conducteur |
JP4129274B2 (ja) | 2006-05-18 | 2008-08-06 | シャープ株式会社 | 半導体記憶装置 |
KR100727650B1 (ko) * | 2006-06-13 | 2007-06-13 | 광주과학기술원 | 에피택시 버퍼층을 이용한 비휘발성 기억소자 및 그제조방법 |
JP4460552B2 (ja) * | 2006-07-04 | 2010-05-12 | シャープ株式会社 | 半導体記憶装置 |
JP4865433B2 (ja) | 2006-07-12 | 2012-02-01 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
US7932548B2 (en) | 2006-07-14 | 2011-04-26 | 4D-S Pty Ltd. | Systems and methods for fabricating self-aligned memory cell |
US8454810B2 (en) | 2006-07-14 | 2013-06-04 | 4D-S Pty Ltd. | Dual hexagonal shaped plasma source |
US20080011603A1 (en) * | 2006-07-14 | 2008-01-17 | Makoto Nagashima | Ultra high vacuum deposition of PCMO material |
JP4987386B2 (ja) * | 2006-08-16 | 2012-07-25 | 株式会社東芝 | 抵抗変化素子を有する半導体メモリ |
JP4344372B2 (ja) | 2006-08-22 | 2009-10-14 | シャープ株式会社 | 半導体記憶装置及びその駆動方法 |
US8308915B2 (en) | 2006-09-14 | 2012-11-13 | 4D-S Pty Ltd. | Systems and methods for magnetron deposition |
JP2008091703A (ja) * | 2006-10-03 | 2008-04-17 | Toshiba Corp | 半導体記憶装置 |
JP4137994B2 (ja) | 2006-11-20 | 2008-08-20 | 松下電器産業株式会社 | 不揮発性記憶素子、不揮発性記憶素子アレイおよびその製造方法 |
KR100795350B1 (ko) * | 2006-11-24 | 2008-01-17 | 삼성전자주식회사 | 비휘발성 메모리 장치, 그 제조 방법 및 동작 방법. |
KR100799721B1 (ko) | 2006-11-30 | 2008-02-01 | 삼성전자주식회사 | 비휘발성 메모리 장치, 그 제조 방법 및 동작 방법. |
KR100868101B1 (ko) | 2007-01-08 | 2008-11-11 | 삼성전자주식회사 | 반도체 메모리 장치 |
JP5091491B2 (ja) * | 2007-01-23 | 2012-12-05 | 株式会社東芝 | 不揮発性半導体記憶装置 |
KR100898897B1 (ko) | 2007-02-16 | 2009-05-27 | 삼성전자주식회사 | 비휘발성 메모리 소자 및 그 형성방법 |
WO2008120333A1 (fr) * | 2007-03-28 | 2008-10-09 | Fujitsu Limited | Mémoire à résistance variable et son procédé d'écriture de données |
JP4288376B2 (ja) | 2007-04-24 | 2009-07-01 | スパンション エルエルシー | 不揮発性記憶装置およびその制御方法 |
JP2008276858A (ja) * | 2007-04-27 | 2008-11-13 | Spansion Llc | 不揮発性記憶装置及びそのバイアス制御方法 |
JP2009146478A (ja) * | 2007-12-12 | 2009-07-02 | Sony Corp | 記憶装置および情報再記録方法 |
US7995378B2 (en) * | 2007-12-19 | 2011-08-09 | Qualcomm Incorporated | MRAM device with shared source line |
US7872907B2 (en) * | 2007-12-28 | 2011-01-18 | Renesas Electronics Corporation | Semiconductor device |
JP5150936B2 (ja) * | 2007-12-28 | 2013-02-27 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
KR101543434B1 (ko) * | 2008-12-15 | 2015-08-10 | 삼성전자주식회사 | 반도체 메모리 시스템의 제조 방법 |
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CN102024494B (zh) * | 2009-09-11 | 2014-01-08 | 中芯国际集成电路制造(上海)有限公司 | 绿色晶体管、电阻随机存储器及其驱动方法 |
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JP5204825B2 (ja) | 2010-09-17 | 2013-06-05 | シャープ株式会社 | 半導体記憶装置 |
KR101847890B1 (ko) * | 2010-10-12 | 2018-04-12 | 삼성세미콘덕터, 인코포레이티드 | 슈도 페이지 모드 메모리 아키텍쳐 및 방법 |
US8964458B2 (en) * | 2012-04-13 | 2015-02-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Differential MRAM structure with relatively reversed magnetic tunnel junction elements enabling writing using same polarity current |
US10037801B2 (en) | 2013-12-06 | 2018-07-31 | Hefei Reliance Memory Limited | 2T-1R architecture for resistive RAM |
JP5700602B1 (ja) * | 2014-02-05 | 2015-04-15 | ウィンボンド エレクトロニクス コーポレーション | 不揮発性半導体メモリ |
TWI544670B (zh) * | 2014-03-26 | 2016-08-01 | 華邦電子股份有限公司 | 非揮發性記憶體元件及其製造方法 |
KR20150117494A (ko) * | 2014-04-10 | 2015-10-20 | 에스케이하이닉스 주식회사 | 전자 장치 |
KR102154076B1 (ko) * | 2014-04-10 | 2020-09-10 | 에스케이하이닉스 주식회사 | 전자 장치 |
CN105023925B (zh) * | 2014-04-15 | 2017-10-20 | 华邦电子股份有限公司 | 非易失性存储器元件及其制造方法 |
KR20150124032A (ko) * | 2014-04-25 | 2015-11-05 | 에스케이하이닉스 주식회사 | 전자 장치 |
KR20150124033A (ko) | 2014-04-25 | 2015-11-05 | 에스케이하이닉스 주식회사 | 전자 장치 |
TWI581264B (zh) * | 2014-05-07 | 2017-05-01 | 旺宏電子股份有限公司 | 電阻式記憶體及其操作方法 |
US20170287540A1 (en) * | 2014-09-25 | 2017-10-05 | Hewlett Packard Enterprise Development Lp | Crosspoint array decoder |
US9299430B1 (en) * | 2015-01-22 | 2016-03-29 | Nantero Inc. | Methods for reading and programming 1-R resistive change element arrays |
US10008537B2 (en) * | 2015-06-19 | 2018-06-26 | Qualcomm Incorporated | Complementary magnetic tunnel junction (MTJ) bit cell with shared bit line |
CN105118528B (zh) * | 2015-07-14 | 2017-11-24 | 江苏时代全芯存储科技有限公司 | 非挥发性记忆装置、可编程电路以及内容可定址记忆体 |
TWI665672B (zh) * | 2016-09-13 | 2019-07-11 | 東芝記憶體股份有限公司 | Semiconductor memory device |
FR3066323B1 (fr) * | 2017-05-12 | 2019-11-01 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Memoire non volatile favorisant une grande densite d'integration |
TWI674580B (zh) | 2019-02-15 | 2019-10-11 | 華邦電子股份有限公司 | 電阻式記憶體電路 |
CN111681694B (zh) * | 2019-03-11 | 2022-05-17 | 华邦电子股份有限公司 | 电阻式存储器电路 |
CN110277115B (zh) * | 2019-06-24 | 2021-01-01 | 中国科学院微电子研究所 | 基于磁隧道结的存储器及其读写方法、制作方法 |
US11901002B2 (en) * | 2021-12-01 | 2024-02-13 | International Business Machines Corporation | RRAM filament spatial localization using a laser stimulation |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5070385A (en) * | 1989-10-20 | 1991-12-03 | Radiant Technologies | Ferroelectric non-volatile variable resistive element |
US5541870A (en) * | 1994-10-28 | 1996-07-30 | Symetrix Corporation | Ferroelectric memory and non-volatile memory cell for same |
WO1998033184A1 (fr) * | 1997-01-27 | 1998-07-30 | Radiant Technologies, Inc. | Systeme a cellule de reference pour memoires axees sur des cellules de memoire ferro-electriques |
US5792569A (en) * | 1996-03-19 | 1998-08-11 | International Business Machines Corporation | Magnetic devices and sensors based on perovskite manganese oxide materials |
US5926412A (en) * | 1992-02-09 | 1999-07-20 | Raytheon Company | Ferroelectric memory structure |
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JP3315293B2 (ja) * | 1995-01-05 | 2002-08-19 | 株式会社東芝 | 半導体記憶装置 |
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JP4656720B2 (ja) | 2000-09-25 | 2011-03-23 | ルネサスエレクトロニクス株式会社 | 薄膜磁性体記憶装置 |
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JP4219141B2 (ja) * | 2002-09-13 | 2009-02-04 | 株式会社ルネサステクノロジ | 薄膜磁性体記憶装置 |
JP4212325B2 (ja) * | 2002-09-30 | 2009-01-21 | 株式会社ルネサステクノロジ | 不揮発性記憶装置 |
-
2002
- 2002-12-05 JP JP2002353734A patent/JP2004185755A/ja active Pending
-
2003
- 2003-12-04 EP EP03257638A patent/EP1441361A3/fr not_active Withdrawn
- 2003-12-05 US US10/729,310 patent/US7016222B2/en not_active Expired - Lifetime
- 2003-12-05 TW TW092134352A patent/TWI235382B/zh not_active IP Right Cessation
- 2003-12-05 CN CNB2003101201086A patent/CN100392758C/zh not_active Expired - Lifetime
- 2003-12-05 KR KR1020030087809A patent/KR100692262B1/ko active IP Right Grant
Patent Citations (5)
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US5070385A (en) * | 1989-10-20 | 1991-12-03 | Radiant Technologies | Ferroelectric non-volatile variable resistive element |
US5926412A (en) * | 1992-02-09 | 1999-07-20 | Raytheon Company | Ferroelectric memory structure |
US5541870A (en) * | 1994-10-28 | 1996-07-30 | Symetrix Corporation | Ferroelectric memory and non-volatile memory cell for same |
US5792569A (en) * | 1996-03-19 | 1998-08-11 | International Business Machines Corporation | Magnetic devices and sensors based on perovskite manganese oxide materials |
WO1998033184A1 (fr) * | 1997-01-27 | 1998-07-30 | Radiant Technologies, Inc. | Systeme a cellule de reference pour memoires axees sur des cellules de memoire ferro-electriques |
Also Published As
Publication number | Publication date |
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US20040130939A1 (en) | 2004-07-08 |
JP2004185755A (ja) | 2004-07-02 |
US7016222B2 (en) | 2006-03-21 |
CN1505042A (zh) | 2004-06-16 |
KR20040049286A (ko) | 2004-06-11 |
TWI235382B (en) | 2005-07-01 |
EP1441361A2 (fr) | 2004-07-28 |
CN100392758C (zh) | 2008-06-04 |
KR100692262B1 (ko) | 2007-03-09 |
TW200425148A (en) | 2004-11-16 |
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