EP1413646A3 - Verfahren zur stromlosen Abscheidung von Metallen - Google Patents

Verfahren zur stromlosen Abscheidung von Metallen Download PDF

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Publication number
EP1413646A3
EP1413646A3 EP03013706A EP03013706A EP1413646A3 EP 1413646 A3 EP1413646 A3 EP 1413646A3 EP 03013706 A EP03013706 A EP 03013706A EP 03013706 A EP03013706 A EP 03013706A EP 1413646 A3 EP1413646 A3 EP 1413646A3
Authority
EP
European Patent Office
Prior art keywords
electroless plating
metals
electrolyte
less
films
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP03013706A
Other languages
English (en)
French (fr)
Other versions
EP1413646B2 (de
EP1413646A2 (de
EP1413646B1 (de
Inventor
Franz-Josef Stark
Helmut Horsthemke
Ulrich Treuner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=32010257&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP1413646(A3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Enthone Inc filed Critical Enthone Inc
Publication of EP1413646A2 publication Critical patent/EP1413646A2/de
Publication of EP1413646A3 publication Critical patent/EP1413646A3/de
Application granted granted Critical
Publication of EP1413646B1 publication Critical patent/EP1413646B1/de
Publication of EP1413646B2 publication Critical patent/EP1413646B2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54Contact plating, i.e. electroless electrochemical plating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1617Purification and regeneration of coating baths
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1655Process features
    • C23C18/1662Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

Die Erfindung betrifft einen Elektrolyten zur stromlosen Abscheidung von Metallschichten mit Druckeigenspannungen, enthaltend ein Metallbasissalz, ein Reduktionsmittel, einen Komplexbildner, Beschleuniger und einen Stabilisator. Um einen Elektrolyten der vorgenannten Art bereitzustellen, aus dem längeren Zeitraum gleichmäßige, poren- und rißfreie Metall-Phosphor-Überzüge mit konstanten Schichteigenschaften und hohen Phosphorgehalten, bei einer erhöhten Abscheidegeschwindigkeit, abgeschieden werden können, wird mit der Erfindung vorgeschlagen, daß der Elektrolyt als Metallbasissalz ein Metallsalz aufweist, dessen Anionen mindestens ein Kohlenstoffatom enthalten und daß in einer Ausgangskonzentration von 0,01 bis 0,3 mol/l vorliegt. Als Metallsalz dessen Anionen mindestens ein Kohlenstoffatom enthalten, wird mindestens ein Salz aus der Gruppe bestehend aus Metallacetat, Metallformiat, Metalloxalat, Metallpropionat, Metallcitrat und Metallascorbiat, besonders bevorzugt Metallacetat eingesetzt. Zudem wird ein insbesondere für die Anwendung des vorangegangenen Elektrolyten geeignetes Verfahren offenbart, wobei dieses Verfahren vorteilhafterweise einen geschlossenen Stoffkreislauf aufweist. Durch den Einsatz der Erfindung werden insbesondere poren- und rißfreie Metallüberzüge mit konstanten Schichteigenschaften über einen Anwendungszeitraum des Bades von mindestens 14 - 22 MTO gleichmäßig abgeschieden.
EP03013706.1A 2002-10-04 2003-06-17 Verfahren zur stromlosen Abscheidung von Metallen Expired - Lifetime EP1413646B2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10246453 2002-10-04
DE10246453A DE10246453A1 (de) 2002-10-04 2002-10-04 Verfahren zur stromlosen Abscheidung von Nickel

Publications (4)

Publication Number Publication Date
EP1413646A2 EP1413646A2 (de) 2004-04-28
EP1413646A3 true EP1413646A3 (de) 2008-01-16
EP1413646B1 EP1413646B1 (de) 2011-02-16
EP1413646B2 EP1413646B2 (de) 2014-09-24

Family

ID=32010257

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03013706.1A Expired - Lifetime EP1413646B2 (de) 2002-10-04 2003-06-17 Verfahren zur stromlosen Abscheidung von Metallen

Country Status (8)

Country Link
US (1) US7846503B2 (de)
EP (1) EP1413646B2 (de)
JP (1) JP4091518B2 (de)
KR (1) KR101063851B1 (de)
CN (1) CN100366795C (de)
AT (1) ATE498707T1 (de)
DE (2) DE10246453A1 (de)
ES (1) ES2357943T5 (de)

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DE102004002778C5 (de) * 2004-01-20 2017-04-20 Enthone Inc. Verfahren zur Regenerierung von Metallisierungsbädern
US7410899B2 (en) * 2005-09-20 2008-08-12 Enthone, Inc. Defectivity and process control of electroless deposition in microelectronics applications
US20080041734A1 (en) * 2005-09-22 2008-02-21 Bergelson Alan P Jewelry display apparatus
JP4740724B2 (ja) * 2005-12-01 2011-08-03 コーア株式会社 抵抗体の形成方法及び金属被膜固定抵抗器の形成方法
CN100412232C (zh) * 2006-01-13 2008-08-20 厦门大学 镁合金表面化学镀镍硼合金的方法
EP1816237A1 (de) * 2006-02-02 2007-08-08 Enthone, Inc. Verfahren und Vorrichtung zur Beschichtung von Substratoberflächen
CN100402699C (zh) * 2006-03-15 2008-07-16 厦门大学 一种镁合金表面化学镀镍硼合金的方法
US8317909B2 (en) * 2007-06-05 2012-11-27 Dfhs, Llc Compositions and processes for deposition of metal ions onto surfaces of conductive substrates
EP2270255A1 (de) 2009-07-03 2011-01-05 Enthone, Inc. Beta-Aminosäure enthaltend Elektrolyt und Verfahren zur Ablagerung einer Metallschicht
EP2449148B1 (de) * 2009-07-03 2019-01-02 MacDermid Enthone Inc. Beta-aminosäure mit elektrolyt und verfahren zur ablagerung einer metallschicht
KR20120034104A (ko) * 2009-07-16 2012-04-09 램 리써치 코포레이션 무전해 성막 용액 및 프로세스 제어
US20110192316A1 (en) * 2010-02-05 2011-08-11 E-Chem Enterprise Corp. Electroless plating solution for providing solar cell electrode
DE102010062357B4 (de) 2010-12-02 2013-08-14 Innovent E.V. Vorrichtung und Verfahren zur Herstellung eines mit zumindest einer Korrosionsschutzschicht beschichteten magnesiumhaltigen Substrats
CN102268658A (zh) * 2011-07-22 2011-12-07 深圳市精诚达电路有限公司 一种化学镀镍液及化学镀镍工艺
ES2663684T3 (es) * 2012-07-17 2018-04-16 Coventya, Inc. Recubrimientos de níquel producidos por reducción química y composiciones y métodos para formar los recubrimientos
EP2845928B1 (de) * 2013-09-05 2019-11-06 MacDermid Enthone Inc. Wässrige Elektrolytzusammensetzung mit reduzierter luftgetragener Emission
US11685999B2 (en) 2014-06-02 2023-06-27 Macdermid Acumen, Inc. Aqueous electroless nickel plating bath and method of using the same
US9708693B2 (en) * 2014-06-03 2017-07-18 Macdermid Acumen, Inc. High phosphorus electroless nickel
US9962522B2 (en) 2014-10-29 2018-05-08 Professional Plating, Inc. Braid plating method for torsional stiffness
US20170051411A1 (en) * 2015-08-20 2017-02-23 Macdermid Acumen, Inc. Electroless Silver Plating Bath and Method of Using the Same
EP3156517B1 (de) 2015-10-13 2018-12-05 MacDermid Enthone Inc. Verwendung von wasserlöslichen und luftstabilen phosphaadamantanen als stabilisator in elektrolyten für stromlose metallabscheidung
EP3255175A1 (de) 2016-06-07 2017-12-13 MacDermid Enthone Inc. Verwendung von wasserlöslichen lanthanidverbindungen als stabilisator in elektrolyten zur stromlosen metallabscheidung
US10856905B2 (en) 2016-10-14 2020-12-08 Pacesetter, Inc. Catheter-based system for delivery and retrieval of a leadless pacemaker
US10351715B2 (en) * 2017-03-30 2019-07-16 The United States Of America As Represented By The Secretary Of The Navy Synergistic metal polycarboxylate corrosion inhibitors
US10960217B2 (en) 2017-03-31 2021-03-30 Pacesetter, Inc. Catheter-based delivery system for delivering a leadless pacemaker and employing a locking hub
DE102017125954A1 (de) * 2017-11-07 2019-05-09 RIAG Oberflächentechnik AG Außen stromloses Verfahren zur Erzeugung einer Nickellegierung und entsprechender Elektrolyt
CN110318045A (zh) * 2019-06-20 2019-10-11 深圳市宏达秋科技有限公司 一种高稳定性化学镀镍液及其制备方法
CN110318046A (zh) * 2019-06-20 2019-10-11 深圳市宏达秋科技有限公司 一种高耐蚀性化学镀镍液及其制备方法
CN117187792A (zh) * 2023-08-10 2023-12-08 中山博美新材料科技有限公司 一种铝合金高磷化学沉镍液及其使用方法与应用

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US2694017A (en) * 1952-09-16 1954-11-09 Gen American Transporation Cor Process of chemical nickel plating of aluminum and its alloys and baths therefor
US3597266A (en) * 1968-09-23 1971-08-03 Enthone Electroless nickel plating
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DE4005088A1 (de) * 1989-02-27 1990-08-30 Omi Int Corp Plattierungszusammensetzung und verfahren

Also Published As

Publication number Publication date
JP2004124261A (ja) 2004-04-22
DE50313472D1 (de) 2011-03-31
ATE498707T1 (de) 2011-03-15
JP4091518B2 (ja) 2008-05-28
EP1413646B2 (de) 2014-09-24
DE10246453A1 (de) 2004-04-15
CN1497062A (zh) 2004-05-19
EP1413646A2 (de) 2004-04-28
ES2357943T5 (es) 2015-11-25
KR101063851B1 (ko) 2011-09-14
US20040144285A1 (en) 2004-07-29
US7846503B2 (en) 2010-12-07
CN100366795C (zh) 2008-02-06
ES2357943T3 (es) 2011-05-04
KR20040031629A (ko) 2004-04-13
EP1413646B1 (de) 2011-02-16

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