ATE498707T1 - Verfahren zur stromlosen abscheidung von metallen - Google Patents

Verfahren zur stromlosen abscheidung von metallen

Info

Publication number
ATE498707T1
ATE498707T1 AT03013706T AT03013706T ATE498707T1 AT E498707 T1 ATE498707 T1 AT E498707T1 AT 03013706 T AT03013706 T AT 03013706T AT 03013706 T AT03013706 T AT 03013706T AT E498707 T1 ATE498707 T1 AT E498707T1
Authority
AT
Austria
Prior art keywords
metals
electrolyte
less
electroless plating
films
Prior art date
Application number
AT03013706T
Other languages
English (en)
Inventor
Franz-Josef Stark
Helmut Horsthemke
Ulrich Treuner
Original Assignee
Enthone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=32010257&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE498707(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Enthone filed Critical Enthone
Application granted granted Critical
Publication of ATE498707T1 publication Critical patent/ATE498707T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
AT03013706T 2002-10-04 2003-06-17 Verfahren zur stromlosen abscheidung von metallen ATE498707T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10246453A DE10246453A1 (de) 2002-10-04 2002-10-04 Verfahren zur stromlosen Abscheidung von Nickel

Publications (1)

Publication Number Publication Date
ATE498707T1 true ATE498707T1 (de) 2011-03-15

Family

ID=32010257

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03013706T ATE498707T1 (de) 2002-10-04 2003-06-17 Verfahren zur stromlosen abscheidung von metallen

Country Status (8)

Country Link
US (1) US7846503B2 (de)
EP (1) EP1413646B2 (de)
JP (1) JP4091518B2 (de)
KR (1) KR101063851B1 (de)
CN (1) CN100366795C (de)
AT (1) ATE498707T1 (de)
DE (2) DE10246453A1 (de)
ES (1) ES2357943T5 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004002778C5 (de) * 2004-01-20 2017-04-20 Enthone Inc. Verfahren zur Regenerierung von Metallisierungsbädern
US7410899B2 (en) * 2005-09-20 2008-08-12 Enthone, Inc. Defectivity and process control of electroless deposition in microelectronics applications
US20080041734A1 (en) * 2005-09-22 2008-02-21 Bergelson Alan P Jewelry display apparatus
JP4740724B2 (ja) * 2005-12-01 2011-08-03 コーア株式会社 抵抗体の形成方法及び金属被膜固定抵抗器の形成方法
CN100412232C (zh) * 2006-01-13 2008-08-20 厦门大学 镁合金表面化学镀镍硼合金的方法
EP1816237A1 (de) * 2006-02-02 2007-08-08 Enthone, Inc. Verfahren und Vorrichtung zur Beschichtung von Substratoberflächen
CN100402699C (zh) * 2006-03-15 2008-07-16 厦门大学 一种镁合金表面化学镀镍硼合金的方法
US8317909B2 (en) * 2007-06-05 2012-11-27 Dfhs, Llc Compositions and processes for deposition of metal ions onto surfaces of conductive substrates
EP2270255A1 (de) 2009-07-03 2011-01-05 Enthone, Inc. Beta-Aminosäure enthaltend Elektrolyt und Verfahren zur Ablagerung einer Metallschicht
EP2449148B1 (de) * 2009-07-03 2019-01-02 MacDermid Enthone Inc. Beta-aminosäure mit elektrolyt und verfahren zur ablagerung einer metallschicht
KR20120034104A (ko) * 2009-07-16 2012-04-09 램 리써치 코포레이션 무전해 성막 용액 및 프로세스 제어
US20110192316A1 (en) * 2010-02-05 2011-08-11 E-Chem Enterprise Corp. Electroless plating solution for providing solar cell electrode
DE102010062357B4 (de) 2010-12-02 2013-08-14 Innovent E.V. Vorrichtung und Verfahren zur Herstellung eines mit zumindest einer Korrosionsschutzschicht beschichteten magnesiumhaltigen Substrats
CN102268658A (zh) * 2011-07-22 2011-12-07 深圳市精诚达电路有限公司 一种化学镀镍液及化学镀镍工艺
ES2663684T3 (es) * 2012-07-17 2018-04-16 Coventya, Inc. Recubrimientos de níquel producidos por reducción química y composiciones y métodos para formar los recubrimientos
EP2845928B1 (de) * 2013-09-05 2019-11-06 MacDermid Enthone Inc. Wässrige Elektrolytzusammensetzung mit reduzierter luftgetragener Emission
US11685999B2 (en) 2014-06-02 2023-06-27 Macdermid Acumen, Inc. Aqueous electroless nickel plating bath and method of using the same
US9708693B2 (en) * 2014-06-03 2017-07-18 Macdermid Acumen, Inc. High phosphorus electroless nickel
US9962522B2 (en) 2014-10-29 2018-05-08 Professional Plating, Inc. Braid plating method for torsional stiffness
US20170051411A1 (en) * 2015-08-20 2017-02-23 Macdermid Acumen, Inc. Electroless Silver Plating Bath and Method of Using the Same
EP3156517B1 (de) 2015-10-13 2018-12-05 MacDermid Enthone Inc. Verwendung von wasserlöslichen und luftstabilen phosphaadamantanen als stabilisator in elektrolyten für stromlose metallabscheidung
EP3255175A1 (de) 2016-06-07 2017-12-13 MacDermid Enthone Inc. Verwendung von wasserlöslichen lanthanidverbindungen als stabilisator in elektrolyten zur stromlosen metallabscheidung
US10856905B2 (en) 2016-10-14 2020-12-08 Pacesetter, Inc. Catheter-based system for delivery and retrieval of a leadless pacemaker
US10351715B2 (en) * 2017-03-30 2019-07-16 The United States Of America As Represented By The Secretary Of The Navy Synergistic metal polycarboxylate corrosion inhibitors
US10960217B2 (en) 2017-03-31 2021-03-30 Pacesetter, Inc. Catheter-based delivery system for delivering a leadless pacemaker and employing a locking hub
DE102017125954A1 (de) * 2017-11-07 2019-05-09 RIAG Oberflächentechnik AG Außen stromloses Verfahren zur Erzeugung einer Nickellegierung und entsprechender Elektrolyt
CN110318045A (zh) * 2019-06-20 2019-10-11 深圳市宏达秋科技有限公司 一种高稳定性化学镀镍液及其制备方法
CN110318046A (zh) * 2019-06-20 2019-10-11 深圳市宏达秋科技有限公司 一种高耐蚀性化学镀镍液及其制备方法
CN117187792A (zh) * 2023-08-10 2023-12-08 中山博美新材料科技有限公司 一种铝合金高磷化学沉镍液及其使用方法与应用

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2694017A (en) * 1952-09-16 1954-11-09 Gen American Transporation Cor Process of chemical nickel plating of aluminum and its alloys and baths therefor
US3060059A (en) * 1961-05-19 1962-10-23 Goodyear Aircraft Corp Electroless nickel-phosphorous alloy plating bath and method
GB1243134A (en) 1968-07-29 1971-08-18 Texas Instruments Inc Chemical nickel plating bath and process
US3597266A (en) * 1968-09-23 1971-08-03 Enthone Electroless nickel plating
US3597267A (en) * 1969-02-26 1971-08-03 Allied Res Prod Inc Bath and process for chemical metal plating
US3887732A (en) * 1970-10-01 1975-06-03 Gen Am Transport Stress controlled electroless nickel deposits
DE2329429A1 (de) * 1972-06-09 1973-12-20 Imasa Konzentrat und loesung sowie verfahren zur stromlosen vernickelung
US3876434A (en) * 1972-12-07 1975-04-08 Shipley Co Replenishment of electroless nickel solutions
US4152164A (en) * 1976-04-26 1979-05-01 Michael Gulla Electroless nickel plating
US4293089A (en) * 1979-05-08 1981-10-06 The United States Of America As Represented By The United States Department Of Energy Brazing method
JPS5743978A (en) * 1980-08-27 1982-03-12 Suzuki Motor Co Ltd Nickel electroless plating method
US4483711A (en) * 1983-06-17 1984-11-20 Omi International Corporation Aqueous electroless nickel plating bath and process
JPS6421082A (en) * 1987-07-15 1989-01-24 Nippon Chemical Ind Production of powdery plated material
JPH01201484A (ja) * 1987-10-06 1989-08-14 Hitachi Ltd 化学ニッケルめっき液及びその使用方法
JPH01123079A (ja) * 1987-11-06 1989-05-16 Minoru Tsuda 非晶質Ｎｉ−Ｐ合金
JPH01195720A (ja) * 1988-01-04 1989-08-07 Nec Corp 半導体集積回路
GB2231063A (en) * 1989-02-27 1990-11-07 Omi International Electroless plating composition containing saccharin
JPH02225776A (ja) * 1989-02-27 1990-09-07 Fujita Corp 制振壁及び制振建造物
ES2027496A6 (es) 1989-10-12 1992-06-01 Enthone Metodo para precipitar una capa metalica no electrica lisa sobre un substrato de aluminio.
JPH0693460A (ja) * 1991-04-15 1994-04-05 Mitsubishi Gas Chem Co Inc 薄膜形成基材の製造法
JP2962496B2 (ja) 1991-08-12 1999-10-12 三井金属鉱業株式会社 マグネ基合金のめっき方法
JPH0565661A (ja) * 1991-09-06 1993-03-19 Kawasaki Kasei Chem Ltd 無電解ニツケルめつき皮膜の製造法
JPH05156458A (ja) * 1991-12-06 1993-06-22 Hitachi Chem Co Ltd 無電解ニッケル−リンめっき液
JP3192003B2 (ja) 1992-10-02 2001-07-23 三井金属鉱業株式会社 マグネ基合金の高耐食性塗装方法
US5258061A (en) * 1992-11-20 1993-11-02 Monsanto Company Electroless nickel plating baths
JPH08176837A (ja) * 1994-12-22 1996-07-09 Hitachi Chem Co Ltd 無電解ニッケルリンめっき液
JPH09137277A (ja) * 1995-11-10 1997-05-27 Ibiden Co Ltd 無電解めっき液、無電解めっき方法およびプリント配線板の製造方法
WO1997046326A1 (en) * 1996-06-05 1997-12-11 The University Of Toledo Electroless plating of a metal layer on an activated substrate
JP2000503354A (ja) * 1996-11-14 2000-03-21 アトテク ドイツェラント ゲーエムベーハー 無電解ニッケルめっき浴からのオルト亜燐酸塩イオンの除去
US6106927A (en) * 1998-02-03 2000-08-22 Seagate Technology, Inc. Ultra-smooth as-deposited electroless nickel coatings
JP2001049448A (ja) * 1999-08-09 2001-02-20 C Uyemura & Co Ltd 無電解ニッケルめっき方法
FR2798677B1 (fr) * 1999-09-22 2001-12-21 A Richard Ets Procede d'epuration/regenaration d'un bain de nickelage chimique
JP2001192850A (ja) * 2000-01-11 2001-07-17 Ebe Katsuo 摺動部品用表面処理液及び摺動部品の表面処理方法及び摺動部品
JP2001214279A (ja) 2000-01-28 2001-08-07 Kyocera Corp 無電解ニッケルめっき浴
JP3479639B2 (ja) * 2000-12-08 2003-12-15 日鉱メタルプレーティング株式会社 無電解ニッケルめっき液
JP2002212746A (ja) * 2001-01-11 2002-07-31 Okuno Chem Ind Co Ltd 未貫通穴を有する被めっき物への無電解ニッケルめっき方法
US6391177B1 (en) * 2001-02-20 2002-05-21 David Crotty High temperature continuous electrodialysis of electroless plating solutions
JP4171604B2 (ja) * 2002-03-18 2008-10-22 株式会社大和化成研究所 無電解めっき浴及び該めっき浴を用いて得られた金属被覆物

Also Published As

Publication number Publication date
JP2004124261A (ja) 2004-04-22
DE50313472D1 (de) 2011-03-31
JP4091518B2 (ja) 2008-05-28
EP1413646B2 (de) 2014-09-24
EP1413646A3 (de) 2008-01-16
DE10246453A1 (de) 2004-04-15
CN1497062A (zh) 2004-05-19
EP1413646A2 (de) 2004-04-28
ES2357943T5 (es) 2015-11-25
KR101063851B1 (ko) 2011-09-14
US20040144285A1 (en) 2004-07-29
US7846503B2 (en) 2010-12-07
CN100366795C (zh) 2008-02-06
ES2357943T3 (es) 2011-05-04
KR20040031629A (ko) 2004-04-13
EP1413646B1 (de) 2011-02-16

Similar Documents

Publication Publication Date Title
ATE498707T1 (de) Verfahren zur stromlosen abscheidung von metallen
EP1095170B1 (de) Verfahren zum einsatzhärten bei niedrigen temperaturen
DE602004001802D1 (de) Vorrichtung und Verfahren zur Herstellung von Einkristallen durch Dampfphasenabscheidung
DE60225352D1 (de) Verfahren zur elektroplattierung von metallischen und metall-matrix-composite folien, beschichtungen und mikrokomponenten
US20130021882A1 (en) Method for securing a decoration to an external timepiece element and external element made in accordance with this method
JP2007152485A (ja) ソーワイヤの製造方法
TW200513546A (en) Catalyst composition and deposition method
JP2003532549A (ja) ダイヤモンド粒子の固定が改良されたニッケル／ダイヤモンド被覆ソーワイヤ
DE602004000465D1 (de) Offenporiger formkörper, verfahren zu dessen herstellung und verwendung dieses körpers
TW200730248A (en) Palladium complex and catalyst-imparting treatment solution using the same
EP1892321A3 (de) Goldlegierungs-Hartplattierungsbad
CN1463303A (zh) 复合材料及其制备方法
RU2012122109A (ru) Основа, покрытая композитом на основе химически осажденного никеля, и способ ее получения
ATE445235T1 (de) Verfahren zur herstellung von zinkpulver- agglomeraten und diese enthaltenden artikel
DE50202493D1 (de) Verfahren zur selektiven galvanisierung eines bandartigen, metallischen trägermaterials
US9376755B2 (en) Method and composition for electroless nickel and cobalt deposition
EP1821289A3 (de) Weicher magnetischer Dünnfilm, Herstellungsverfahren dafür und Magnetkopf
DE60315170D1 (de) Verfahren zur vorbehandlung einer oberfläche eines mit metall zu beschichtenden nichtleitenden materials
JP2006219727A (ja) 無電解めっき用触媒液及びそれを用いた無電解めっき方法
PT103003A (pt) Novos inibidores de metalo-enzimas com potencial aplicacao em medicina
DE60310764D1 (de) Verfahren zur herstellung substituierter,halogenierter aniline
JP3083404B2 (ja) 置換金めっき液
JP2002186395A (ja) 耐久性に優れたＡｌ合金製蹄鉄およびその製造方法
JP6771755B2 (ja) 装飾品及びその製造方法
JP6739156B2 (ja) Ｄｌｃ膜被覆部材