EE200100059A - Leeliseline tsink-nikkel galvaanimisvann - Google Patents
Leeliseline tsink-nikkel galvaanimisvannInfo
- Publication number
- EE200100059A EE200100059A EEP200100059A EEP200100059A EE200100059A EE 200100059 A EE200100059 A EE 200100059A EE P200100059 A EEP200100059 A EE P200100059A EE P200100059 A EEP200100059 A EE P200100059A EE 200100059 A EE200100059 A EE 200100059A
- Authority
- EE
- Estonia
- Prior art keywords
- plating bath
- nickel plating
- alkaline zinc
- alkaline
- zinc
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
- Battery Electrode And Active Subsutance (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19834353A DE19834353C2 (de) | 1998-07-30 | 1998-07-30 | Alkalisches Zink-Nickelbad |
PCT/EP1999/005443 WO2000006807A2 (de) | 1998-07-30 | 1999-07-29 | Alkalisches zink-nickelbad |
Publications (1)
Publication Number | Publication Date |
---|---|
EE200100059A true EE200100059A (et) | 2002-10-15 |
Family
ID=7875843
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EEP200100059A EE200100059A (et) | 1998-07-30 | 1999-07-29 | Leeliseline tsink-nikkel galvaanimisvann |
Country Status (22)
Country | Link |
---|---|
US (4) | US6602394B1 (ko) |
EP (2) | EP1102875B1 (ko) |
JP (2) | JP4716568B2 (ko) |
KR (1) | KR20010071074A (ko) |
CN (1) | CN1311830A (ko) |
AT (2) | ATE242821T1 (ko) |
AU (1) | AU5415299A (ko) |
BG (1) | BG105184A (ko) |
BR (1) | BR9912589A (ko) |
CA (1) | CA2339144A1 (ko) |
CZ (1) | CZ298904B6 (ko) |
DE (3) | DE19834353C2 (ko) |
EE (1) | EE200100059A (ko) |
ES (2) | ES2277624T3 (ko) |
HR (1) | HRP20010044B1 (ko) |
HU (1) | HUP0103951A3 (ko) |
IL (1) | IL141086A0 (ko) |
MX (1) | MXPA01000932A (ko) |
PL (1) | PL198149B1 (ko) |
SK (1) | SK285453B6 (ko) |
TR (1) | TR200100232T2 (ko) |
WO (1) | WO2000006807A2 (ko) |
Families Citing this family (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19834353C2 (de) * | 1998-07-30 | 2000-08-17 | Hillebrand Walter Gmbh & Co Kg | Alkalisches Zink-Nickelbad |
US8236159B2 (en) * | 1999-04-13 | 2012-08-07 | Applied Materials Inc. | Electrolytic process using cation permeable barrier |
US20060157355A1 (en) * | 2000-03-21 | 2006-07-20 | Semitool, Inc. | Electrolytic process using anion permeable barrier |
US8852417B2 (en) | 1999-04-13 | 2014-10-07 | Applied Materials, Inc. | Electrolytic process using anion permeable barrier |
US20060189129A1 (en) * | 2000-03-21 | 2006-08-24 | Semitool, Inc. | Method for applying metal features onto barrier layers using ion permeable barriers |
DE10026956A1 (de) * | 2000-05-30 | 2001-12-13 | Walter Hillebrand Galvanotechn | Zink-Legierungsbad |
ATE306572T1 (de) † | 2000-06-15 | 2005-10-15 | Taskem Inc | Zink-nickel-elektroplattierung |
US6755960B1 (en) | 2000-06-15 | 2004-06-29 | Taskem Inc. | Zinc-nickel electroplating |
US7628898B2 (en) * | 2001-03-12 | 2009-12-08 | Semitool, Inc. | Method and system for idle state operation |
DE10223622B4 (de) * | 2002-05-28 | 2005-12-08 | Walter Hillebrand Gmbh & Co. Kg Galvanotechnik | Alkalisches Zink-Nickelbad sowie entsprechende Galvanisierungsverfahren mit erhöhter Stromausbeute |
US8377283B2 (en) | 2002-11-25 | 2013-02-19 | Coventya, Inc. | Zinc and zinc-alloy electroplating |
DE10261493A1 (de) * | 2002-12-23 | 2004-07-08 | METAKEM Gesellschaft für Schichtchemie der Metalle mbH | Anode zur Galvanisierung |
ES2609080T3 (es) * | 2003-06-03 | 2017-04-18 | Coventya, Inc. | Revestimiento electrolítico de cinc y aleaciones de cinc |
US20050121332A1 (en) * | 2003-10-03 | 2005-06-09 | Kochilla John R. | Apparatus and method for treatment of metal surfaces by inorganic electrophoretic passivation |
US20050133376A1 (en) * | 2003-12-19 | 2005-06-23 | Opaskar Vincent C. | Alkaline zinc-nickel alloy plating compositions, processes and articles therefrom |
FR2864553B1 (fr) * | 2003-12-31 | 2006-09-01 | Coventya | Installation de depot de zinc ou d'alliages de zinc |
US7442286B2 (en) * | 2004-02-26 | 2008-10-28 | Atotech Deutschland Gmbh | Articles with electroplated zinc-nickel ternary and higher alloys, electroplating baths, processes and systems for electroplating such alloys |
DE102004061255B4 (de) | 2004-12-20 | 2007-10-31 | Atotech Deutschland Gmbh | Verfahren für den kontinuierlichen Betrieb von sauren oder alkalischen Zink- oder Zinklegierungsbädern und Vorrichtung zur Durchführung desselben |
EP1712660A1 (de) | 2005-04-12 | 2006-10-18 | Enthone Inc. | Unlösliche Anode |
EP1717353B1 (de) * | 2005-04-26 | 2009-04-22 | ATOTECH Deutschland GmbH | Alkalisches Galvanikbad mit einer Filtrationsmembran |
EP1717351A1 (de) * | 2005-04-27 | 2006-11-02 | Enthone Inc. | Galvanikbad |
JP4738910B2 (ja) * | 2005-06-21 | 2011-08-03 | 日本表面化学株式会社 | 亜鉛−ニッケル合金めっき方法 |
US20070043474A1 (en) * | 2005-08-17 | 2007-02-22 | Semitool, Inc. | Systems and methods for predicting process characteristics of an electrochemical treatment process |
DE102005051632B4 (de) * | 2005-10-28 | 2009-02-19 | Enthone Inc., West Haven | Verfahren zum Beizen von nicht leitenden Substratoberflächen und zur Metallisierung von Kunststoffoberflächen |
JP4819612B2 (ja) * | 2006-08-07 | 2011-11-24 | ルネサスエレクトロニクス株式会社 | めっき処理装置および半導体装置の製造方法 |
DE102007040005A1 (de) | 2007-08-23 | 2009-02-26 | Ewh Industrieanlagen Gmbh & Co. Kg | Verfahren zum Abscheiden funktioneller Schichten aus einem Galvanikbad |
DE102007060200A1 (de) | 2007-12-14 | 2009-06-18 | Coventya Gmbh | Galvanisches Bad, Verfahren zur galvanischen Abscheidung und Verwendung einer bipolaren Membran zur Separation in einem galvanischen Bad |
TWI384094B (zh) * | 2008-02-01 | 2013-02-01 | Zhen Ding Technology Co Ltd | 電鍍用陽極裝置及包括該陽極裝置之電鍍裝置 |
EP2096193B1 (en) | 2008-02-21 | 2013-04-03 | Atotech Deutschland GmbH | Process for the preparation of corrosion resistant zinc and zinc-nickel plated linear or complex shaped parts |
DE102008058086B4 (de) | 2008-11-18 | 2013-05-23 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zur Reinigung von galvanischen Bädern zur Abscheidung von Metallen |
KR100977068B1 (ko) * | 2010-01-25 | 2010-08-19 | 한용순 | 비정질 3가크롬합금도금층을 형성하기 위한 도금장치 및 그 3가크롬합금도금액 |
EP2384800B1 (de) | 2010-05-07 | 2013-02-13 | Dr.Ing. Max Schlötter GmbH & Co. KG | Regeneration alkalischer Zinknickelelektrolyte durch Entfernen von Cyanidionen |
DE102010044551A1 (de) | 2010-09-07 | 2012-03-08 | Coventya Gmbh | Anode sowie deren Verwendung in einem alkalischen Galvanikbad |
EP2738290A1 (en) | 2011-08-30 | 2014-06-04 | Rohm and Haas Electronic Materials LLC | Adhesion promotion of cyanide-free white bronze |
CN103849915B (zh) * | 2012-12-06 | 2016-08-31 | 北大方正集团有限公司 | 电镀装置和pcb板导通孔镀铜的方法 |
CN103911650B (zh) * | 2014-04-02 | 2016-07-06 | 广东达志环保科技股份有限公司 | 一种应用于碱性锌镍合金电镀的阳极 |
DE202015002289U1 (de) | 2015-03-25 | 2015-05-06 | Hartmut Trenkner | Zweikammer - Elektrodialysezelle mit Anionen- und Kationenaustauschermembran zur Verwendung als Anode in alkalischen Zink- und Zinklegierungselektrolyten zum Zweck der Metallabscheidung in galvanischen Anlagen |
BR112015028629A2 (pt) | 2015-07-22 | 2017-07-25 | Dipsol Chem | método de eletrogalvanização de liga de zinco |
EP3042985B1 (en) | 2015-07-22 | 2019-04-10 | Dipsol Chemicals Co., Ltd. | Zinc alloy plating method |
WO2017171113A1 (ko) * | 2016-03-29 | 2017-10-05 | (주) 테크윈 | 전해조 및 전해 방법 |
CN106987879A (zh) * | 2016-11-23 | 2017-07-28 | 瑞尔太阳能投资有限公司 | 电沉积装置及其电沉积方法 |
EP3358045A1 (de) | 2017-02-07 | 2018-08-08 | Dr.Ing. Max Schlötter GmbH & Co. KG | Verfahren zur galvanischen abscheidung von zink- und zinklegierungsüberzügen aus einem alkalischen beschichtungsbad mit reduziertem abbau von organischen badzusätzen |
HUE065554T2 (hu) | 2017-06-14 | 2024-06-28 | Dr Ing Max Schloetter Gmbh & Co Kg | Eljárás cink-nikkel ötvözet rétegek elektrolitikus lecsapására egy alkálikus cink-nikkel ötvözet fürdõbõl adalékok korlátozott lebomlása mellett |
TWI841670B (zh) * | 2019-01-24 | 2024-05-11 | 德商德國艾托特克公司 | 用於電解鋅-鎳合金沉積之膜陽極系統 |
JP6582353B1 (ja) | 2019-02-15 | 2019-10-02 | ディップソール株式会社 | 亜鉛又は亜鉛合金電気めっき方法及びシステム |
JP6750186B1 (ja) | 2019-11-28 | 2020-09-02 | ユケン工業株式会社 | めっき液の亜鉛濃度の上昇を抑制する方法および亜鉛系めっき部材の製造方法 |
WO2021123129A1 (en) | 2019-12-20 | 2021-06-24 | Atotech Deutschland Gmbh | Method and system for depositing a zinc-nickel alloy on a substrate |
EP4273303A1 (en) | 2022-05-05 | 2023-11-08 | Atotech Deutschland GmbH & Co. KG | Method for depositing a zinc-nickel alloy on a substrate, an aqueous zinc-nickel deposition bath, a brightening agent and use thereof |
CN115821346A (zh) * | 2022-11-16 | 2023-03-21 | 广州超邦化工有限公司 | 一种中碳钢机加件镀碱性锌镍合金的方法 |
Family Cites Families (37)
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---|---|---|---|---|
DE925264C (de) | 1952-11-15 | 1955-03-17 | Hesse & Co Dr | Verfahren zum Vernickeln ohne Nickelanoden |
GB1349735A (en) | 1969-11-20 | 1974-04-10 | Fulmer Res Inst Ltd | Electrodeposited metal coatings |
US3660170A (en) * | 1970-04-08 | 1972-05-02 | Gen Electric | Dendrite-inhibiting additive for battery cell having zinc electrode |
US3718549A (en) | 1971-06-14 | 1973-02-27 | Kewanee Oil Co | Alkaline nickel plating solutions |
JPS5128533A (en) * | 1974-09-04 | 1976-03-10 | Matsushita Electric Ind Co Ltd | Aen nitsukerugokin metsukyodenkaieki |
GB1602404A (en) | 1978-04-06 | 1981-11-11 | Ibm | Electroplating of chromium |
US4192908A (en) * | 1979-06-15 | 1980-03-11 | The United States Of America As Represented By The Secretary Of The Navy | Mass-transport separator for alkaline nickel-zinc cells and cell |
JPS5893886A (ja) | 1981-11-30 | 1983-06-03 | Tokuyama Soda Co Ltd | 電気メツキ方法 |
JPS5893899A (ja) | 1981-11-30 | 1983-06-03 | Sumitomo Metal Ind Ltd | 電気メツキの浴管理方法 |
US4469564A (en) * | 1982-08-11 | 1984-09-04 | At&T Bell Laboratories | Copper electroplating process |
DE3310730A1 (de) | 1983-03-24 | 1984-03-29 | Daimler-Benz Ag, 7000 Stuttgart | Verfahren zum entfernen ueberschuessiger metall-ionen aus sauren chloridhaltigen galvanischen baeder |
JPS59193295A (ja) | 1983-04-15 | 1984-11-01 | Hitachi Ltd | ニツケルめつき方法及び装置 |
DE3712511C3 (de) * | 1986-04-14 | 1995-06-29 | Dipsol Chem | Alkalisches cyanidfreies Elektroplattierungsbad und Verwendung dieses Bades |
US4889602B1 (en) | 1986-04-14 | 1995-11-14 | Dipsol Chem | Electroplating bath and method for forming zinc-nickel alloy coating |
US4832812A (en) * | 1987-09-08 | 1989-05-23 | Eco-Tec Limited | Apparatus for electroplating metals |
JPH02175894A (ja) * | 1988-12-28 | 1990-07-09 | Kosaku:Kk | スズ、スズ合金電気めっき方法及び同電気めっき装置 |
FR2650304B1 (fr) | 1989-07-25 | 1991-10-04 | Siderurgie Fse Inst Rech | Procede de revetement electrolytique d'une surface metallique, et cellule d'electrolyse pour sa mise en oeuvre |
JPH049493A (ja) * | 1990-04-27 | 1992-01-14 | Permelec Electrode Ltd | 鋼板の電気錫メッキ方法 |
JP2764337B2 (ja) * | 1990-05-10 | 1998-06-11 | 新日本製鐵株式会社 | Ni又はNi―Zn合金又はNi―Zn―Co合金メッキ方法 |
JPH0444374A (ja) | 1990-06-12 | 1992-02-14 | Matsushita Electric Ind Co Ltd | エキシマレーザ装置 |
US5310465A (en) * | 1990-06-14 | 1994-05-10 | Vaughan Daniel J | Electrodialytic oxydation-reduction of metals |
JPH0452296A (ja) * | 1990-06-20 | 1992-02-20 | Permelec Electrode Ltd | 銅めっき方法 |
JPH08375Y2 (ja) * | 1990-08-15 | 1996-01-10 | 株式会社アルメックス | メッキ装置の陽極構造 |
EP0483937A1 (de) | 1990-10-24 | 1992-05-06 | ATOTECH Deutschland GmbH | Membranelektrolysemodul, Verfahren und dessen Verwendung |
DE4035316C2 (de) | 1990-11-07 | 1993-11-04 | Daimler Benz Ag | Verfahren zur elektrolytischen rueckgewinnung von nickel aus chloridhaltigen elektrolytischen baedern |
JPH04176893A (ja) | 1990-11-08 | 1992-06-24 | Kawasaki Steel Corp | Sn―Ni合金めっき方法 |
US5162079A (en) | 1991-01-28 | 1992-11-10 | Eco-Tec Limited | Process and apparatus for control of electroplating bath composition |
JP2997072B2 (ja) * | 1991-02-13 | 2000-01-11 | ディップソール株式会社 | 亜鉛−ニッケル合金めっき浴及び被めっき物上の黒色析出を防止する方法 |
JPH059776A (ja) * | 1991-07-01 | 1993-01-19 | Fujitsu Ltd | プリント配線板のめつき方法 |
JPH059799A (ja) | 1991-07-05 | 1993-01-19 | Kawasaki Steel Corp | 硫酸浴Zn−Ni電気めつきにおける金属イオンの供給方法及び装置 |
JPH05128533A (ja) | 1991-11-05 | 1993-05-25 | Nec Eng Ltd | 光デイスク再生装置 |
FR2686352B1 (fr) | 1992-01-16 | 1995-06-16 | Framatome Sa | Appareil et procede de revetement electrolytique de nickel. |
US5417840A (en) * | 1993-10-21 | 1995-05-23 | Mcgean-Rohco, Inc. | Alkaline zinc-nickel alloy plating baths |
US5405523A (en) * | 1993-12-15 | 1995-04-11 | Taskem Inc. | Zinc alloy plating with quaternary ammonium polymer |
JPH10130878A (ja) | 1996-11-01 | 1998-05-19 | Asahi Glass Co Ltd | 電解ニッケルめっき方法 |
US5883762A (en) | 1997-03-13 | 1999-03-16 | Calhoun; Robert B. | Electroplating apparatus and process for reducing oxidation of oxidizable plating anions and cations |
DE19834353C2 (de) | 1998-07-30 | 2000-08-17 | Hillebrand Walter Gmbh & Co Kg | Alkalisches Zink-Nickelbad |
-
1998
- 1998-07-30 DE DE19834353A patent/DE19834353C2/de not_active Expired - Lifetime
-
1999
- 1999-07-24 US US09/744,706 patent/US6602394B1/en not_active Expired - Lifetime
- 1999-07-29 ES ES03003890T patent/ES2277624T3/es not_active Expired - Lifetime
- 1999-07-29 EE EEP200100059A patent/EE200100059A/xx unknown
- 1999-07-29 EP EP99940077A patent/EP1102875B1/de not_active Revoked
- 1999-07-29 WO PCT/EP1999/005443 patent/WO2000006807A2/de active IP Right Grant
- 1999-07-29 EP EP03003890A patent/EP1344850B1/de not_active Expired - Lifetime
- 1999-07-29 CN CN99809138A patent/CN1311830A/zh active Pending
- 1999-07-29 SK SK89-2001A patent/SK285453B6/sk not_active IP Right Cessation
- 1999-07-29 MX MXPA01000932A patent/MXPA01000932A/es unknown
- 1999-07-29 BR BR9912589-7A patent/BR9912589A/pt not_active Application Discontinuation
- 1999-07-29 PL PL345970A patent/PL198149B1/pl unknown
- 1999-07-29 AT AT99940077T patent/ATE242821T1/de active
- 1999-07-29 JP JP2000562585A patent/JP4716568B2/ja not_active Expired - Lifetime
- 1999-07-29 ES ES99940077T patent/ES2201759T3/es not_active Expired - Lifetime
- 1999-07-29 CA CA002339144A patent/CA2339144A1/en not_active Abandoned
- 1999-07-29 DE DE59905937T patent/DE59905937D1/de not_active Expired - Lifetime
- 1999-07-29 KR KR1020017001285A patent/KR20010071074A/ko not_active Application Discontinuation
- 1999-07-29 AU AU54152/99A patent/AU5415299A/en not_active Abandoned
- 1999-07-29 TR TR2001/00232T patent/TR200100232T2/xx unknown
- 1999-07-29 HU HU0103951A patent/HUP0103951A3/hu unknown
- 1999-07-29 DE DE59914011T patent/DE59914011D1/de not_active Expired - Lifetime
- 1999-07-29 AT AT03003890T patent/ATE346180T1/de active
- 1999-07-29 CZ CZ20010189A patent/CZ298904B6/cs not_active IP Right Cessation
- 1999-07-29 IL IL14108699A patent/IL141086A0/xx unknown
-
2001
- 2001-01-16 HR HR20010044A patent/HRP20010044B1/xx not_active IP Right Cessation
- 2001-01-25 BG BG105184A patent/BG105184A/xx unknown
-
2003
- 2003-07-11 US US10/618,352 patent/US20040104123A1/en not_active Abandoned
-
2008
- 2008-02-13 US US12/030,750 patent/US7807035B2/en not_active Expired - Lifetime
- 2008-03-18 JP JP2008069722A patent/JP2008150713A/ja active Pending
-
2010
- 2010-10-01 US US12/896,673 patent/US8486235B2/en not_active Expired - Fee Related
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