EE200100059A - Leeliseline tsink-nikkel galvaanimisvann - Google Patents

Leeliseline tsink-nikkel galvaanimisvann

Info

Publication number
EE200100059A
EE200100059A EEP200100059A EEP200100059A EE200100059A EE 200100059 A EE200100059 A EE 200100059A EE P200100059 A EEP200100059 A EE P200100059A EE P200100059 A EEP200100059 A EE P200100059A EE 200100059 A EE200100059 A EE 200100059A
Authority
EE
Estonia
Prior art keywords
plating bath
nickel plating
alkaline zinc
alkaline
zinc
Prior art date
Application number
EEP200100059A
Other languages
English (en)
Inventor
Hillebrand Ernst-Walter
Original Assignee
Walter Hillebrand Gmbh & Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7875843&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EE200100059(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Walter Hillebrand Gmbh & Co filed Critical Walter Hillebrand Gmbh & Co
Publication of EE200100059A publication Critical patent/EE200100059A/et

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02Tanks; Installations therefor
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/565Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
EEP200100059A 1998-07-30 1999-07-29 Leeliseline tsink-nikkel galvaanimisvann EE200100059A (et)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19834353A DE19834353C2 (de) 1998-07-30 1998-07-30 Alkalisches Zink-Nickelbad
PCT/EP1999/005443 WO2000006807A2 (de) 1998-07-30 1999-07-29 Alkalisches zink-nickelbad

Publications (1)

Publication Number Publication Date
EE200100059A true EE200100059A (et) 2002-10-15

Family

ID=7875843

Family Applications (1)

Application Number Title Priority Date Filing Date
EEP200100059A EE200100059A (et) 1998-07-30 1999-07-29 Leeliseline tsink-nikkel galvaanimisvann

Country Status (22)

Country Link
US (4) US6602394B1 (et)
EP (2) EP1102875B1 (et)
JP (2) JP4716568B2 (et)
KR (1) KR20010071074A (et)
CN (1) CN1311830A (et)
AT (2) ATE242821T1 (et)
AU (1) AU5415299A (et)
BG (1) BG105184A (et)
BR (1) BR9912589A (et)
CA (1) CA2339144A1 (et)
CZ (1) CZ298904B6 (et)
DE (3) DE19834353C2 (et)
EE (1) EE200100059A (et)
ES (2) ES2277624T3 (et)
HR (1) HRP20010044B1 (et)
HU (1) HUP0103951A3 (et)
IL (1) IL141086A0 (et)
MX (1) MXPA01000932A (et)
PL (1) PL198149B1 (et)
SK (1) SK285453B6 (et)
TR (1) TR200100232T2 (et)
WO (1) WO2000006807A2 (et)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
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DE19834353C2 (de) 1998-07-30 2000-08-17 Hillebrand Walter Gmbh & Co Kg Alkalisches Zink-Nickelbad
US20060157355A1 (en) * 2000-03-21 2006-07-20 Semitool, Inc. Electrolytic process using anion permeable barrier
US8236159B2 (en) 1999-04-13 2012-08-07 Applied Materials Inc. Electrolytic process using cation permeable barrier
US8852417B2 (en) 1999-04-13 2014-10-07 Applied Materials, Inc. Electrolytic process using anion permeable barrier
US20060189129A1 (en) * 2000-03-21 2006-08-24 Semitool, Inc. Method for applying metal features onto barrier layers using ion permeable barriers
DE10026956A1 (de) * 2000-05-30 2001-12-13 Walter Hillebrand Galvanotechn Zink-Legierungsbad
WO2001096631A1 (en) 2000-06-15 2001-12-20 Taskem Inc. Zinc-nickel electroplating
US6755960B1 (en) 2000-06-15 2004-06-29 Taskem Inc. Zinc-nickel electroplating
US7628898B2 (en) * 2001-03-12 2009-12-08 Semitool, Inc. Method and system for idle state operation
DE10223622B4 (de) * 2002-05-28 2005-12-08 Walter Hillebrand Gmbh & Co. Kg Galvanotechnik Alkalisches Zink-Nickelbad sowie entsprechende Galvanisierungsverfahren mit erhöhter Stromausbeute
US8377283B2 (en) 2002-11-25 2013-02-19 Coventya, Inc. Zinc and zinc-alloy electroplating
DE10261493A1 (de) * 2002-12-23 2004-07-08 METAKEM Gesellschaft für Schichtchemie der Metalle mbH Anode zur Galvanisierung
BR0318331A (pt) * 2003-06-03 2006-07-11 Taskem Inc aparelho para aplicar um eletrodepósito de zinco ou de liga de zinco a uma peça de trabalho
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FR2864553B1 (fr) * 2003-12-31 2006-09-01 Coventya Installation de depot de zinc ou d'alliages de zinc
US7442286B2 (en) * 2004-02-26 2008-10-28 Atotech Deutschland Gmbh Articles with electroplated zinc-nickel ternary and higher alloys, electroplating baths, processes and systems for electroplating such alloys
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ES2324169T3 (es) * 2005-04-26 2009-07-31 Atotech Deutschland Gmbh Baño galvanico alcalino con una membrana de filtracion.
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TWI384094B (zh) * 2008-02-01 2013-02-01 Zhen Ding Technology Co Ltd 電鍍用陽極裝置及包括該陽極裝置之電鍍裝置
EP2096193B1 (en) 2008-02-21 2013-04-03 Atotech Deutschland GmbH Process for the preparation of corrosion resistant zinc and zinc-nickel plated linear or complex shaped parts
DE102008058086B4 (de) 2008-11-18 2013-05-23 Atotech Deutschland Gmbh Verfahren und Vorrichtung zur Reinigung von galvanischen Bädern zur Abscheidung von Metallen
KR100977068B1 (ko) * 2010-01-25 2010-08-19 한용순 비정질 3가크롬합금도금층을 형성하기 위한 도금장치 및 그 3가크롬합금도금액
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EP2738290A1 (en) 2011-08-30 2014-06-04 Rohm and Haas Electronic Materials LLC Adhesion promotion of cyanide-free white bronze
CN103849915B (zh) * 2012-12-06 2016-08-31 北大方正集团有限公司 电镀装置和pcb板导通孔镀铜的方法
CN103911650B (zh) * 2014-04-02 2016-07-06 广东达志环保科技股份有限公司 一种应用于碱性锌镍合金电镀的阳极
DE202015002289U1 (de) 2015-03-25 2015-05-06 Hartmut Trenkner Zweikammer - Elektrodialysezelle mit Anionen- und Kationenaustauschermembran zur Verwendung als Anode in alkalischen Zink- und Zinklegierungselektrolyten zum Zweck der Metallabscheidung in galvanischen Anlagen
BR112015028629A2 (pt) 2015-07-22 2017-07-25 Dipsol Chem método de eletrogalvanização de liga de zinco
RU2610183C1 (ru) 2015-07-22 2017-02-08 Дипсол Кемикалз Ко., Лтд. Способ гальваностегии цинковым сплавом
WO2017171113A1 (ko) * 2016-03-29 2017-10-05 (주) 테크윈 전해조 및 전해 방법
CN106987879A (zh) * 2016-11-23 2017-07-28 瑞尔太阳能投资有限公司 电沉积装置及其电沉积方法
EP3358045A1 (de) 2017-02-07 2018-08-08 Dr.Ing. Max Schlötter GmbH & Co. KG Verfahren zur galvanischen abscheidung von zink- und zinklegierungsüberzügen aus einem alkalischen beschichtungsbad mit reduziertem abbau von organischen badzusätzen
PL3415665T3 (pl) 2017-06-14 2024-03-25 Dr.Ing. Max Schlötter Gmbh & Co. Kg Sposób osadzania galwanicznego powłok ze stopu cynku i niklu z alkalicznej kąpieli stopu cynku i niklu z ograniczoną degradacją dodatków
CN113383118A (zh) * 2019-01-24 2021-09-10 德国艾托特克公司 用于电解锌-镍合金沉积的膜阳极系统
CN110462107A (zh) 2019-02-15 2019-11-15 迪普索股份公司 锌或锌合金电镀方法和系统
JP6750186B1 (ja) 2019-11-28 2020-09-02 ユケン工業株式会社 めっき液の亜鉛濃度の上昇を抑制する方法および亜鉛系めっき部材の製造方法
TW202132629A (zh) 2019-12-20 2021-09-01 德商德國艾托特克公司 用於在基板上沉積鋅-鎳合金的方法及系統
EP4273303A1 (en) 2022-05-05 2023-11-08 Atotech Deutschland GmbH & Co. KG Method for depositing a zinc-nickel alloy on a substrate, an aqueous zinc-nickel deposition bath, a brightening agent and use thereof

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Also Published As

Publication number Publication date
BG105184A (en) 2001-10-31
JP2008150713A (ja) 2008-07-03
PL198149B1 (pl) 2008-05-30
HUP0103951A2 (hu) 2002-02-28
BR9912589A (pt) 2001-05-02
JP2002521572A (ja) 2002-07-16
DE19834353C2 (de) 2000-08-17
ES2201759T3 (es) 2004-03-16
EP1102875B1 (de) 2003-06-11
PL345970A1 (en) 2002-01-14
DE19834353A1 (de) 2000-02-03
ES2277624T3 (es) 2007-07-16
US6602394B1 (en) 2003-08-05
ATE346180T1 (de) 2006-12-15
WO2000006807A2 (de) 2000-02-10
DE59905937D1 (de) 2003-07-17
EP1344850B1 (de) 2006-11-22
IL141086A0 (en) 2002-02-10
WO2000006807A3 (de) 2000-05-04
TR200100232T2 (tr) 2001-06-21
US8486235B2 (en) 2013-07-16
CA2339144A1 (en) 2000-02-10
EP1344850A1 (de) 2003-09-17
SK892001A3 (en) 2001-10-08
ATE242821T1 (de) 2003-06-15
CN1311830A (zh) 2001-09-05
CZ298904B6 (cs) 2008-03-05
SK285453B6 (sk) 2007-01-04
HRP20010044B1 (en) 2005-06-30
CZ2001189A3 (cs) 2001-08-15
MXPA01000932A (es) 2002-06-04
KR20010071074A (ko) 2001-07-28
US7807035B2 (en) 2010-10-05
US20080164150A1 (en) 2008-07-10
AU5415299A (en) 2000-02-21
JP4716568B2 (ja) 2011-07-06
HRP20010044A2 (en) 2001-12-31
US20110031127A1 (en) 2011-02-10
DE59914011D1 (de) 2007-01-04
US20040104123A1 (en) 2004-06-03
HUP0103951A3 (en) 2003-05-28
EP1102875A2 (de) 2001-05-30

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