DE69737053D1 - Chip-Widerstand und Verfahren zu dessen Herstellung - Google Patents

Chip-Widerstand und Verfahren zu dessen Herstellung

Info

Publication number
DE69737053D1
DE69737053D1 DE69737053T DE69737053T DE69737053D1 DE 69737053 D1 DE69737053 D1 DE 69737053D1 DE 69737053 T DE69737053 T DE 69737053T DE 69737053 T DE69737053 T DE 69737053T DE 69737053 D1 DE69737053 D1 DE 69737053D1
Authority
DE
Germany
Prior art keywords
manufacture
chip resistor
resistor
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69737053T
Other languages
English (en)
Other versions
DE69737053T2 (de
Inventor
Suzuki Kimura
Koji Shimoyama
Naotugu Yoneda
Keiichi Nakao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69737053D1 publication Critical patent/DE69737053D1/de
Application granted granted Critical
Publication of DE69737053T2 publication Critical patent/DE69737053T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49099—Coating resistive material on a base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49101—Applying terminal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Non-Adjustable Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Details Of Resistors (AREA)
DE69737053T 1996-09-11 1997-09-09 Chip-Widerstand und Verfahren zu dessen Herstellung Expired - Lifetime DE69737053T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP24029496 1996-09-11
JP24029496 1996-09-11

Publications (2)

Publication Number Publication Date
DE69737053D1 true DE69737053D1 (de) 2007-01-18
DE69737053T2 DE69737053T2 (de) 2007-03-29

Family

ID=17057342

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69737053T Expired - Lifetime DE69737053T2 (de) 1996-09-11 1997-09-09 Chip-Widerstand und Verfahren zu dessen Herstellung

Country Status (6)

Country Link
US (2) US5907274A (de)
EP (1) EP0829886B1 (de)
CN (2) CN100483568C (de)
DE (1) DE69737053T2 (de)
MY (1) MY123824A (de)
TW (1) TW350071B (de)

Families Citing this family (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0861492A1 (de) * 1996-09-13 1998-09-02 Koninklijke Philips Electronics N.V. Dünnschichtwiderstand und widerstandsmaterial für einen dünnschichtwiderstand
KR100367632B1 (ko) * 1997-10-02 2003-01-10 마쯔시다덴기산교 가부시키가이샤 저항기 및 그 제조방법
JP2000164402A (ja) * 1998-11-27 2000-06-16 Rohm Co Ltd チップ抵抗器の構造
KR100328255B1 (ko) * 1999-01-27 2002-03-16 이형도 칩 부품 및 그 제조방법
US6256866B1 (en) * 1999-05-11 2001-07-10 Motorola, Inc. Polymer thick-film resistor printed on planar circuit board surface
TW552596B (en) * 1999-07-30 2003-09-11 Rohm Co Ltd Chip resistor and method of making the same
JP3715488B2 (ja) * 1999-11-22 2005-11-09 株式会社東芝 評価用半導体装置
JP4722318B2 (ja) * 2000-06-05 2011-07-13 ローム株式会社 チップ抵抗器
US6609292B2 (en) * 2000-08-10 2003-08-26 Rohm Co., Ltd. Method of making chip resistor
US7057490B2 (en) * 2000-08-30 2006-06-06 Matsushita Electric Industrial Co. Ltd. Resistor and production method therefor
JP4780689B2 (ja) * 2001-03-09 2011-09-28 ローム株式会社 チップ抵抗器
US6880234B2 (en) * 2001-03-16 2005-04-19 Vishay Intertechnology, Inc. Method for thin film NTC thermistor
US7038572B2 (en) * 2001-03-19 2006-05-02 Vishay Dale Electronics, Inc. Power chip resistor
US6873028B2 (en) 2001-11-15 2005-03-29 Vishay Intertechnology, Inc. Surge current chip resistor
US6690558B1 (en) * 2002-01-14 2004-02-10 Alan Devoe Power resistor and method for making
JP3869273B2 (ja) * 2002-01-17 2007-01-17 ローム株式会社 チップ抵抗器の製造方法
US7342480B2 (en) * 2002-06-13 2008-03-11 Rohm Co., Ltd. Chip resistor and method of making same
WO2004001774A1 (ja) * 2002-06-19 2003-12-31 Rohm Co., Ltd. 低い抵抗値を有するチップ抵抗器とその製造方法
TW540829U (en) * 2002-07-02 2003-07-01 Inpaq Technology Co Ltd Improved chip-type thick film resistor structure
WO2004023498A1 (en) * 2002-09-03 2004-03-18 Vishay Intertechnology, Inc. Flip chip resistor and its manufacturing method
CN100378874C (zh) * 2003-02-28 2008-04-02 广东风华高新科技股份有限公司 片式网络电阻器的制备方法
JP4047760B2 (ja) * 2003-04-28 2008-02-13 ローム株式会社 チップ抵抗器およびその製造方法
JP4435734B2 (ja) * 2003-05-08 2010-03-24 パナソニック株式会社 電子部品及びその製造方法
JP4358664B2 (ja) * 2004-03-24 2009-11-04 ローム株式会社 チップ抵抗器およびその製造方法
CN100401432C (zh) * 2004-07-09 2008-07-09 陈柳武 起动电阻
CN1989578B (zh) * 2004-07-27 2010-12-08 松下电器产业株式会社 芯片电阻器及其制造方法
US7915993B2 (en) * 2004-09-08 2011-03-29 Cyntec Co., Ltd. Inductor
US7667565B2 (en) * 2004-09-08 2010-02-23 Cyntec Co., Ltd. Current measurement using inductor coil with compact configuration and low TCR alloys
JP2007088161A (ja) * 2005-09-21 2007-04-05 Koa Corp チップ抵抗器
JP4841914B2 (ja) * 2005-09-21 2011-12-21 コーア株式会社 チップ抵抗器
JP5225598B2 (ja) * 2007-03-19 2013-07-03 コーア株式会社 電子部品およびその製造法
JP5287154B2 (ja) * 2007-11-08 2013-09-11 パナソニック株式会社 回路保護素子およびその製造方法
CN101206939B (zh) * 2007-12-14 2011-11-09 广东风华高新科技股份有限公司 一种片式贱金属电阻器的制造方法
JP2009218552A (ja) * 2007-12-17 2009-09-24 Rohm Co Ltd チップ抵抗器およびその製造方法
ES2547650T3 (es) * 2008-02-22 2015-10-07 Vishay Advanced Technologies, Ltd. Resistencia en chip montada en superficie con conductores flexibles
CN101295569B (zh) * 2008-06-06 2011-04-27 广东风华高新科技股份有限公司 一种片式电阻器及其制备方法
CN101673604B (zh) * 2008-09-09 2012-10-03 Aem科技(苏州)股份有限公司 静电保护器及其制造方法
CN101673602B (zh) * 2008-09-12 2012-08-29 乾坤科技股份有限公司 电阻元件及其制造方法
US8284016B2 (en) * 2009-09-04 2012-10-09 Samsung Electro-Mechanics Co., Ltd. Array type chip resistor
US8179226B2 (en) * 2009-09-04 2012-05-15 Samsung Electro-Mechanics Co., Ltd. Array type chip resistor
US20110089025A1 (en) * 2009-10-20 2011-04-21 Yageo Corporation Method for manufacturing a chip resistor having a low resistance
TW201133517A (en) * 2010-03-23 2011-10-01 Yageo Corp Chip resistor having a low resistance and method for manufacturing the same
CN102237160A (zh) * 2010-04-30 2011-11-09 国巨股份有限公司 具有低电阻的芯片电阻器及其制造方法
KR101892750B1 (ko) * 2011-12-19 2018-08-29 삼성전기주식회사 칩 저항 부품 및 그의 제조 방법
JP5970695B2 (ja) * 2012-03-26 2016-08-17 Koa株式会社 電流検出用抵抗器およびその実装構造
KR101412951B1 (ko) * 2012-08-17 2014-06-26 삼성전기주식회사 칩 저항기 및 이의 제조 방법
CN103680782A (zh) * 2012-09-07 2014-03-26 成都默一科技有限公司 双绝缘层片式电阻器
DE102013219571B4 (de) * 2013-09-27 2019-05-23 Infineon Technologies Ag Leistungshalbleitermodul mit vertikalem Shunt-Widerstand
KR101630035B1 (ko) * 2014-04-25 2016-06-13 삼성전기주식회사 모바일 기기용 저항 조립체 및 그 제조 방법
JP6370602B2 (ja) * 2014-05-09 2018-08-08 Koa株式会社 電流検出用抵抗器
KR101973420B1 (ko) * 2014-10-06 2019-04-29 삼성전기주식회사 다단자 전자부품, 그 제조방법 및 다단자 전자부품의 실장 기판
KR20160052283A (ko) * 2014-11-04 2016-05-12 삼성전기주식회사 저항 소자, 그 제조방법 및 저항 소자의 실장 기판
KR101670140B1 (ko) * 2014-12-15 2016-10-27 삼성전기주식회사 저항 소자, 그 제조방법 및 저항 소자의 실장 기판
JP6554833B2 (ja) * 2015-03-12 2019-08-07 株式会社村田製作所 複合電子部品および抵抗素子
JP6491032B2 (ja) * 2015-04-24 2019-03-27 スタンレー電気株式会社 抵抗器の製造方法、および、抵抗器
JP2017022176A (ja) * 2015-07-07 2017-01-26 Koa株式会社 薄膜抵抗器及びその製造方法
CN106356167B (zh) * 2015-07-17 2021-01-15 乾坤科技股份有限公司 微电阻器
TWI616903B (zh) * 2015-07-17 2018-03-01 乾坤科技股份有限公司 微電阻器
US10083781B2 (en) 2015-10-30 2018-09-25 Vishay Dale Electronics, Llc Surface mount resistors and methods of manufacturing same
KR101771836B1 (ko) * 2016-02-15 2017-08-25 삼성전기주식회사 칩 저항 소자 및 칩 저항 소자 어셈블리
WO2018061961A1 (ja) * 2016-09-27 2018-04-05 パナソニックＩｐマネジメント株式会社 チップ抵抗器
EP3309800B1 (de) 2016-10-11 2019-03-20 Heraeus Deutschland GmbH & Co. KG Verfahren zur herstellung eines schichtaufbaus unter verwendung einer paste auf basis einer widerstandslegierung
JPWO2018147014A1 (ja) * 2017-02-08 2019-12-12 パナソニックＩｐマネジメント株式会社 チップ抵抗器の製造方法およびチップ抵抗器
JP7241261B2 (ja) * 2017-04-14 2023-03-17 パナソニックＩｐマネジメント株式会社 チップ抵抗器
CN108735408B (zh) * 2017-04-21 2020-02-21 李文熙 高导电卑金属电极或合金低欧姆芯片电阻器的制作方法
US9928947B1 (en) * 2017-07-19 2018-03-27 National Cheng Kung University Method of fabricating highly conductive low-ohmic chip resistor having electrodes of base metal or base-metal alloy
US10438729B2 (en) * 2017-11-10 2019-10-08 Vishay Dale Electronics, Llc Resistor with upper surface heat dissipation
CN110277207A (zh) * 2018-03-16 2019-09-24 新力应用材料有限公司 电阻材料、电阻器与其制作方法
CN108766690A (zh) * 2018-06-25 2018-11-06 中国振华集团云科电子有限公司 一种脉冲电阻及脉冲电阻调阻方法
CN109346255A (zh) * 2018-11-29 2019-02-15 昆山厚声电子工业有限公司 一种低阻值电阻器及其制作工艺
CN110459373A (zh) * 2019-08-19 2019-11-15 南京隆特电子有限公司 一种低阻电阻器及制造方法
CN110931195A (zh) * 2019-12-17 2020-03-27 苏州聚永昶电子科技有限公司 用于合金电阻的生产加工系统
CN112133510B (zh) * 2020-09-04 2022-09-20 广东风华高新科技股份有限公司 一种具备信噪屏蔽功能的电阻及其制备方法
TWI797623B (zh) * 2021-05-15 2023-04-01 道登電子材料股份有限公司 晶片電阻及其製備方法
JP2022189034A (ja) * 2021-06-10 2022-12-22 Koa株式会社 チップ抵抗器およびチップ抵抗器の製造方法
JP2022189028A (ja) * 2021-06-10 2022-12-22 Koa株式会社 チップ部品
CN113571275B (zh) * 2021-06-24 2022-03-11 贝迪斯电子有限公司 一种片式合金箔电阻的制造方法
CN114743745A (zh) * 2022-05-06 2022-07-12 广东风华高新科技股份有限公司 一种电流感测电阻及其制备方法

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JP3012875B2 (ja) * 1996-01-16 2000-02-28 北陸電気工業株式会社 チップ抵抗器の製造方法

Also Published As

Publication number Publication date
CN100483568C (zh) 2009-04-29
US5907274A (en) 1999-05-25
EP0829886A3 (de) 1998-04-29
EP0829886B1 (de) 2006-12-06
CN1118073C (zh) 2003-08-13
US6314637B1 (en) 2001-11-13
CN1180906A (zh) 1998-05-06
CN1437201A (zh) 2003-08-20
MY123824A (en) 2006-06-30
EP0829886A2 (de) 1998-03-18
TW350071B (en) 1999-01-11
DE69737053T2 (de) 2007-03-29

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8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)