DE60235343D1 - Verfahren und Vorrichtung zum Transportieren von Halbleiterwafern - Google Patents

Verfahren und Vorrichtung zum Transportieren von Halbleiterwafern

Info

Publication number
DE60235343D1
DE60235343D1 DE60235343T DE60235343T DE60235343D1 DE 60235343 D1 DE60235343 D1 DE 60235343D1 DE 60235343 T DE60235343 T DE 60235343T DE 60235343 T DE60235343 T DE 60235343T DE 60235343 D1 DE60235343 D1 DE 60235343D1
Authority
DE
Germany
Prior art keywords
wafer
suction
held
semiconductor wafers
transporting semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60235343T
Other languages
English (en)
Inventor
Masayuki Yamamoto
Takao Matsushita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of DE60235343D1 publication Critical patent/DE60235343D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
DE60235343T 2001-12-03 2002-12-02 Verfahren und Vorrichtung zum Transportieren von Halbleiterwafern Expired - Lifetime DE60235343D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001368629 2001-12-03
JP2002292568A JP4201564B2 (ja) 2001-12-03 2002-10-04 半導体ウエハ搬送方法およびこれを用いた半導体ウエハ搬送装置

Publications (1)

Publication Number Publication Date
DE60235343D1 true DE60235343D1 (de) 2010-04-01

Family

ID=26624840

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60235343T Expired - Lifetime DE60235343D1 (de) 2001-12-03 2002-12-02 Verfahren und Vorrichtung zum Transportieren von Halbleiterwafern

Country Status (9)

Country Link
US (1) US7078262B2 (de)
EP (1) EP1320121B1 (de)
JP (1) JP4201564B2 (de)
KR (1) KR100901040B1 (de)
CN (1) CN100390953C (de)
AT (1) ATE458267T1 (de)
DE (1) DE60235343D1 (de)
SG (1) SG111979A1 (de)
TW (1) TWI251893B (de)

Families Citing this family (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4408351B2 (ja) 2002-10-24 2010-02-03 リンテック株式会社 アライメント装置
US20060194412A1 (en) * 2004-04-07 2006-08-31 Takehito Nakayama Method and device for sticking tape
FR2857504B1 (fr) * 2003-07-08 2006-01-06 Atmel Grenoble Sa Capteur d'image de grande dimension et procede de fabrication
JP4647197B2 (ja) * 2003-09-17 2011-03-09 東京エレクトロン株式会社 被処理体の搬送方法及びコンピュータ読取可能な記憶媒体
JP4444619B2 (ja) 2003-10-10 2010-03-31 リンテック株式会社 マウント装置及びマウント方法
US8359895B2 (en) * 2003-10-15 2013-01-29 Modern Body Engineering Corporation Machine cell with vacuum nest for holding a metal panel during a forming operation
JP2005150177A (ja) * 2003-11-12 2005-06-09 Nitto Denko Corp 半導体ウエハ裏面への粘着テープ貼付方法及び粘着テープ貼付装置
JP4489414B2 (ja) * 2003-11-26 2010-06-23 株式会社 日立ディスプレイズ 表示装置の製造方法及びその製造装置
US7074695B2 (en) * 2004-03-02 2006-07-11 Chippac, Inc. DBG system and method with adhesive layer severing
TW200539357A (en) 2004-04-28 2005-12-01 Lintec Corp Adhering apparatus and adhering method
JP4704756B2 (ja) * 2005-01-04 2011-06-22 オリンパス株式会社 基板搬送装置
US20070033827A1 (en) * 2005-07-28 2007-02-15 Kim Young M Apparatus for moving up and down a wafer cassette and chip sorter having the apparatus
WO2007018041A1 (ja) * 2005-08-11 2007-02-15 Lintec Corporation シート貼付装置及び貼付方法
JP4611180B2 (ja) * 2005-11-18 2011-01-12 日東電工株式会社 エラー表示装置
JP2007214357A (ja) * 2006-02-09 2007-08-23 Nitto Denko Corp ワーク貼付け支持方法およびこれを用いたワーク貼付け支持装置
JP4781901B2 (ja) * 2006-05-08 2011-09-28 東京エレクトロン株式会社 熱処理方法，プログラム及び熱処理装置
JP4693696B2 (ja) * 2006-06-05 2011-06-01 株式会社東京精密 ワーク処理装置
JP4698519B2 (ja) * 2006-07-31 2011-06-08 日東電工株式会社 半導体ウエハマウント装置
JP4841355B2 (ja) 2006-08-08 2011-12-21 日東電工株式会社 半導体ウエハの保持方法
JP4953738B2 (ja) 2006-09-07 2012-06-13 日東電工株式会社 粘着テープ切断方法およびこれを用いた粘着テープ貼付け装置
JP4974626B2 (ja) * 2006-09-20 2012-07-11 日東電工株式会社 粘着テープ切断方法およびこれを用いた粘着テープ貼付け装置
JP4974639B2 (ja) * 2006-10-20 2012-07-11 日東電工株式会社 粘着テープ切断方法およびこれを用いた装置
JP4745945B2 (ja) * 2006-12-04 2011-08-10 リンテック株式会社 搬送装置及びこれを用いたシート貼付装置並びにシート剥離装置
JP4661807B2 (ja) * 2007-03-13 2011-03-30 パナソニック株式会社 部品実装装置及び基板搬送方法
JP4661808B2 (ja) * 2007-03-14 2011-03-30 パナソニック株式会社 部品実装装置及び基板搬送方法
JP4853872B2 (ja) * 2007-05-24 2012-01-11 ラピスセミコンダクタ株式会社 チップの製造方法
JP4856593B2 (ja) * 2007-07-04 2012-01-18 リンテック株式会社 マウント装置及びマウント方法
JP2008177600A (ja) * 2008-03-26 2008-07-31 Nitto Denko Corp 半導体ウエハ裏面への粘着テープ貼付方法及び粘着テープ貼付装置
JP5015848B2 (ja) * 2008-04-08 2012-08-29 リンテック株式会社 アライメント装置
DE102008018536B4 (de) * 2008-04-12 2020-08-13 Erich Thallner Vorrichtung und Verfahren zum Aufbringen und/oder Ablösen eines Wafers auf einen/von einem Träger
NL1036785A1 (nl) * 2008-04-18 2009-10-20 Asml Netherlands Bv Rapid exchange device for lithography reticles.
SG142402A1 (en) * 2008-05-02 2009-11-26 Rokko Ventures Pte Ltd Apparatus and method for multiple substrate processing
US8145349B2 (en) * 2008-05-14 2012-03-27 Formfactor, Inc. Pre-aligner search
JP5216472B2 (ja) * 2008-08-12 2013-06-19 日東電工株式会社 半導体ウエハの保護テープ貼付け方法およびその装置
US9343273B2 (en) * 2008-09-25 2016-05-17 Seagate Technology Llc Substrate holders for uniform reactive sputtering
JP5180801B2 (ja) * 2008-12-17 2013-04-10 リンテック株式会社 アライメント装置及びアライメント方法
JP5554013B2 (ja) * 2009-05-15 2014-07-23 リンテック株式会社 板状部材の搬送装置及び搬送方法
JP5324319B2 (ja) * 2009-05-26 2013-10-23 日東電工株式会社 ウエハマウント方法とウエハマウント装置
CN102004293B (zh) * 2009-09-02 2014-04-23 鸿富锦精密工业（深圳）有限公司 光学元件取放装置及取放多个光学元件的方法
JP5585379B2 (ja) * 2010-10-21 2014-09-10 富士電機株式会社 半導体装置の製造方法およびその製造装置
US8496159B2 (en) * 2011-06-06 2013-07-30 International Business Machines Corporation Injection molded solder process for forming solder bumps on substrates
JP5977042B2 (ja) * 2012-02-27 2016-08-24 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置、基板保持装置および基板保持方法
US10262885B2 (en) * 2012-08-31 2019-04-16 Semiconductor Technologies & Instruments Pte Ltd Multifunction wafer and film frame handling system
TWI571949B (zh) * 2013-01-10 2017-02-21 晶元光電股份有限公司 半導體元件翻轉裝置
JP6122299B2 (ja) 2013-01-15 2017-04-26 キヤノン株式会社 処理装置、処理方法、及びデバイスの製造方法
JP2014150206A (ja) * 2013-02-04 2014-08-21 Disco Abrasive Syst Ltd 板状物の搬送装置
JP6087669B2 (ja) * 2013-03-06 2017-03-01 キヤノン株式会社 基板処理装置、リソグラフィ装置および物品の製造方法
EP2851941B1 (de) * 2013-09-23 2016-09-07 Mechatronic Systemtechnik GmbH Verfahren zur Übergabe eines gedünnten, insbesondere geschliffenen, Halbleiterwafers
US9355882B2 (en) * 2013-12-04 2016-05-31 Taiwan Semiconductor Manufacturing Co., Ltd. Transfer module for bowed wafers
JP6253089B2 (ja) * 2013-12-10 2017-12-27 株式会社ディスコ 研削装置
CN103779453B (zh) * 2014-01-21 2016-09-14 中国科学院半导体研究所 一种控制半导体led外延片内应力的装置
JP6300629B2 (ja) * 2014-05-13 2018-03-28 株式会社ディスコ 荷重測定装置
JP6373068B2 (ja) * 2014-05-30 2018-08-15 株式会社ディスコ 搬送方法
TWI581904B (zh) * 2014-11-18 2017-05-11 漢民科技股份有限公司 工件處理裝置與方法
JP6474275B2 (ja) * 2015-02-19 2019-02-27 株式会社ディスコ 加工装置
JP6568781B2 (ja) * 2015-04-04 2019-08-28 東京エレクトロン株式会社 基板保持方法、基板保持装置、処理方法及び処理装置
JP6709726B2 (ja) * 2015-12-18 2020-06-17 日本特殊陶業株式会社 基板保持装置、基板保持部材および基板保持方法
KR101812209B1 (ko) * 2016-02-16 2017-12-26 주식회사 이오테크닉스 레이저 마킹 장치 및 레이저 마킹 방법
JP6723131B2 (ja) 2016-09-29 2020-07-15 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置および基板搬送方法
JP6990038B2 (ja) * 2017-04-26 2022-01-12 日東電工株式会社 基板の離脱方法および基板の離脱装置
JP6978877B2 (ja) * 2017-09-04 2021-12-08 キヤノン株式会社 インプリント装置および物品製造方法
KR20210021480A (ko) * 2018-06-22 2021-02-26 로제 가부시키가이샤 얼라이너 및 얼라이너의 보정값 산출 방법
JP7303635B2 (ja) * 2019-01-07 2023-07-05 株式会社ディスコ ワークの保持方法及びワークの処理方法
JP7161415B2 (ja) * 2019-01-21 2022-10-26 株式会社ディスコ 加工装置
US11177146B2 (en) 2019-10-31 2021-11-16 Applied Materials, Inc. Methods and apparatus for processing a substrate
KR20220008514A (ko) * 2020-07-14 2022-01-21 삼성전자주식회사 웨이퍼 본딩 장치 및 웨이퍼 본딩 방법
JP7464472B2 (ja) * 2020-07-17 2024-04-09 株式会社ディスコ 加工装置
KR102417320B1 (ko) 2020-08-26 2022-07-06 주식회사 쿠온솔루션 부상된 대상물을 이송시키는 이송 장치
US20240096675A1 (en) * 2020-12-04 2024-03-21 Nippon Telegraph And Telephone Corporation Substrate for carrying wafer
WO2022195931A1 (ja) * 2021-03-18 2022-09-22 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法
TWI773378B (zh) * 2021-06-11 2022-08-01 亞亞科技股份有限公司 電路板檢測裝置之取放暨壓制模組

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3110341C2 (de) * 1980-03-19 1983-11-17 Hitachi, Ltd., Tokyo Verfahren und Vorrichtung zum Ausrichten eines dünnen Substrats in der Bildebene eines Kopiergerätes
JPS59134848A (ja) * 1983-01-22 1984-08-02 Nec Corp ウエハ−チヤツク
JPS61276339A (ja) * 1985-05-31 1986-12-06 Nec Corp ウエハ−・ステ−ジ
JPH0697676B2 (ja) * 1985-11-26 1994-11-30 忠弘 大見 ウエハサセプタ装置
US4962441A (en) * 1989-04-10 1990-10-09 Applied Materials, Inc. Isolated electrostatic wafer blade clamp
JPH0499320A (ja) * 1990-08-17 1992-03-31 Soatetsuku:Kk ウエハ保護テープの自動芯出し方法
USH1373H (en) * 1992-04-06 1994-11-01 American Telephone And Telegraph Company Wafer handling apparatus and method
JPH05315434A (ja) * 1992-05-07 1993-11-26 Nec Yamagata Ltd 半導体ウェーハ保持具
JPH0758191A (ja) * 1993-08-13 1995-03-03 Toshiba Corp ウェハステージ装置
US5515167A (en) * 1994-09-13 1996-05-07 Hughes Aircraft Company Transparent optical chuck incorporating optical monitoring
US5622400A (en) * 1995-06-07 1997-04-22 Karl Suss America, Inc. Apparatus and method for handling semiconductor wafers
KR100432975B1 (ko) * 1995-07-27 2004-10-22 닛토덴코 가부시키가이샤 반도체웨이퍼의수납·인출장치및이것에이용되는반도체웨이퍼의운반용기
US5703493A (en) * 1995-10-25 1997-12-30 Motorola, Inc. Wafer holder for semiconductor applications
JP3586817B2 (ja) * 1995-12-26 2004-11-10 株式会社オーク製作所 画像形成用露光装置とワーク位置決め方法
US5930652A (en) * 1996-05-28 1999-07-27 Motorola, Inc. Semiconductor encapsulation method
JPH1092776A (ja) * 1996-09-12 1998-04-10 Disco Abrasive Syst Ltd 被加工物用保護部材及びウエーハの研磨方法
JPH10154671A (ja) * 1996-11-26 1998-06-09 Mitsubishi Electric Corp 半導体製造装置、及び半導体装置の製造方法
US5861632A (en) * 1997-08-05 1999-01-19 Advanced Micro Devices, Inc. Method for monitoring the performance of an ion implanter using reusable wafers
JPH1174164A (ja) * 1997-08-27 1999-03-16 Canon Inc 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法
JPH11176731A (ja) * 1997-12-15 1999-07-02 Nitto Denko Corp レジスト除去装置
JP4283926B2 (ja) * 1999-02-22 2009-06-24 株式会社アルバック ウエハカセットのウエハ保持システム
EP1089328A1 (de) * 1999-09-29 2001-04-04 Infineon Technologies AG Verfahren zur Herstellung eines Halbleiterbauelementes
JP4085538B2 (ja) * 1999-10-15 2008-05-14 ソニー株式会社 検査装置
SG93901A1 (en) * 1999-10-25 2003-01-21 Tokyo Electron Ltd Substrate processing system and substrate processing method
JP2001239487A (ja) * 2000-02-29 2001-09-04 Nippei Toyama Corp ウェーハの搬送装置における真空保持装置および真空保持解除方法
JP4302284B2 (ja) * 2000-03-29 2009-07-22 リンテック株式会社 半導体ウェハの移載装置
US6541989B1 (en) * 2000-09-29 2003-04-01 Motorola, Inc. Testing device for semiconductor components and a method of using the device
US6612590B2 (en) * 2001-01-12 2003-09-02 Tokyo Electron Limited Apparatus and methods for manipulating semiconductor wafers
JP3983053B2 (ja) * 2002-01-17 2007-09-26 日東電工株式会社 保護テープの切断方法およびそれを用いた保護テープ貼付装置

Also Published As

Publication number Publication date
SG111979A1 (en) 2005-06-29
EP1320121B1 (de) 2010-02-17
ATE458267T1 (de) 2010-03-15
TW200300999A (en) 2003-06-16
KR20030045602A (ko) 2003-06-11
KR100901040B1 (ko) 2009-06-04
CN100390953C (zh) 2008-05-28
JP4201564B2 (ja) 2008-12-24
EP1320121A3 (de) 2006-07-05
JP2003234392A (ja) 2003-08-22
TWI251893B (en) 2006-03-21
CN1422791A (zh) 2003-06-11
US7078262B2 (en) 2006-07-18
US20030133762A1 (en) 2003-07-17
EP1320121A2 (de) 2003-06-18

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