TWI571949B - 半導體元件翻轉裝置 - Google Patents

半導體元件翻轉裝置 Download PDF

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TWI571949B
TWI571949B TW102101043A TW102101043A TWI571949B TW I571949 B TWI571949 B TW I571949B TW 102101043 A TW102101043 A TW 102101043A TW 102101043 A TW102101043 A TW 102101043A TW I571949 B TWI571949 B TW I571949B
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positioning
platform
semiconductor component
inverting
roller
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TW102101043A
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TW201428871A (zh
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魏志偉
許嘉良
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晶元光電股份有限公司
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D37/00Tools as parts of machines covered by this subclass
    • B21D37/14Particular arrangements for handling and holding in place complete dies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/15Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor incorporating preformed parts or layers, e.g. extrusion moulding around inserts
    • B29C48/154Coating solid articles, i.e. non-hollow articles
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67109Apparatus for thermal treatment mainly by convection
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0811Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using induction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/10Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation for articles of indefinite length
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/06Rod-shaped
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/16Articles comprising two or more components, e.g. co-extruded layers
    • B29C48/18Articles comprising two or more components, e.g. co-extruded layers the components being layers
    • B29C48/19Articles comprising two or more components, e.g. co-extruded layers the components being layers the layers being joined at their edges
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25Component parts, details or accessories; Auxiliary operations
    • B29C48/88Thermal treatment of the stream of extruded material, e.g. cooling
    • B29C48/91Heating, e.g. for cross linking
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25Component parts, details or accessories; Auxiliary operations
    • B29C48/88Thermal treatment of the stream of extruded material, e.g. cooling
    • B29C48/911Cooling
    • B29C48/9135Cooling of flat articles, e.g. using specially adapted supporting means

Description

半導體元件翻轉裝置

本發明揭露一半導體元件翻轉裝置,特別是關於一晶圓型式(wafer form)或晶粒型式(chip form)之半導體元件翻轉裝置。

為因應半導體元件製作步驟的需求或製程設備的限制,常有將上表面向上之半導體元件整個翻轉至下表面向上的情況。目前方法為利用人工手動完成此翻轉動作,人工手動翻轉半導體元件不僅費時費力,且易造成半導體元件結構遭受到傷害。

本發明提供一半導體元件翻轉裝置,包含:一平台,包含一承載台及一滾輪系統;一定位裝置位於平台之上方,包含一圓形開口區域;及一移動裝置連接平台與定位裝置。

本發明提供一半導體元件翻轉裝置,其操作步驟如下:1.將欲翻轉的半導體元件固定於一鐵環之膠體物質之上,2.將鐵環固定於定位裝置,3.完成定位裝置定位動作,4.進行翻轉動作,5.定位 裝置回復至起始位置,6.取出翻轉完成之半導體元件。

1‧‧‧平台

1a‧‧‧平台之上表面

2‧‧‧滾輪系統

2a‧‧‧滾輪

2b‧‧‧軌道

3‧‧‧承載台

3a‧‧‧承載治具

4‧‧‧移動式加熱器

5‧‧‧定位裝置

5a‧‧‧圓形開口區域

5b‧‧‧鐵環

5c‧‧‧膠體物質

5d‧‧‧定位裝置之上表面

6‧‧‧移動裝置

7‧‧‧支柱

8‧‧‧發光二極體晶粒

D‧‧‧平台與定位裝置之距離

d‧‧‧鐵環與承載治具之距離

第1圖係描述本發明半導體元件翻轉裝置之結構圖。

第2圖係描述本發明半導體元件固定於膠體物質之上之示意圖。

第3圖係描述本發明半導體元件翻轉裝置進行翻轉動作之示意圖。

為了使本發明之敘述更加詳盡與完備,請參照下列描述並配合第1-3圖之圖式。

第1圖所示為本發明所揭露之半導體元件翻轉裝置,係包含:一平台1,包含一上表面1a;一滾輪系統2及一承載台3位於此上表面1a之上;一定位裝置5包含一上表面5d位於平台1之上方,包含一圓形開孔區域5a;及一移動裝置6連接平台1與定位裝置5。

於本實施例中,滾輪系統2更包含一滾輪2a及一軌道2b,且滾輪2a沿著此軌道2b滾動。滾輪2a可由非剛體材料所組成,亦可由彈性材料所組成,例如:橡膠。滾輪2a具有下壓和滾動的功能,當滾輪滾動時速度可為等速度,變速度或等加速度。另外,滾輪2a外觀可為一圓柱體狀或一凸透鏡狀之柱體。承載台3包含一加熱裝置(圖未示),另包含一承載治具3a位於承載台3之上;其中此承載治具3a 之上可附著一膠體物質(圖未示),且此膠體物質可藉由溫度的變化以改變其黏性。於本實施例中,膠體物質可為一發泡膠。

一定位裝置5位於平台1之上方,包含一圓形開口區域5a。另外,一移動式加熱器4被固定於一支柱7上,且可藉由支柱7上下移動於定位裝置5之上方改變移動式加熱器4的位置。一移動裝置6位於平台1與定位裝置5之間且連接平台1與定位裝置5。移動裝置6更包含一氣壓缸(圖未示)作為其動力來源。於本實施例中,移動裝置6具有4個可調式單軸氣壓缸。定位裝置5可藉此移動裝置6以接近或遠離平台1。

本發明揭露之半導體元件翻轉裝置具有將一上表面向上之半導體元件翻轉至其下表面向上之功能;其中半導體元件可為晶圓型式或晶粒型式之元件,例如:發光二極體晶圓或發光二極體晶粒。本實施例中以翻轉發光二極體晶粒8為例,操作翻轉裝置步驟如下:

1.將欲翻轉的發光二極體晶粒8固定於一鐵環5b之膠體物質5c之上:第2圖係描述發光二極體晶粒8固定於一膠體物質之上之示意圖。首先如第2a圖所示,提供一鐵環5b;再如第2b圖所示,於鐵環5b附著一膠體物質5c;於本實施例中,膠體物質5c可為一膠膜。如第2c圖所示,將欲翻轉的發光二極體晶粒8以上表面向上且下表面和膠體物質5c直接接觸之方式固定。於本實施例中,膠體物質5c可藉由溫度的變化以改變其黏性,且當黏性改變時不會污染欲翻轉之發光二極體晶粒8。

2.將鐵環5b固定於定位裝置5:將其上附著膠體物質5c之鐵環5b以欲翻轉發光二極體晶粒8其上表面向下的方式固定在定位裝置5之圓形開口區域5a。此時定位裝置5位於一特定位置,且定位裝置之上表面5d與平台之上表面1a之間的距離為D,此特定位置稱為起始位置。

3.完成定位裝置5定位動作:如第3圖所示,將承載治具2a之上放置一基材(圖未示),例如:一氧化鋁基材,且其上附著一膠體物質(圖未示),例如:一發泡膠;然後啟動承載台3之加熱裝置(圖未示)加熱膠體物質以增加其粘性。藉由移動移動裝置6以調整圓形開口區域5a與承載台3之承載治具3a之相對位置,以利後續進行翻轉動作。於本實施例中,鐵環5b與承載治具3a之間距離d不大於0.2公分。

4.進行翻轉動作:繼續參照第3圖,當定位裝置5完成定位動作後,滾輪2a會沿著第1圖之軌道2b進行下壓及滾動的動作。於本實施例中,滾輪2a會在附著鐵環5b之上的膠體物質5c表面來回滾動至少一次。一般而言,滾輪2a下壓及滾動的動作可藉由設定一組可程式邏輯控制器(Programmable Logic Controller,PLC)(圖未示)以執行。接著,支柱7向下移動以使改變移動式加熱器4位於鐵環5b之膠體物質5c之上方,然後開啟移動式加熱器4並施加熱量於膠體物質5c;此時膠體物質5c因溫度的變化改變其黏性,使原黏著其上的發光二極體晶粒8脫落並轉置於承載治具3a之基材之膠體物質上,以完成翻轉之動作。

5.定位裝置5回復至起始位置。

6.取出翻轉完成之發光二極體晶粒8。

依據本發明之實施例中所述之半導體元件可為發光二極體晶粒8,其中常用之材料係如磷化鋁鎵銦(AlGaInP)系列、氮化鋁鎵銦(AlGaInN)系列、氧化鋅(ZnO)系列等。

以上各圖式與說明雖僅分別對應特定實施例,然而,各個實施例中所說明或揭露之元件、實施方式、設計準則、及技術原理除在彼此顯相衝突、矛盾、或難以共同實施之外,吾人當可依其所需任意參照、交換、搭配、協調、或合併。

雖然本發明已說明如上,然其並非用以限制本發明之範圍、實施順序、或使用之材料與製程方法。對於本發明所作之各種修飾與變更,皆不脫本發明之精神與範圍。

1‧‧‧平台

1a‧‧‧平台之上表面

2‧‧‧滾輪系統

2a‧‧‧滾輪

2b‧‧‧軌道

3‧‧‧承載台

3a‧‧‧承載治具

4‧‧‧移動式加熱器

5‧‧‧定位裝置

5a‧‧‧圓形開口區域

5d‧‧‧定位裝置之上表面

6‧‧‧移動裝置

7‧‧‧支柱

D‧‧‧平台與定位裝置之距離

Claims (10)

  1. 一半導體元件翻轉裝置,包含:一平台,包含一承載台及一滾輪系統;一定位裝置位於該平台之上方,包含一圓形開口區域;及一移動裝置連接該平台與該定位裝置。
  2. 如申請專利範圍第1項所述之半導體元件翻轉裝置,其中該承載台更包含一加熱裝置。
  3. 如申請專利範圍第1項所述之半導體元件翻轉裝置,其中該滾輪系統更包含:一滾輪及一軌道,其中該軌道可供該滾輪於其上滾動。
  4. 如申請專利範圍第1項所述之半導體元件翻轉裝置,其中更包含一移動式加熱器位於該定位裝置之上方。
  5. 如申請專利範圍第1項所述之半導體元件翻轉裝置,其中該定位裝置藉由該移動裝置接近或遠離該平台。
  6. 如申請專利範圍第1項所述之半導體元件翻轉裝置,其中更包含一鐵環固定於該定位裝置之該圓形開口區域。
  7. 如申請專利範圍第3項所述之半導體元件翻轉裝置,其中該滾輪由橡膠所組成。
  8. 如申請專利範圍第1項所述之半導體元件翻轉裝置,其中更包含一承載治具位於該承載台之上。
  9. 如申請專利範圍第1項所述之半導體元件翻轉裝置,更包含一膠體物質位於該承載台上,其中該膠體物質可藉由溫度的變化以改變其黏性。
  10. 一種操作如申請專利範圍第1至9項之任一項所述之半導體元件翻轉裝置之方法,包含:使該定位裝置位於一起始位置;將一欲翻轉的半導體元件固定於該平台之上;完成該定位裝置定位動作;進行翻轉該半導體元件之動作;使該定位裝置回復至該起始位置;及取出翻轉完成之該半導體元件。
TW102101043A 2013-01-10 2013-01-10 半導體元件翻轉裝置 TWI571949B (zh)

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TW102101043A TWI571949B (zh) 2013-01-10 2013-01-10 半導體元件翻轉裝置
US14/150,439 US9209058B2 (en) 2013-01-10 2014-01-08 Apparatus for flipping semiconductor device
US14/960,819 US9754808B2 (en) 2013-01-10 2015-12-07 Apparatus for flipping semiconductor device for transferring the semiconductor device between substrates
US15/666,075 US10651069B2 (en) 2013-01-10 2017-08-01 Apparatus for flipping semiconductor device

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TWI571949B true TWI571949B (zh) 2017-02-21

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TWI571949B (zh) * 2013-01-10 2017-02-21 晶元光電股份有限公司 半導體元件翻轉裝置
TWI548004B (zh) * 2015-04-30 2016-09-01 Saul Tech Technology Co Ltd 晶粒定位佈置設備以及晶粒定位佈置方法

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