FR2857504B1 - Capteur d'image de grande dimension et procede de fabrication - Google Patents

Capteur d'image de grande dimension et procede de fabrication

Info

Publication number
FR2857504B1
FR2857504B1 FR0308340A FR0308340A FR2857504B1 FR 2857504 B1 FR2857504 B1 FR 2857504B1 FR 0308340 A FR0308340 A FR 0308340A FR 0308340 A FR0308340 A FR 0308340A FR 2857504 B1 FR2857504 B1 FR 2857504B1
Authority
FR
France
Prior art keywords
image sensor
microchip
holes
case
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0308340A
Other languages
English (en)
Other versions
FR2857504A1 (fr
Inventor
Gilles Simon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teledyne e2v Semiconductors SAS
Original Assignee
Atmel Grenoble SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atmel Grenoble SA filed Critical Atmel Grenoble SA
Priority to FR0308340A priority Critical patent/FR2857504B1/fr
Publication of FR2857504A1 publication Critical patent/FR2857504A1/fr
Application granted granted Critical
Publication of FR2857504B1 publication Critical patent/FR2857504B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • HELECTRICITY
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    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67132Apparatus for placing on an insulating substrate, e.g. tape
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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    • H01L23/00Details of semiconductor or other solid state devices
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    • H01L24/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L21/67005Apparatus not specifically provided for elsewhere
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    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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    • H01L2224/92Specific sequence of method steps
    • H01L2224/922Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222Sequential connecting processes
    • H01L2224/92242Sequential connecting processes the first connecting process involving a layer connector
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FR0308340A 2003-07-08 2003-07-08 Capteur d'image de grande dimension et procede de fabrication Expired - Fee Related FR2857504B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0308340A FR2857504B1 (fr) 2003-07-08 2003-07-08 Capteur d'image de grande dimension et procede de fabrication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0308340A FR2857504B1 (fr) 2003-07-08 2003-07-08 Capteur d'image de grande dimension et procede de fabrication

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FR2857504A1 FR2857504A1 (fr) 2005-01-14
FR2857504B1 true FR2857504B1 (fr) 2006-01-06

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FR0308340A Expired - Fee Related FR2857504B1 (fr) 2003-07-08 2003-07-08 Capteur d'image de grande dimension et procede de fabrication

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2915573B1 (fr) 2007-04-25 2010-04-02 Fr De Detecteurs Infrarouges S Procede pour la realisation d'une matrice de detection de rayonnements electromagnetiques et notamment de rayonnements infrarouges

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5252850A (en) * 1992-01-27 1993-10-12 Photometrics Ltd. Apparatus for contouring a semiconductor, light responsive array with a prescribed physical profile
EP1170788A3 (fr) * 2000-07-03 2002-08-07 Esec Trading S.A. Méthode et appareil de montage de plaquettes semi-conductrices sur un substrat flexible
AT411197B (de) * 2001-02-16 2003-10-27 Datacon Semiconductor Equip Verfahren zum montieren, haltern oder abmontieren eines wafers sowie einrichtung zur durchführung des verfahrens
JP4201564B2 (ja) * 2001-12-03 2008-12-24 日東電工株式会社 半導体ウエハ搬送方法およびこれを用いた半導体ウエハ搬送装置

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