TW200640278A - Electret condenser silicon microphone and fabrication method of the same - Google Patents
Electret condenser silicon microphone and fabrication method of the sameInfo
- Publication number
- TW200640278A TW200640278A TW094114718A TW94114718A TW200640278A TW 200640278 A TW200640278 A TW 200640278A TW 094114718 A TW094114718 A TW 094114718A TW 94114718 A TW94114718 A TW 94114718A TW 200640278 A TW200640278 A TW 200640278A
- Authority
- TW
- Taiwan
- Prior art keywords
- pcb
- diaphragm
- silicon chip
- metal
- metal perforated
- Prior art date
Links
Abstract
An electret condenser silicon microphone having a silicon chip with diaphragm, a metal perforated plate, a printed circuit board (PCB), and a metal shell is provided. The silicon chip and the metal perforated plate are assembled as a parallel plate condenser having a predetermined bias by applying a electret layer within. The diaphragm is formed by using Micro-Electro-Mechanical System (MEMS) technology. The metal perforated plate having at least one hole is positioned under the silicon chip and separated from the diaphragm with a preset distance. The PCB is positioned under the metal perforated board and electrically connected to it. The metal shell is assembled on the PCB and contains the silicon chip and the metal perforated board assembled within. A through hole is formed on the shell to have the ambient acoustic pressure vibrate the diaphragm. So the parallel plate condenser generates a corresponding electric signal, which is processed and out put by the PCB.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94114718A TWI312638B (en) | 2005-05-06 | 2005-05-06 | Electret condenser silicon microphone and fabrication method of the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94114718A TWI312638B (en) | 2005-05-06 | 2005-05-06 | Electret condenser silicon microphone and fabrication method of the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200640278A true TW200640278A (en) | 2006-11-16 |
TWI312638B TWI312638B (en) | 2009-07-21 |
Family
ID=45072629
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94114718A TWI312638B (en) | 2005-05-06 | 2005-05-06 | Electret condenser silicon microphone and fabrication method of the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI312638B (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090175477A1 (en) * | 2007-08-20 | 2009-07-09 | Yamaha Corporation | Vibration transducer |
TWI477156B (en) * | 2008-12-17 | 2015-03-11 | Goertek Inc | Miniature condenser microphone |
TWI486069B (en) * | 2010-05-18 | 2015-05-21 | Taiwan Carol Electronics Co Ltd | Capacitive microphone process |
US9258662B2 (en) | 2013-02-18 | 2016-02-09 | National Tsing Hua University | Condenser microphone and manufacturing method thereof |
TWI553884B (en) * | 2013-06-05 | 2016-10-11 | 應美盛股份有限公司 | Capacitive sensing structure with embedded acoustic channels and method of manufacturing the same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9491531B2 (en) | 2014-08-11 | 2016-11-08 | 3R Semiconductor Technology Inc. | Microphone device for reducing noise coupling effect |
-
2005
- 2005-05-06 TW TW94114718A patent/TWI312638B/en active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090175477A1 (en) * | 2007-08-20 | 2009-07-09 | Yamaha Corporation | Vibration transducer |
TWI477156B (en) * | 2008-12-17 | 2015-03-11 | Goertek Inc | Miniature condenser microphone |
TWI486069B (en) * | 2010-05-18 | 2015-05-21 | Taiwan Carol Electronics Co Ltd | Capacitive microphone process |
US9258662B2 (en) | 2013-02-18 | 2016-02-09 | National Tsing Hua University | Condenser microphone and manufacturing method thereof |
US9729990B2 (en) | 2013-02-18 | 2017-08-08 | National Tsing Hua University | Manufacturing method of a condenser microphone |
TWI553884B (en) * | 2013-06-05 | 2016-10-11 | 應美盛股份有限公司 | Capacitive sensing structure with embedded acoustic channels and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
TWI312638B (en) | 2009-07-21 |
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