TWI486069B - Capacitive microphone process - Google Patents

Description

Capacitive microphone process

The invention relates to a microphone process, in particular to a condenser microphone process.

Due to the pursuit of high quality, high price and high functionality, electronic products must be light and thin, and the development of microphones is no exception, especially after the introduction of MEMS process, even under high-performance conditions. Significantly reducing the size of the microphone, it has become the main focus of the development of the microphone.

Referring to FIG. 1 , the conventional condenser microphone 1 includes a housing 11 , a semi-finished product 12 encapsulated in the housing 11 , and an electronic component 14 .

The housing 11 is formed by a housing 111 through which external acoustic energy passes and a printed circuit board 112 (PCB). The semi-finished product 12 is tightly packaged in the housing 11 and is associated with the printed circuit board 112. The electronic component 14 is a field effect transistor that is received in the gap 13 and electrically connected to the semi-finished product 12 and the printed circuit board 112.

The semi-finished product 12 includes a circuit board spacer 121, a backing plate 122, a diaphragm gasket 123, a diaphragm 124, and a grounding pad 126.

The circuit board pad 121 is insulated and can be disposed on the printed circuit board 112. The back plate 122 is disposed on the circuit board pad 121 and has a plurality of air holes 127, and cooperates with the circuit board. The shims 121 and the printed circuit board 112 define the gap 13 for the electronic component 14 to be received therein. The diaphragm gasket 123 is disposed on the backing plate 122. The diaphragm 124 is disposed on the diaphragm gasket 123. And cooperate with the diaphragm gasket 123 and the backing plate 122 to define a back air chamber 125 that communicates with the outside through the air holes 127, and the diaphragm 124 cooperates with the back plate 122 to form a capacitor. The grounding pad 126 is electrically conductively disposed on a side of the diaphragm 124 opposite to the diaphragm pad 123, and the diaphragm 124 is grounded by the casing 111 and the printed circuit board 112.

When the condenser microphone 1 is subjected to external acoustic energy, the acoustic energy penetrates through the casing 111 to deform the diaphragm 124, and the capacitance formed by the diaphragm 124 and the backing plate 122 is changed. The electronic component 14 is converted to an electrical signal for output to the outside world.

Referring to FIG. 2, the above-mentioned condenser microphone 1 is manufactured in two ways. One is the technique disclosed in US Pat. No. 7,327,851, which is shown in FIG. 2: the casing 111, the grounding pad 126, and the diaphragm 124 are separately fabricated. The diaphragm gasket 123, the backing plate 122, the circuit board spacer 121, the electronic component 14, and the printed circuit board 112 are assembled into the condenser microphone 1 in sequence. The advantage of this fabrication is that the prefabrication of each component is simple, but the disadvantage is that the number of components that need to be assembled in the package is too large and requires a lot of assembly man-hours, which greatly reduces the production efficiency and, in addition, the sensitivity of each component to the external environment. Different, so in the high temperature or high humidity environment, product characteristics are subject to change.

Referring to FIG. 3, another manufacturing method is the technology disclosed in US Pat. No. 6,684,090. A semi-finished wafer 12' having a circuit board spacer 121, a backing plate 122, a diaphragm gasket 123, and a diaphragm 124 is directly fabricated by a microelectromechanical process. Then, the semi-finished wafer 12' is packaged with the electronic component 14, the casing 111, and the printed circuit board 112 to obtain the condenser microphone 1'. Such a manufacturing process can greatly reduce the assembly man-hour required for packaging, and the semi-finished wafer fabricated by the micro-electromechanical process can be improved in overall sensitivity and sensitivity, and can reduce the influence of temperature and humidity, but the disadvantage is that the semi-finished wafer contains The number of components is increased, but the complexity is greatly increased, and the process yield is also reduced, which makes the production cost high.

Therefore, the current production method of the condenser microphone still needs to be improved to provide another production method with more practical commercial production value, which has been a technical bottleneck for the industry to break through.

Accordingly, it is an object of the present invention to provide a condenser microphone process which can increase productivity, reduce product characteristics by environmental factors such as temperature and humidity, and which is simple to manufacture.

Thus, a condenser microphone process of the present invention comprises the following three steps.

First, a diaphragm module wafer is fabricated by a microelectromechanical process, wherein the diaphragm module wafer has a diaphragm that is deformed by the action of acoustic energy, and a diaphragm extending downward from the bottom surface of the diaphragm and restricting the diaphragm A diaphragm gasket that is tensioned and stretched.

Next, a prefabricated backplane having a plurality of pores is connected to the diaphragm gasket corresponding to the central region of the diaphragm, so that the diaphragm, the diaphragm gasket and the backing plate form a The back air chamber, which communicates with the outside air, produces half of the finished product.

Finally, the diaphragm is matched with the backing plate to form a capacitor, and the semi-finished product is packaged in a housing composed of a casing and a circuit board for sound energy to pass through, and the condenser microphone is fabricated.

Furthermore, another capacitive microphone process of the present invention comprises the following three steps.

First, a diaphragm module wafer is fabricated by a microelectromechanical process, wherein the diaphragm module wafer has a diaphragm that is deformed when subjected to acoustic energy, and extends downward from the bottom surface of the diaphragm and limits the diaphragm to a tensioned tensioned diaphragm gasket and a front cavity gasket formed from a top surface of the diaphragm with a conductive material.

Next, a prefabricated backplane having a plurality of pores is connected to the diaphragm gasket corresponding to the central region of the diaphragm, so that the diaphragm, the diaphragm gasket and the backing plate form a The back air chamber, which communicates with the outside air, produces half of the finished product.

Finally, the diaphragm is matched with the backing plate to form a capacitor, and the semi-finished product is packaged in a housing composed of a casing and a circuit board for sound energy to pass through, and the condenser microphone is fabricated.

Furthermore, another capacitive microphone process of the present invention comprises the following three steps.

First, a diaphragm module wafer is fabricated by a microelectromechanical process, wherein the diaphragm module wafer has a diaphragm that is deformed by the action of acoustic energy, and a diaphragm extends upward from the top of the diaphragm and limits the diaphragm. A tensioned, anterior chamber gasket.

Next, a prefabricated diaphragm gasket is glued to the bottom surface of the diaphragm of the diaphragm module wafer, and a prefabricated backplane having a plurality of pores is connected to the central region of the diaphragm with the pores The diaphragm gasket is such that the diaphragm, the diaphragm gasket and the back plate form a back air chamber that communicates with the outside through the air holes, and half of the finished product is obtained.

Finally, the diaphragm is matched with the backing plate to form a capacitor, and the semi-finished product is packaged in a housing composed of a casing and a circuit board for sound energy to pass through, and the condenser microphone is fabricated.

The effect of the invention is that the diaphragm module wafer with the diaphragm and simple structure is fabricated by the micro-electromechanical process, and the pre-fabricated components are assembled into a condenser microphone, which can reduce the temperature characteristics of the product under the premise of maintaining the sensing sensitivity. The effect of humidity, at the same time, the number of components in the overall package is reduced to help reduce package man-hours and improve process yield.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments of the invention.

Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to FIG. 4, a first preferred embodiment of the condenser microphone process of the present invention includes three steps for fabricating a condenser microphone 200 similar to that shown in FIG.

Referring to FIG. 4 and FIG. 5, step 21 is first performed to fabricate a diaphragm module wafer 201 having a diaphragm 202 and a diaphragm spacer 203 by a microelectromechanical process; in detail, for example, sputtering is performed on a substrate. Forming, by vapor deposition, deposition or spinning, a vibration layer 204 which is deformed by the action of sound energy, and a conductive layer 205 formed on the vibration layer 204 and electrically conductive, so that the vibration layer 204 and the After the conductive layer 205 is configured to form the diaphragm 202, the substrate is etched to form a predetermined pattern to form the diaphragm spacer 203, and the diaphragm module wafer 201 is completed. The diaphragm 202 is subjected to external acoustic energy. The deformation is generated, and the diaphragm gasket 203 restricts the diaphragm 202 to a tensioned tension state, and the conductive layer 205 is made of a conductive material and is available for grounding.

Referring to FIG. 4 and FIG. 6, proceeding to step 22, a pre-made backplane 206 having a plurality of air holes 207 and a back conductive layer 208 is connected to the diaphragm pad with the air holes 207 corresponding to the central region of the diaphragm 202. The sheet 203 is such that the diaphragm 202, the diaphragm gasket 203 and the backing plate 206 form a back air chamber 209 communicating with the outside through the air holes 207, and then a prefabricated and electrically conductive front chamber gasket 210 is glued. The diaphragm 202 is adhered to the diaphragm module wafer 201 to produce a semi-finished product 211. In this example, the backing plate 206 is disposed on the diaphragm spacer 203 in a lying manner, and the back conductive layer is disposed. The 208 is made of a conductive material. Preferably, the back plate 206 is adhesively attached to the diaphragm spacer 203.

Referring to FIG. 4 and FIG. 7 , finally step 23 is performed to cooperate with the back plate 206 to form a capacitor 212 that generates an electrical signal when subjected to external acoustic energy, and package the semi-finished product 211 in a cover 214. The condenser microphone 200 is formed in a housing 213 formed by a circuit board 215 for sound energy to pass through; wherein the circuit board 215 has a sound hole 216 through which sound energy passes, and a back plate The back conductive layer 208 of the 206 is electrically connected to the electronic component 217, and the electronic component 217 is received in the gap 218 formed by the backplane 206 and the circuit board 215 in the housing 213. The backplane 206 is electrically connected to the back conductive layer 208 of the backplane 206, so that the electrical signal of the capacitor 212 is output to the outside through the backplane 206, the electronic component 217, and the circuit board 215; The front cavity gasket 210 causes the diaphragm 202 of the condenser microphone 200 to be grounded through the front cavity spacer 210, the casing 214, and the circuit board 215 through the conductive layer 205.

It should be noted that, in this example, the front cavity spacer 210 is adhered to ground the diaphragm 202, and the diaphragm 202 can be electrically connected to the circuit board 215 by wire bonding. The front cavity gasket 210 is glued.

In addition, in this example, the backplane 206 is electrically connected to the electronic component 217 via the back conductive layer 208, but the backplane 206 can also be directly made of a conductive material, and no additional fabrication is required. The back conductive layer 208.

Referring to FIG. 8, it is worth mentioning that the condenser microphone 200 can pass through a ring-shaped and electrically conductive conductive ring 220, as shown in FIG. 8, such that the back plate 206 passes through the back conductive layer 208 of the back plate 206. The conductive ring 220 and the circuit board 215 are electrically connected to the electronic component 217 of the circuit board 215 to output the electrical signal of the capacitor 212 to the outside, and the conductive ring 220 abuts against the back plate 206. When the backing plate 206 is disposed on the diaphragm film in a placement manner, the electronic component 217 does not need to be supported by the electronic component 217, and the installation position of the electronic component 217 can be changed as needed, for example, on the bottom surface of the circuit board 215 or This gap 218 is external.

Referring to Fig. 9, it is also worth mentioning that a sound hole 221 through which external sound energy can pass can also be formed on the casing 214' as shown in Fig. 9.

Referring to FIG. 10, it is also worth mentioning that an electret layer 222 composed of an electret material is further formed on one side of the backing plate 206' opposite to the back conductive layer 208, as shown in FIG. The back conductive layer 208 does not need to supply a voltage by the outside.

As can be seen from the above description, the present invention is a micro-electromechanical process for fabricating a diaphragm module wafer 201 having a simple structure of a diaphragm 202 and a diaphragm gasket 203, and then the diaphragm module wafer 201 and other prefabricated front chambers. The spacer 210 and the back plate 206 are assembled into a semi-finished product 211, and then packaged with components such as the cover 214 and the circuit board 215 to form the condenser microphone 200.

Compared with the existing prefabricated all components and the method of sequentially stacking the packages, the present invention fabricates the diaphragm module wafer 201 by the microelectromechanical process, so that the sensitivity of the microphone is effectively improved, and the required operation is greatly reduced. The number of packaged components can reduce the number of man-hours for packaging and assembly, and improve the yield of the process. In addition, because the components are glued, the sensitivity of each component to temperature and humidity can be reduced. Maintain the product characteristics of the condenser microphone.

Compared with the existing manufacturing method of fully manufacturing the semi-finished wafer after the semi-finished wafer is fabricated, and the circuit board 215 is packaged, the present invention not only similarly manufactures the diaphragm module wafer 201 by the micro-electromechanical process, but also effectively improves the microphone. Sensitivity, and because of the simple structure of the diaphragm module wafer 201 to be fabricated, the complexity and difficulty of the microelectromechanical process can be greatly reduced, thereby greatly reducing the manufacturing cost, and providing a more economical manufacturing method to produce a highly sensitive capacitor. Microphones effectively meet the needs of the market.

Referring to FIG. 4, a second preferred embodiment of the condenser microphone process of the present invention includes three steps for fabricating a condenser microphone 300 similar to that shown in FIG.

Referring to FIG. 4 and FIG. 11, first, step 21 is performed to fabricate a diaphragm module wafer 301 having a diaphragm 302 and a diaphragm gasket 303 by a microelectromechanical process; in detail, for example, sputtering is performed on a substrate. Forming, by vapor deposition, deposition or spinning, a vibration layer 304 which is deformed by the action of the acoustic energy, and a conductive layer 305 formed on the vibration layer 304 and electrically conductive, and the vibration layer 304 and the After the conductive layer 305 is configured to form the diaphragm 302, the substrate is etched to form a predetermined pattern to form the diaphragm spacer 303, and the diaphragm module wafer 301 is completed.

Referring to FIG. 4 and FIG. 12, proceeding to step 22, a simple prefabricated insulated circuit board spacer 306 is first adhered, and a prefabricated backplane 307 having a plurality of air holes 308 and a back conductive layer 309 is applied thereto. The air hole 308 is glued to the diaphragm pad 303 corresponding to the central area of the diaphragm 302, so that the diaphragm 302, the diaphragm pad 303 and the back plate 307 form a hole 308 and The externally connected back chamber 310 is then bonded to a diaphragm 302 of the diaphragm module wafer 301 by a prefabricated and electrically conductive front chamber spacer 311 to produce a semi-finished product 312.

Referring to FIG. 4 and FIG. 13 , finally, step 23 is performed to cooperate with the back plate 307 to form a capacitor 313 for generating an electrical signal when external acoustic energy is applied, and the semi-finished product 312 is packaged in a casing 315. The condenser microphone 300 is formed in a housing 314 formed by a circuit board 316 and through which sound energy passes. The circuit board 316 has a sound hole 317 through which sound energy passes, and a back plate. The back conductive layer 309 of the 307 is electrically connected to the electronic component 318, and the electronic component 318 is received in the semi-finished product 312, the backplane 307, the circuit board spacer 306, and the circuit board 316 is packaged in the housing 314. In the resulting gap 319.

Compared with the first preferred embodiment, after the diaphragm gasket 303 shown in FIG. 10 is fabricated by the microelectromechanical process, the simple prefabricated circuit board spacer 306 is glued, so that the original needs to be fabricated as shown in FIG. The process of the diaphragm gasket 203 shown in FIG. 5 for the arrangement of the backing plate 206 is greatly reduced, and the time required to fabricate the diaphragm gasket 303 is also greatly reduced, further reducing the difficulty of the microelectromechanical process. The time required for the process.

Referring to Figure 14, a third preferred embodiment of the condenser microphone process of the present invention comprises three steps for fabricating a condenser microphone 400 similar to that shown in Figure 1.

Referring to FIG. 14 and FIG. 15, first, step 31 is performed to fabricate a diaphragm module wafer 401 having a diaphragm 402, a diaphragm gasket 403, and a front cavity spacer 404 in a microelectromechanical process; On the substrate made of a conductive material, an electrically conductive conductive layer 406 is formed in a manner such as sputtering, evaporation, deposition or spin coating, and a vibration is formed on the conductive layer 406 and deformed by the action of acoustic energy. a layer 405, and a plate formed on the vibration layer 405, the vibration layer 405 and the conductive layer 406 together form the diaphragm 402, and the substrate is etched into a predetermined pattern to form the front cavity spacer 404, and then The diaphragm 403 is etched into a predetermined pattern to complete the fabrication of the diaphragm module wafer 401. The diaphragm 402 is deformed by external acoustic energy, and the diaphragm 403 limits the The diaphragm 402 is in a tensioned state, and the conductive layer 405 is made of a conductive material and is available for grounding.

Referring to FIG. 14 and FIG. 16, step 32 is followed by first bonding a simple prefabricated insulated circuit board spacer 407, and then prefabricating a backing plate 408 having a plurality of air holes 409 and a back conductive layer 410. The air hole 409 is glued to the diaphragm gasket 403 corresponding to the central region of the diaphragm 402, so that the diaphragm 402, the diaphragm gasket 403 and the back plate 408 form a hole 409 and The back air chamber 411, which is connected to the outside, produces half of the finished product 412; in this example, the back conductive layer 410 is made of a conductive material.

Referring to FIG. 14 and FIG. 17, finally, step 33 is performed to cooperate with the backing plate 408 to form a capacitor 413 that generates an electrical signal when subjected to external acoustic energy, and the semi-finished product 412 is packaged in a casing 415. The condenser microphone 400 is formed in a housing 414 formed by a circuit board 416 for sound energy to pass through; wherein the circuit board 416 has a sound hole 417 through which sound energy passes, and a back plate The back conductive layer 410 of the 408 is electrically connected to the electronic component 418, and the electronic component 418 is received in the gap 419 formed by the backplane 408 and the circuit board 416 in the housing 414. The backplane 408 is electrically connected to the backing layer 408 of the backplane 408, so that the electrical signal of the capacitor 413 is output to the outside through the backplane 408, the electronic component 418, and the circuit board 416.

The diaphragm 402 of the condenser microphone 400 that is packaged and made through the front cavity spacer 404, the cover 415, and the circuit board 416 are grounded through the front cavity spacer 404.

As can be seen from the above description, the present invention is a diaphragm module wafer 401 having a simple structure of a diaphragm 402, a diaphragm gasket 403 and a front cavity gasket 404 by a microelectromechanical process, and then is combined with the backing plate 408 to form the semi-finished product. 412. Finally, the semi-finished product 412 is mounted on the inner wall surface of the casing 415 with the front cavity gasket 404 and is fitted with the circuit board 416 to form a condenser microphone 400.

Compared with the second preferred embodiment, the diaphragm module wafer 401 which is different in microelectromechanical process is composed of the diaphragm 402, the diaphragm gasket 403, and the front cavity spacer 404, although The microelectromechanical process of the diaphragm module wafer 401 requires the fabrication of the front cavity spacer 404, but the structure is still simple, and the labor required for packaging can be reduced and the production cost can be reduced compared with the prior art.

Referring to Figure 18, a fourth preferred embodiment of the condenser microphone process of the present invention comprises three steps for fabricating a condenser microphone 500 similar to that shown in Figure 1.

Referring to FIG. 18 and FIG. 19, first, step 41 is performed to fabricate a diaphragm module wafer 501 having a diaphragm 502 and a front cavity spacer 503 by a microelectromechanical process; in detail, a substrate made of a conductive material. Forming an electrically conductive conductive layer 504 in a manner such as sputtering, evaporation, deposition or spinning, and a vibration layer 505 formed on the conductive layer 504 and deformed by the action of acoustic energy. After the conductive layer 504 and the vibration layer 505 form the diaphragm 502, the substrate is etched to form a predetermined pattern to form the front cavity spacer 503, and the diaphragm module wafer 501 is completed.

The diaphragm 502 is deformed by the external acoustic energy, and the front cavity gasket 503 restricts the diaphragm 502 into a tensioned tension state, and the conductive layer 505 is made of a conductive material and is available. Ground.

Referring to FIG. 18 and FIG. 20, proceeding to step 42, first, a prefabricated diaphragm gasket 506 is adhered to the diaphragm 502, and then a prefabricated and insulated circuit board gasket 507 is adhered to the diaphragm gasket. 506. Thereafter, a pre-fabricated back plate 508 having a plurality of air holes 509 and a back conductive layer 510 is connected to the diaphragm pad 506 corresponding to the central region of the diaphragm 502 such that the diaphragm 502 The diaphragm gasket 506 and the backing plate 508 form a back air chamber 511 communicating with the outside through the air holes 509 to obtain a semi-finished product 512. In this example, the back conductive layer 510 is made of a conductive material.

Referring to FIG. 18 and FIG. 21, finally, step 43 is performed to cooperate with the backing plate 508 to form a capacitor 513 for generating an electrical signal when external acoustic energy is applied, and the semi-finished product 512 is packaged in a casing 515. The condenser microphone 500 is formed in a housing 514 formed by a circuit board 516 for sound energy to pass through; wherein the circuit board 516 has a sound hole 517 through which sound energy passes, and a back plate The back conductive layer 510 of the 508 is electrically connected to the electronic component 518, and the electronic component 518 is received in the gap 519 formed by the backplane 508 and the circuit board 516 in the housing 514. The backplane 508 is electrically connected to the backing layer 508 of the backplane 508, so that the electrical signal of the capacitor 513 is output to the outside through the backplane 508, the electronic component 518, and the circuit board 516.

The diaphragm 502 of the condenser microphone 500 that is packaged and made through the front cavity spacer 503, the cover 515, and the circuit board 516 are grounded through the front cavity spacer 503.

Compared with the second preferred embodiment, the diaphragm module wafer 501 which is made by the micro-electromechanical process is composed of the diaphragm 502 and the front cavity spacer 503, and the structure design of the micro-electromechanical process is simple and uncomplicated. Then, the semi-finished product 512 is obtained by adhering the diaphragm gasket 506 and the backing plate 507, and then packaging the casing 515 and the circuit board 516, thereby reducing the labor required for packaging and reducing the production cost.

In summary, the method of manufacturing the condenser microphone of the present invention and the existing independent prefabricated components are sequentially stacked, and the manufacturing method of the semi-finished product after the microelectromechanical process is fabricated, and the microelectromechanical process is compared. The production of a diaphragm module wafer with a diaphragm and a simple structure not only effectively improves the sensitivity of the condenser microphone, but also greatly reduces the complexity and difficulty of the micro-electromechanical process, and greatly reduces the manufacturing cost, and is combined with a simple prefabricated component assembly. After the capacitor is fabricated, the condenser microphone can reduce the influence of temperature and humidity while maintaining the sensitivity of the sensor. At the same time, the number of components to be packaged is greatly reduced, which helps to reduce the packaging time and improve the process. The rate, and therefore more economical, can provide a more industrially competitive capacitive microphone process in the industry, so it can indeed achieve the purpose of the present invention.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

1. . . Condenser microphone

11. . . Shell

111. . . Cover

112. . . Circuit board

12. . . Semi finished product

121. . . Board gasket

122. . . Diaphragm back plate

123. . . Diaphragm gasket

124. . . Diaphragm

125. . . Back air chamber

126. . . Grounding gasket

127. . . Stomata

128. . . Vibration layer

129. . . Ground plane

13. . . gap

14. . . Electronic component

twenty one. . . step

twenty two. . . step

twenty three. . . step

200. . . Condenser microphone

201. . . Diaphragm module wafer

202. . . Diaphragm

203. . . Diaphragm gasket

204. . . Vibration layer

205. . . Conductive layer

206. . . Backplane

206’. . . Backplane

207. . . Stomata

208. . . Back conductive layer

209. . . Back air chamber

210. . . Front cavity gasket

211. . . Semi finished product

212. . . capacitance

213. . . Shell

214. . . Cover

214’. . . Cover

215. . . Circuit board

216. . . Sound hole

217. . . Electronic component

218. . . gap

220. . . Conductive ring

221. . . Sound hole

222. . . Electret layer

300. . . Condenser microphone

301. . . Diaphragm module wafer

302. . . Diaphragm

303. . . Diaphragm gasket

304. . . Vibration layer

305. . . Conductive layer

306. . . Board gasket

307. . . Backplane

308. . . Stomata

309. . . Back conductive layer

310. . . Back air chamber

311. . . Front cavity gasket

312. . . Semi finished product

313. . . capacitance

314. . . Shell

315. . . Cover

316. . . Circuit board

317. . . Sound hole

318. . . Electronic component

319. . . gap

31. . . step

32. . . step

33. . . step

400. . . Condenser microphone

401. . . Diaphragm module wafer

402. . . Diaphragm

403. . . Diaphragm gasket

404. . . Front cavity gasket

405. . . Vibration layer

406. . . Conductive layer

407. . . Board gasket

408. . . Backplane

409. . . Stomata

410. . . Back conductive layer

411. . . Back air chamber

412. . . Semi finished product

413. . . capacitance

414. . . Shell

415. . . Cover

416. . . Circuit board

417. . . Sound hole

418. . . Electronic component

419. . . gap

41. . . step

42. . . step

43. . . step

500. . . Condenser microphone

501. . . Diaphragm module wafer

502. . . Diaphragm

503. . . Front cavity gasket

504. . . Conductive layer

505. . . Vibration layer

506. . . Diaphragm gasket

507. . . Board gasket

508. . . Backplane

509. . . Stomata

510. . . Back conductive layer

511. . . Back air chamber

512. . . Semi finished product

513. . . capacitance

514. . . Shell

515. . . Cover

516. . . Circuit board

517. . . Sound hole

518. . . Electronic component

519. . . gap

1 is a schematic cross-sectional view showing a condenser microphone to be fabricated by the condenser microphone process of the present invention;

2 is a flow chart illustrating a method of fabricating a conventional condenser microphone;

3 is a flow chart showing a method of fabricating another conventional condenser microphone;

4 is a flow chart showing a first preferred embodiment of the process of the condenser microphone of the present invention;

Figure 5 is a cross-sectional view of the first preferred embodiment of Figure 4;

Figure 6 is a cross-sectional view of the first preferred embodiment of Figure 4;

Figure 7 is a cross-sectional view of the first preferred embodiment of Figure 4;

Figure 8 is a cross-sectional view of the first preferred embodiment of Figure 4;

Figure 9 is a cross-sectional view of the first preferred embodiment of Figure 4;

Figure 10 is a cross-sectional view of the first preferred embodiment of Figure 4;

Figure 11 is a cross-sectional view, to assist in a second preferred embodiment of Figure 4;

Figure 12 is a cross-sectional view of the second preferred embodiment of Figure 4;

Figure 13 is a cross-sectional view of the second preferred embodiment of Figure 4;

Figure 14 is a flow chart showing a third preferred embodiment of the process of the condenser microphone of the present invention;

Figure 15 is a cross-sectional view of the third preferred embodiment of Figure 14;

Figure 16 is a schematic cross-sectional view of the third preferred embodiment of Figure 14;

Figure 17 is a cross-sectional view of the third preferred embodiment of Figure 14;

Figure 18 is a flow chart showing a fourth preferred embodiment of the process of the condenser microphone of the present invention;

Figure 19 is a cross-sectional view of the fourth preferred embodiment of Figure 18;

Figure 20 is a cross-sectional view showing the fourth preferred embodiment of Figure 18; and

Figure 21 is a cross-sectional view showing the fourth preferred embodiment of Figure 18.

twenty one. . . Steps A micro-electromechanical process is used to fabricate a diaphragm module wafer having a diaphragm that is deformed by the action of acoustic energy and a diaphragm gasket that restricts the tension of the diaphragm into a tension.

twenty two. . . Step: The adhesive diaphragm module wafer and the back plate having a plurality of air holes are used to prepare a semi-finished product, and the diaphragm module wafer and the back plate form a back air chamber that communicates with the outside through the air holes.

twenty three. . . Steps Make the diaphragm and the back plate cooperate to form a capacitor, and package the semi-finished product in the housing to make a condenser microphone.

Claims (10)

A condenser microphone process comprising: (A) fabricating a diaphragm module wafer by a microelectromechanical process, wherein the diaphragm module wafer has a diaphragm that is deformed by the action of acoustic energy, and a diaphragm a diaphragm gasket extending downwardly from the bottom surface and restricting the diaphragm into a tensioned tension; (B) a prefabricated backing plate having a plurality of pores, the pores being connected to the central region of the diaphragm To the diaphragm gasket, the diaphragm, the diaphragm gasket and the back plate form a back air chamber communicating with the outside through the air holes to obtain a half finished product; and (C) the diaphragm and the back plate The condenser microphone is fabricated by fitting a capacitor and encapsulating the semi-finished product in a housing formed by a casing and a circuit board for sound energy to pass through. According to the capacitive microphone process of claim 1, wherein the diaphragm of the diaphragm module wafer produced in the step (A) comprises a vibration layer, and a conductive layer formed on the vibration layer, and The step (B) also bonds a prefabricated and electrically conductive front cavity gasket to the top surface of the diaphragm of the diaphragm module wafer, so that the diaphragm of the condenser microphone obtained by the package is transmitted through the conductive layer. The front cavity gasket, the casing, and the circuit board are grounded. According to the capacitive microphone process of claim 1, wherein the step (B) is to adhesively adhere the back plate to the bottom surface of the diaphragm gasket, and the circuit used in the step (C) The board has a sound hole through which the sound energy passes, and an electronic component electrically connected to the back board, so that the condenser microphone obtained by the package senses acoustic energy through the sound hole and passes the electric signal formed by the capacitor The backplane, electronic components, and circuit boards are output to the outside world. According to the capacitive microphone process of claim 1, wherein the step (B) further adheres an insulating circuit board spacer to the diaphragm gasket, so that when the semi-finished product is packaged in the housing In the middle, the backplane, the circuit board spacer and the circuit board form a gap for the electronic component to be accommodated. A condenser microphone process comprising: (A) fabricating a diaphragm module wafer by a microelectromechanical process, wherein the diaphragm module wafer has a diaphragm that is deformed by the action of acoustic energy, and a diaphragm from the bottom of the diaphragm a diaphragm gasket extending downwardly and limiting the tension of the diaphragm into a tensioned state, and a front cavity gasket formed from a top surface of the diaphragm with a conductive material; (B) a prefabricated and majority a back plate of the air hole, wherein the air holes are connected to the diaphragm gasket corresponding to the central region of the diaphragm, so that the diaphragm, the diaphragm gasket and the back plate form a back air chamber that communicates with the outside through the air holes And (C) forming the capacitor to cooperate with the back sheet to form a capacitor, and packaging the semi-finished product in a housing formed by a casing and a circuit board for sound energy to pass through The condenser microphone is available. According to the capacitive microphone process of claim 5, wherein the step (B) is to adhesively adhere the back plate to the bottom surface of the diaphragm gasket, and the circuit used in the step (C) The board has a sound hole through which the sound energy passes, and an electronic component electrically connected to the back board, so that the condenser microphone obtained by the package senses acoustic energy through the sound hole and passes the electric signal formed by the capacitor The backplane, electronic components, and circuit boards are output to the outside world. According to the capacitive microphone process of claim 5, wherein the step (B) further adheres an insulating circuit board spacer to the diaphragm gasket, so that when the semi-finished product is packaged in the housing In the middle, the backplane, the circuit board spacer and the circuit board form a gap for the electronic component to be accommodated. A condenser microphone process comprising: (A) fabricating a diaphragm module wafer by a microelectromechanical process, wherein the diaphragm module wafer has a diaphragm that is deformed by the action of acoustic energy, and a diaphragm a front cavity gasket extending upwardly and limiting the tension of the diaphragm into a tensioned state; (B) adhering a prefabricated diaphragm gasket to the bottom surface of the diaphragm of the diaphragm module wafer, and a prefabricated back plate having a plurality of pores, wherein the pores are connected to the diaphragm gasket corresponding to a central region of the diaphragm, so that the diaphragm, the diaphragm gasket and the back plate form a hole and the outside a connected plenum to produce half of the finished product; and (C) constituting the diaphragm with the backing plate to form a capacitor, and packaging the semi-finished product in a casing and a circuit board for sound energy to pass through The condenser microphone is fabricated in the housing. According to the capacitive microphone process of claim 8, wherein the step (B) is to adhesively adhere the back plate to the bottom surface of the diaphragm gasket, and the circuit used in the step (C) The board has a sound hole through which the sound energy passes, and an electronic component electrically connected to the back board, so that the condenser microphone obtained by the package senses acoustic energy through the sound hole and passes the electric signal formed by the capacitor The backplane, electronic components, and circuit boards are output to the outside world. According to the capacitive microphone process of claim 8, wherein the step (B) further adheres an insulating circuit board spacer to the diaphragm gasket, so that when the semi-finished product is packaged in the housing In the middle, the backplane, the circuit board spacer and the circuit board form a gap for the electronic component to be accommodated.