TW200729994A - Microphone structure - Google Patents

Microphone structure

Info

Publication number
TW200729994A
TW200729994A TW095102904A TW95102904A TW200729994A TW 200729994 A TW200729994 A TW 200729994A TW 095102904 A TW095102904 A TW 095102904A TW 95102904 A TW95102904 A TW 95102904A TW 200729994 A TW200729994 A TW 200729994A
Authority
TW
Taiwan
Prior art keywords
metal pad
circuit element
microphone
microphone chip
microphone structure
Prior art date
Application number
TW095102904A
Other languages
Chinese (zh)
Other versions
TWI291838B (en
Inventor
Lu-Po Liao
Yu-Chun Hsu
Hung-Hsin Tsai
Bor-Chen Tsai
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW95102904A priority Critical patent/TWI291838B/en
Publication of TW200729994A publication Critical patent/TW200729994A/en
Application granted granted Critical
Publication of TWI291838B publication Critical patent/TWI291838B/en

Links

Landscapes

  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

A microphone structure is provided. The structure includes a microphone chip, at least a first metal pad on one surface of the microphone chip, a circuit element, and at least a second metal pad on one surface of the circuit element. The surface with the first metal pad of the microphone chip and the surface with the second metal pad of the circuit element face to each other, and connect to each other by the first metal pad and the second metal pad. Because the microphone chip connects to the circuit element without conducting wires, the parasitic capacitance effect caused by the conducting wires is reduced. The efficiency of the microphone structure is improved.
TW95102904A 2006-01-25 2006-01-25 Microphone structure TWI291838B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95102904A TWI291838B (en) 2006-01-25 2006-01-25 Microphone structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95102904A TWI291838B (en) 2006-01-25 2006-01-25 Microphone structure

Publications (2)

Publication Number Publication Date
TW200729994A true TW200729994A (en) 2007-08-01
TWI291838B TWI291838B (en) 2007-12-21

Family

ID=39461295

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95102904A TWI291838B (en) 2006-01-25 2006-01-25 Microphone structure

Country Status (1)

Country Link
TW (1) TWI291838B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI486069B (en) * 2010-05-18 2015-05-21 Taiwan Carol Electronics Co Ltd Capacitive microphone process
TWI504279B (en) * 2011-12-01 2015-10-11 Ind Tech Res Inst Mems acoustic transducer and method for manufacturing the same
WO2022076770A1 (en) * 2020-10-09 2022-04-14 The Johns Hopkins University Impedance-matched acoustic transducer

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI401774B (en) * 2010-01-18 2013-07-11 Chipmos Technologies Inc Mems chip package and method for making the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI486069B (en) * 2010-05-18 2015-05-21 Taiwan Carol Electronics Co Ltd Capacitive microphone process
TWI504279B (en) * 2011-12-01 2015-10-11 Ind Tech Res Inst Mems acoustic transducer and method for manufacturing the same
US9236275B2 (en) 2011-12-01 2016-01-12 Industrial Technology Research Institute MEMS acoustic transducer and method for fabricating the same
WO2022076770A1 (en) * 2020-10-09 2022-04-14 The Johns Hopkins University Impedance-matched acoustic transducer

Also Published As

Publication number Publication date
TWI291838B (en) 2007-12-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees