US4884122A
(en)
*
|
1988-08-05 |
1989-11-28 |
General Electric Company |
Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer
|
US4937203A
(en)
*
|
1986-09-26 |
1990-06-26 |
General Electric Company |
Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer
|
US4890156A
(en)
*
|
1987-03-13 |
1989-12-26 |
Motorola Inc. |
Multichip IC module having coplanar dice and substrate
|
US5191224A
(en)
*
|
1987-04-22 |
1993-03-02 |
Hitachi, Ltd. |
Wafer scale of full wafer memory system, packaging method thereof, and wafer processing method employed therein
|
JP2544396B2
(ja)
*
|
1987-08-25 |
1996-10-16 |
株式会社日立製作所 |
半導体集積回路装置の製造方法
|
JP2610487B2
(ja)
*
|
1988-06-10 |
1997-05-14 |
株式会社日立製作所 |
セラミック積層回路基板
|
US5019946A
(en)
*
|
1988-09-27 |
1991-05-28 |
General Electric Company |
High density interconnect with high volumetric efficiency
|
US5107586A
(en)
*
|
1988-09-27 |
1992-04-28 |
General Electric Company |
Method for interconnecting a stack of integrated circuits at a very high density
|
US4878991A
(en)
*
|
1988-12-12 |
1989-11-07 |
General Electric Company |
Simplified method for repair of high density interconnect circuits
|
US4988412A
(en)
*
|
1988-12-27 |
1991-01-29 |
General Electric Company |
Selective electrolytic desposition on conductive and non-conductive substrates
|
US5192716A
(en)
*
|
1989-01-25 |
1993-03-09 |
Polylithics, Inc. |
Method of making a extended integration semiconductor structure
|
AU5094890A
(en)
*
|
1989-01-25 |
1990-09-05 |
Polylithics, Inc. |
Extended integration semiconductor structure and method of making the same
|
US5055907A
(en)
*
|
1989-01-25 |
1991-10-08 |
Mosaic, Inc. |
Extended integration semiconductor structure with wiring layers
|
JPH0362547A
(ja)
*
|
1989-02-03 |
1991-03-18 |
General Electric Co <Ge> |
集積回路試験構造物及び試験方法
|
US5225023A
(en)
*
|
1989-02-21 |
1993-07-06 |
General Electric Company |
High density interconnect thermoplastic die attach material and solvent die attach processing
|
US4933743A
(en)
*
|
1989-03-11 |
1990-06-12 |
Fairchild Semiconductor Corporation |
High performance interconnect system for an integrated circuit
|
US5151776A
(en)
*
|
1989-03-28 |
1992-09-29 |
General Electric Company |
Die attachment method for use in high density interconnected assemblies
|
US5019535A
(en)
*
|
1989-03-28 |
1991-05-28 |
General Electric Company |
Die attachment method using nonconductive adhesive for use in high density interconnected assemblies
|
US5144407A
(en)
*
|
1989-07-03 |
1992-09-01 |
General Electric Company |
Semiconductor chip protection layer and protected chip
|
US5209390A
(en)
*
|
1989-07-03 |
1993-05-11 |
General Electric Company |
Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
|
US5258647A
(en)
*
|
1989-07-03 |
1993-11-02 |
General Electric Company |
Electronic systems disposed in a high force environment
|
US5150196A
(en)
*
|
1989-07-17 |
1992-09-22 |
Hughes Aircraft Company |
Hermetic sealing of wafer scale integrated wafer
|
US5032896A
(en)
*
|
1989-08-31 |
1991-07-16 |
Hughes Aircraft Company |
3-D integrated circuit assembly employing discrete chips
|
DE3931238A1
(de)
*
|
1989-09-19 |
1991-03-28 |
Siemens Ag |
Vielfach-chip-modul und verfahren zu dessen herstellung
|
US5108825A
(en)
*
|
1989-12-21 |
1992-04-28 |
General Electric Company |
Epoxy/polyimide copolymer blend dielectric and layered circuits incorporating it
|
US5206712A
(en)
*
|
1990-04-05 |
1993-04-27 |
General Electric Company |
Building block approach to microwave modules
|
US5157255A
(en)
*
|
1990-04-05 |
1992-10-20 |
General Electric Company |
Compact, thermally efficient focal plane array and testing and repair thereof
|
JP3280394B2
(ja)
*
|
1990-04-05 |
2002-05-13 |
ロックヒード マーティン コーポレーション |
電子装置
|
US5200810A
(en)
*
|
1990-04-05 |
1993-04-06 |
General Electric Company |
High density interconnect structure with top mounted components
|
US5146303A
(en)
*
|
1990-04-05 |
1992-09-08 |
General Electric Company |
Compact, thermally efficient focal plane array and testing and repair thereof
|
US5410179A
(en)
*
|
1990-04-05 |
1995-04-25 |
Martin Marietta Corporation |
Microwave component having tailored operating characteristics and method of tailoring
|
DE4115043A1
(de)
*
|
1991-05-08 |
1997-07-17 |
Gen Electric |
Dichtgepackte Verbindungsstruktur, die eine Kammer enthält
|
US5351001A
(en)
*
|
1990-04-05 |
1994-09-27 |
General Electric Company |
Microwave component test method and apparatus
|
US5161093A
(en)
*
|
1990-07-02 |
1992-11-03 |
General Electric Company |
Multiple lamination high density interconnect process and structure employing a variable crosslinking adhesive
|
US5049978A
(en)
*
|
1990-09-10 |
1991-09-17 |
General Electric Company |
Conductively enclosed hybrid integrated circuit assembly using a silicon substrate
|
US5679977A
(en)
*
|
1990-09-24 |
1997-10-21 |
Tessera, Inc. |
Semiconductor chip assemblies, methods of making same and components for same
|
US7198969B1
(en)
|
1990-09-24 |
2007-04-03 |
Tessera, Inc. |
Semiconductor chip assemblies, methods of making same and components for same
|
US5148265A
(en)
|
1990-09-24 |
1992-09-15 |
Ist Associates, Inc. |
Semiconductor chip assemblies with fan-in leads
|
US5386623A
(en)
*
|
1990-11-15 |
1995-02-07 |
Hitachi, Ltd. |
Process for manufacturing a multi-chip module
|
US5138436A
(en)
*
|
1990-11-16 |
1992-08-11 |
Ball Corporation |
Interconnect package having means for waveguide transmission of rf signals
|
JP2960560B2
(ja)
*
|
1991-02-28 |
1999-10-06 |
株式会社日立製作所 |
超小型電子機器
|
DE4108154A1
(de)
*
|
1991-03-14 |
1992-09-17 |
Telefunken Electronic Gmbh |
Elektronische baugruppe und verfahren zur herstellung von elektronischen baugruppen
|
FR2674682A1
(fr)
*
|
1991-03-26 |
1992-10-02 |
Thomson Csf |
Module hybride et procede de realisation.
|
US5144747A
(en)
*
|
1991-03-27 |
1992-09-08 |
Integrated System Assemblies Corporation |
Apparatus and method for positioning an integrated circuit chip within a multichip module
|
US5250843A
(en)
*
|
1991-03-27 |
1993-10-05 |
Integrated System Assemblies Corp. |
Multichip integrated circuit modules
|
US5111278A
(en)
*
|
1991-03-27 |
1992-05-05 |
Eichelberger Charles W |
Three-dimensional multichip module systems
|
US5091769A
(en)
*
|
1991-03-27 |
1992-02-25 |
Eichelberger Charles W |
Configuration for testing and burn-in of integrated circuit chips
|
US5166605A
(en)
*
|
1991-08-02 |
1992-11-24 |
General Electric Company |
Controlled impedance test fixture for planar electronic device
|
US5239448A
(en)
*
|
1991-10-28 |
1993-08-24 |
International Business Machines Corporation |
Formulation of multichip modules
|
DE4135654A1
(de)
*
|
1991-10-29 |
2003-03-27 |
Lockheed Corp |
Dichtgepackte Verbindungsstruktur, die eine Abstandshalterstruktur und einen Zwischenraum enthält
|
KR940005712B1
(ko)
*
|
1991-11-14 |
1994-06-23 |
금성일랙트론 주식회사 |
잭 타입 아이씨 패키지(jack-type ic package)
|
US5291066A
(en)
*
|
1991-11-14 |
1994-03-01 |
General Electric Company |
Moisture-proof electrical circuit high density interconnect module and method for making same
|
US5257178A
(en)
*
|
1991-12-19 |
1993-10-26 |
General Electric Company |
Method of optimally operating a computer numerical control milling machine to mill optimal high density interconnect substrates
|
US5208729A
(en)
*
|
1992-02-14 |
1993-05-04 |
International Business Machines Corporation |
Multi-chip module
|
US5455459A
(en)
*
|
1992-03-27 |
1995-10-03 |
Martin Marietta Corporation |
Reconstructable interconnect structure for electronic circuits
|
JP2801810B2
(ja)
*
|
1992-04-14 |
1998-09-21 |
株式会社東芝 |
樹脂封止型半導体装置
|
US5255431A
(en)
*
|
1992-06-26 |
1993-10-26 |
General Electric Company |
Method of using frozen epoxy for placing pin-mounted components in a circuit module
|
DE69327666D1
(de)
*
|
1992-07-17 |
2000-02-24 |
Vlt Corp |
Verpackung für elektronische Komponenten
|
US5336928A
(en)
*
|
1992-09-18 |
1994-08-09 |
General Electric Company |
Hermetically sealed packaged electronic system
|
US5544038A
(en)
*
|
1992-09-21 |
1996-08-06 |
General Electric Company |
Synchronous rectifier package for high-efficiency operation
|
US5279706A
(en)
*
|
1992-10-13 |
1994-01-18 |
General Electric Company |
Method and apparatus for fabricating a metal interconnection pattern for an integrated circuit module
|
US5285571A
(en)
*
|
1992-10-13 |
1994-02-15 |
General Electric Company |
Method for extending an electrical conductor over an edge of an HDI substrate
|
US5366906A
(en)
*
|
1992-10-16 |
1994-11-22 |
Martin Marietta Corporation |
Wafer level integration and testing
|
US5422513A
(en)
*
|
1992-10-16 |
1995-06-06 |
Martin Marietta Corporation |
Integrated circuit chip placement in a high density interconnect structure
|
US5324687A
(en)
*
|
1992-10-16 |
1994-06-28 |
General Electric Company |
Method for thinning of integrated circuit chips for lightweight packaged electronic systems
|
US6274391B1
(en)
*
|
1992-10-26 |
2001-08-14 |
Texas Instruments Incorporated |
HDI land grid array packaged device having electrical and optical interconnects
|
JPH06151685A
(ja)
*
|
1992-11-04 |
1994-05-31 |
Mitsubishi Electric Corp |
Mcp半導体装置
|
US5300812A
(en)
*
|
1992-12-09 |
1994-04-05 |
General Electric Company |
Plasticized polyetherimide adhesive composition and usage
|
US5374792A
(en)
*
|
1993-01-04 |
1994-12-20 |
General Electric Company |
Micromechanical moving structures including multiple contact switching system
|
US5384691A
(en)
*
|
1993-01-08 |
1995-01-24 |
General Electric Company |
High density interconnect multi-chip modules including embedded distributed power supply elements
|
US5352629A
(en)
*
|
1993-01-19 |
1994-10-04 |
General Electric Company |
Process for self-alignment and planarization of semiconductor chips attached by solder die adhesive to multi-chip modules
|
US5463201A
(en)
*
|
1993-02-04 |
1995-10-31 |
Generla Electric Company |
Seam-tracking apparatus for a welding system employing an array of eddy current elements
|
US5353498A
(en)
*
|
1993-02-08 |
1994-10-11 |
General Electric Company |
Method for fabricating an integrated circuit module
|
US5302547A
(en)
*
|
1993-02-08 |
1994-04-12 |
General Electric Company |
Systems for patterning dielectrics by laser ablation
|
US5418457A
(en)
*
|
1993-03-12 |
1995-05-23 |
General Electric Company |
System and method for aligning an inspection probe and maintaining uniform spacing between the probe surface and an inspection surface
|
US5401687A
(en)
*
|
1993-04-15 |
1995-03-28 |
Martin Marietta Corporation |
Process for high density interconnection of substrates and integrated circuit chips containing sensitive structures
|
US5381445A
(en)
*
|
1993-05-03 |
1995-01-10 |
General Electric Company |
Munitions cartridge transmitter
|
US5717332A
(en)
*
|
1993-05-03 |
1998-02-10 |
General Electric Company |
System and method using eddy currents to acquire positional data relating to fibers in a composite
|
US5353195A
(en)
*
|
1993-07-09 |
1994-10-04 |
General Electric Company |
Integral power and ground structure for multi-chip modules
|
US5594273A
(en)
*
|
1993-07-23 |
1997-01-14 |
Motorola Inc. |
Apparatus for performing wafer-level testing of integrated circuits where test pads lie within integrated circuit die but overly no active circuitry for improved yield
|
US5654588A
(en)
*
|
1993-07-23 |
1997-08-05 |
Motorola Inc. |
Apparatus for performing wafer-level testing of integrated circuits where the wafer uses a segmented conductive top-layer bus structure
|
US5399505A
(en)
*
|
1993-07-23 |
1995-03-21 |
Motorola, Inc. |
Method and apparatus for performing wafer level testing of integrated circuit dice
|
US5508558A
(en)
*
|
1993-10-28 |
1996-04-16 |
Digital Equipment Corporation |
High density, high speed, semiconductor interconnect using-multilayer flexible substrate with unsupported central portion
|
US5492586A
(en)
*
|
1993-10-29 |
1996-02-20 |
Martin Marietta Corporation |
Method for fabricating encased molded multi-chip module substrate
|
US5432675A
(en)
*
|
1993-11-15 |
1995-07-11 |
Fujitsu Limited |
Multi-chip module having thermal contacts
|
KR0154994B1
(ko)
*
|
1993-11-22 |
1998-12-01 |
세끼자와 다다시 |
반도체장치 및 그 제조방법
|
US5373627A
(en)
*
|
1993-11-23 |
1994-12-20 |
Grebe; Kurt R. |
Method of forming multi-chip module with high density interconnections
|
US5637922A
(en)
*
|
1994-02-07 |
1997-06-10 |
General Electric Company |
Wireless radio frequency power semiconductor devices using high density interconnect
|
US5434751A
(en)
*
|
1994-04-11 |
1995-07-18 |
Martin Marietta Corporation |
Reworkable high density interconnect structure incorporating a release layer
|
US5449427A
(en)
*
|
1994-05-23 |
1995-09-12 |
General Electric Company |
Processing low dielectric constant materials for high speed electronics
|
EP0688047A1
(de)
|
1994-06-13 |
1995-12-20 |
Mitsubishi Materials Corporation |
Aluminiumnitridsubstrat und Herstellungsverfahren dafür
|
US5594629A
(en)
*
|
1994-06-20 |
1997-01-14 |
General Electric Company |
High-frequency switching circuits operable in a natural zero-voltage switching mode
|
US6486528B1
(en)
|
1994-06-23 |
2002-11-26 |
Vertical Circuits, Inc. |
Silicon segment programming apparatus and three terminal fuse configuration
|
US5698895A
(en)
*
|
1994-06-23 |
1997-12-16 |
Cubic Memory, Inc. |
Silicon segment programming method and apparatus
|
US6255726B1
(en)
|
1994-06-23 |
2001-07-03 |
Cubic Memory, Inc. |
Vertical interconnect process for silicon segments with dielectric isolation
|
US5675180A
(en)
|
1994-06-23 |
1997-10-07 |
Cubic Memory, Inc. |
Vertical interconnect process for silicon segments
|
US6124633A
(en)
*
|
1994-06-23 |
2000-09-26 |
Cubic Memory |
Vertical interconnect process for silicon segments with thermally conductive epoxy preform
|
US5891761A
(en)
*
|
1994-06-23 |
1999-04-06 |
Cubic Memory, Inc. |
Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform
|
US6080596A
(en)
*
|
1994-06-23 |
2000-06-27 |
Cubic Memory Inc. |
Method for forming vertical interconnect process for silicon segments with dielectric isolation
|
US5657206A
(en)
*
|
1994-06-23 |
1997-08-12 |
Cubic Memory, Inc. |
Conductive epoxy flip-chip package and method
|
US5798286A
(en)
|
1995-09-22 |
1998-08-25 |
Tessera, Inc. |
Connecting multiple microelectronic elements with lead deformation
|
US5546654A
(en)
*
|
1994-08-29 |
1996-08-20 |
General Electric Company |
Vacuum fixture and method for fabricating electronic assemblies
|
US6577148B1
(en)
|
1994-08-31 |
2003-06-10 |
Motorola, Inc. |
Apparatus, method, and wafer used for testing integrated circuits formed on a product wafer
|
US5548099A
(en)
*
|
1994-09-13 |
1996-08-20 |
Martin Marietta Corporation |
Method for making an electronics module having air bridge protection without large area ablation
|
US5524339A
(en)
*
|
1994-09-19 |
1996-06-11 |
Martin Marietta Corporation |
Method for protecting gallium arsenide mmic air bridge structures
|
US6320257B1
(en)
*
|
1994-09-27 |
2001-11-20 |
Foster-Miller, Inc. |
Chip packaging technique
|
US5527741A
(en)
*
|
1994-10-11 |
1996-06-18 |
Martin Marietta Corporation |
Fabrication and structures of circuit modules with flexible interconnect layers
|
US5876859A
(en)
*
|
1994-11-10 |
1999-03-02 |
Vlt Corporation |
Direct metal bonding
|
US5906310A
(en)
*
|
1994-11-10 |
1999-05-25 |
Vlt Corporation |
Packaging electrical circuits
|
US5644103A
(en)
*
|
1994-11-10 |
1997-07-01 |
Vlt Corporation |
Packaging electrical components having a scallop formed in an edge of a circuit board
|
US5945130A
(en)
|
1994-11-15 |
1999-08-31 |
Vlt Corporation |
Apparatus for circuit encapsulation
|
US5728600A
(en)
*
|
1994-11-15 |
1998-03-17 |
Vlt Corporation |
Circuit encapsulation process
|
US5683928A
(en)
*
|
1994-12-05 |
1997-11-04 |
General Electric Company |
Method for fabricating a thin film resistor
|
US5675310A
(en)
*
|
1994-12-05 |
1997-10-07 |
General Electric Company |
Thin film resistors on organic surfaces
|
US5561085A
(en)
*
|
1994-12-19 |
1996-10-01 |
Martin Marietta Corporation |
Structure for protecting air bridges on semiconductor chips from damage
|
JP2732823B2
(ja)
*
|
1995-02-02 |
1998-03-30 |
ヴィエルティー コーポレーション |
はんだ付け方法
|
JPH08288424A
(ja)
*
|
1995-04-18 |
1996-11-01 |
Nec Corp |
半導体装置
|
US5844810A
(en)
*
|
1995-05-30 |
1998-12-01 |
General Electric Company |
Scaled adaptive lithography
|
US5657537A
(en)
*
|
1995-05-30 |
1997-08-19 |
General Electric Company |
Method for fabricating a stack of two dimensional circuit modules
|
US5552633A
(en)
*
|
1995-06-06 |
1996-09-03 |
Martin Marietta Corporation |
Three-dimensional multimodule HDI arrays with heat spreading
|
US5559363A
(en)
*
|
1995-06-06 |
1996-09-24 |
Martin Marietta Corporation |
Off-chip impedance matching utilizing a dielectric element and high density interconnect technology
|
WO1997001437A1
(en)
*
|
1995-06-28 |
1997-01-16 |
Fraivillig Materials Company |
Circuit board laminates and method of making
|
US5770884A
(en)
*
|
1995-06-30 |
1998-06-23 |
International Business Machines Corporation |
Very dense integrated circuit package
|
US5745984A
(en)
*
|
1995-07-10 |
1998-05-05 |
Martin Marietta Corporation |
Method for making an electronic module
|
US6031726A
(en)
*
|
1995-11-06 |
2000-02-29 |
Vlt Corporation |
Low profile mounting of power converters with the converter body in an aperture
|
US5866952A
(en)
|
1995-11-30 |
1999-02-02 |
Lockheed Martin Corporation |
High density interconnected circuit module with a compliant layer as part of a stress-reducing molded substrate
|
US5672546A
(en)
*
|
1995-12-04 |
1997-09-30 |
General Electric Company |
Semiconductor interconnect method and structure for high temperature applications
|
US5736448A
(en)
|
1995-12-04 |
1998-04-07 |
General Electric Company |
Fabrication method for thin film capacitors
|
US5567657A
(en)
*
|
1995-12-04 |
1996-10-22 |
General Electric Company |
Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers
|
US6137125A
(en)
*
|
1995-12-21 |
2000-10-24 |
The Whitaker Corporation |
Two layer hermetic-like coating for on-wafer encapsulatuon of GaAs MMIC's having flip-chip bonding capabilities
|
US5914508A
(en)
*
|
1995-12-21 |
1999-06-22 |
The Whitaker Corporation |
Two layer hermetic-like coating process for on-wafer encapsulation of GaAs MMIC's
|
US5888837A
(en)
*
|
1996-04-16 |
1999-03-30 |
General Electric Company |
Chip burn-in and test structure and method
|
US5972145A
(en)
*
|
1996-06-07 |
1999-10-26 |
International Business Machines Corporation |
Removable passivating polyimide coating and methods of use
|
US5731223A
(en)
*
|
1996-09-24 |
1998-03-24 |
Lsi Logic Corporation |
Array of solder pads on an integrated circuit
|
US5874770A
(en)
*
|
1996-10-10 |
1999-02-23 |
General Electric Company |
Flexible interconnect film including resistor and capacitor layers
|
US6093971A
(en)
*
|
1996-10-14 |
2000-07-25 |
Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. |
Chip module with conductor paths on the chip bonding side of a chip carrier
|
US5766979A
(en)
|
1996-11-08 |
1998-06-16 |
W. L. Gore & Associates, Inc. |
Wafer level contact sheet and method of assembly
|
US5857858A
(en)
*
|
1996-12-23 |
1999-01-12 |
General Electric Company |
Demountable and repairable low pitch interconnect for stacked multichip modules
|
US5904496A
(en)
|
1997-01-24 |
1999-05-18 |
Chipscale, Inc. |
Wafer fabrication of inside-wrapped contacts for electronic devices
|
JPH10223624A
(ja)
*
|
1997-02-06 |
1998-08-21 |
Nec Yamagata Ltd |
半導体装置の製造方法
|
US6229203B1
(en)
|
1997-03-12 |
2001-05-08 |
General Electric Company |
Semiconductor interconnect structure for high temperature applications
|
US5814885A
(en)
*
|
1997-04-28 |
1998-09-29 |
International Business Machines Corporation |
Very dense integrated circuit package
|
US6040226A
(en)
*
|
1997-05-27 |
2000-03-21 |
General Electric Company |
Method for fabricating a thin film inductor
|
US6150719A
(en)
*
|
1997-07-28 |
2000-11-21 |
General Electric Company |
Amorphous hydrogenated carbon hermetic structure and fabrication method
|
US5886401A
(en)
*
|
1997-09-02 |
1999-03-23 |
General Electric Company |
Structure and fabrication method for interconnecting light emitting diodes with metallization extending through vias in a polymer film overlying the light emitting diodes
|
US5888884A
(en)
*
|
1998-01-02 |
1999-03-30 |
General Electric Company |
Electronic device pad relocation, precision placement, and packaging in arrays
|
US5998868A
(en)
*
|
1998-02-04 |
1999-12-07 |
International Business Machines Corporation |
Very dense chip package
|
US6087199A
(en)
*
|
1998-02-04 |
2000-07-11 |
International Business Machines Corporation |
Method for fabricating a very dense chip package
|
GB2334143A
(en)
*
|
1998-02-07 |
1999-08-11 |
Motorola Inc |
An electronic device package
|
US5959357A
(en)
*
|
1998-02-17 |
1999-09-28 |
General Electric Company |
Fet array for operation at different power levels
|
US6107179A
(en)
*
|
1998-05-28 |
2000-08-22 |
Xerox Corporation |
Integrated flexible interconnection
|
JP2000012607A
(ja)
*
|
1998-05-28 |
2000-01-14 |
Xerox Corp |
集積回路装置、及びフリップチップボンディングされたコンビネ―ションを作成する方法
|
US6025638A
(en)
*
|
1998-06-01 |
2000-02-15 |
International Business Machines Corporation |
Structure for precision multichip assembly
|
JP3907845B2
(ja)
*
|
1998-08-18 |
2007-04-18 |
沖電気工業株式会社 |
半導体装置
|
US6239980B1
(en)
|
1998-08-31 |
2001-05-29 |
General Electric Company |
Multimodule interconnect structure and process
|
US6251219B1
(en)
|
1998-09-17 |
2001-06-26 |
Intermedics Inc. |
Method and apparatus for use in assembling electronic devices
|
US6505665B1
(en)
|
1998-09-17 |
2003-01-14 |
Intermedics, Inc. |
Method and apparatus for use in assembling electronic devices
|
US6066513A
(en)
*
|
1998-10-02 |
2000-05-23 |
International Business Machines Corporation |
Process for precise multichip integration and product thereof
|
US6188301B1
(en)
|
1998-11-13 |
2001-02-13 |
General Electric Company |
Switching structure and method of fabrication
|
US6234842B1
(en)
|
1998-11-20 |
2001-05-22 |
Vlt Corporation |
Power converter connector assembly
|
SG82591A1
(en)
*
|
1998-12-17 |
2001-08-21 |
Eriston Technologies Pte Ltd |
Bumpless flip chip assembly with solder via
|
JP3635219B2
(ja)
*
|
1999-03-11 |
2005-04-06 |
新光電気工業株式会社 |
半導体装置用多層基板及びその製造方法
|
US6468638B2
(en)
*
|
1999-03-16 |
2002-10-22 |
Alien Technology Corporation |
Web process interconnect in electronic assemblies
|
US6110806A
(en)
*
|
1999-03-26 |
2000-08-29 |
International Business Machines Corporation |
Process for precision alignment of chips for mounting on a substrate
|
US6272271B1
(en)
|
1999-04-29 |
2001-08-07 |
General Electric Company |
Alignment of optical interfaces for data communication
|
US6333553B1
(en)
|
1999-05-21 |
2001-12-25 |
International Business Machines Corporation |
Wafer thickness compensation for interchip planarity
|
US6316737B1
(en)
|
1999-09-09 |
2001-11-13 |
Vlt Corporation |
Making a connection between a component and a circuit board
|
JP2003510824A
(ja)
*
|
1999-09-28 |
2003-03-18 |
ジエテツク,インコーポレーテツド |
大きい深さ対幅アスペクト比をもつホールから、ポリマーを制御下にかつ急速に除去するための大気内プロセスおよびシステム
|
US6242282B1
(en)
|
1999-10-04 |
2001-06-05 |
General Electric Company |
Circuit chip package and fabrication method
|
US7365019B2
(en)
*
|
1999-11-01 |
2008-04-29 |
Jetek, Llc |
Atmospheric process and system for controlled and rapid removal of polymers from high aspect ratio holes
|
US6762136B1
(en)
|
1999-11-01 |
2004-07-13 |
Jetek, Inc. |
Method for rapid thermal processing of substrates
|
US6955991B2
(en)
*
|
1999-11-01 |
2005-10-18 |
Jetek, Inc. |
Atmospheric process and system for controlled and rapid removal of polymers from high depth to width aspect ratio holes
|
US6475877B1
(en)
|
1999-12-22 |
2002-11-05 |
General Electric Company |
Method for aligning die to interconnect metal on flex substrate
|
US6586682B2
(en)
|
2000-02-23 |
2003-07-01 |
Kulicke & Soffa Holdings, Inc. |
Printed wiring board with controlled line impedance
|
DE60128656T2
(de)
*
|
2000-02-25 |
2007-10-04 |
Ibiden Co., Ltd., Ogaki |
Mehrschichtige leiterplatte und verfahren zu ihrer herstellung
|
US6410356B1
(en)
|
2000-03-07 |
2002-06-25 |
General Electric Company |
Silicon carbide large area device fabrication apparatus and method
|
EP1138804A3
(de)
|
2000-03-27 |
2003-06-25 |
Infineon Technologies AG |
Bauelement mit zumindest zwei aneinander grenzenden Isolierschichten und Herstellungsverfahren dazu
|
US6614103B1
(en)
|
2000-09-01 |
2003-09-02 |
General Electric Company |
Plastic packaging of LED arrays
|
CN1901177B
(zh)
|
2000-09-25 |
2010-05-12 |
揖斐电株式会社 |
半导体元件及其制造方法、多层印刷布线板及其制造方法
|
US6444560B1
(en)
*
|
2000-09-26 |
2002-09-03 |
International Business Machines Corporation |
Process for making fine pitch connections between devices and structure made by the process
|
JP3923716B2
(ja)
*
|
2000-09-29 |
2007-06-06 |
株式会社東芝 |
半導体装置
|
US6998281B2
(en)
*
|
2000-10-12 |
2006-02-14 |
General Electric Company |
Solid state lighting device with reduced form factor including LED with directional emission and package with microoptics
|
US6434005B1
(en)
|
2000-10-27 |
2002-08-13 |
Vlt Corporation |
Power converter packaging
|
US6518600B1
(en)
|
2000-11-17 |
2003-02-11 |
General Electric Company |
Dual encapsulation for an LED
|
US6985341B2
(en)
|
2001-04-24 |
2006-01-10 |
Vlt, Inc. |
Components having actively controlled circuit elements
|
US7443229B1
(en)
|
2001-04-24 |
2008-10-28 |
Picor Corporation |
Active filtering
|
US6606247B2
(en)
|
2001-05-31 |
2003-08-12 |
Alien Technology Corporation |
Multi-feature-size electronic structures
|
US6838750B2
(en)
*
|
2001-07-12 |
2005-01-04 |
Custom One Design, Inc. |
Interconnect circuitry, multichip module, and methods of manufacturing thereof
|
US6696910B2
(en)
*
|
2001-07-12 |
2004-02-24 |
Custom One Design, Inc. |
Planar inductors and method of manufacturing thereof
|
US6706624B1
(en)
|
2001-10-31 |
2004-03-16 |
Lockheed Martin Corporation |
Method for making multichip module substrates by encapsulating electrical conductors
|
US6602739B1
(en)
|
2001-10-31 |
2003-08-05 |
Lockheed Martin Corporation |
Method for making multichip module substrates by encapsulating electrical conductors and filling gaps
|
US6541378B1
(en)
|
2001-11-06 |
2003-04-01 |
Lockheed Martin Corporation |
Low-temperature HDI fabrication
|
US6908561B1
(en)
|
2001-11-06 |
2005-06-21 |
Lockhead Martin Corporation |
Polymide-to-substrate adhesion promotion in HDI
|
US6753746B2
(en)
*
|
2001-11-07 |
2004-06-22 |
Compeq Manufacturing Co., Ltd. |
Printed circuit board having jumper lines and the method for making said printed circuit board
|
US7214569B2
(en)
|
2002-01-23 |
2007-05-08 |
Alien Technology Corporation |
Apparatus incorporating small-feature-size and large-feature-size components and method for making same
|
FI119215B
(fi)
|
2002-01-31 |
2008-08-29 |
Imbera Electronics Oy |
Menetelmä komponentin upottamiseksi alustaan ja elektroniikkamoduuli
|
JP2003243604A
(ja)
*
|
2002-02-13 |
2003-08-29 |
Sony Corp |
電子部品及び電子部品の製造方法
|
US7579681B2
(en)
*
|
2002-06-11 |
2009-08-25 |
Micron Technology, Inc. |
Super high density module with integrated wafer level packages
|
EP1514307A1
(de)
*
|
2002-06-19 |
2005-03-16 |
Sten Bjorsell |
Herstellung elektronischer schaltung
|
US7485489B2
(en)
*
|
2002-06-19 |
2009-02-03 |
Bjoersell Sten |
Electronics circuit manufacture
|
US6964881B2
(en)
*
|
2002-08-27 |
2005-11-15 |
Micron Technology, Inc. |
Multi-chip wafer level system packages and methods of forming same
|
US6794222B1
(en)
|
2002-09-23 |
2004-09-21 |
Lockheed Martin Corporation |
HDI module with integral conductive electromagnetic shield
|
DE10250538B4
(de)
*
|
2002-10-29 |
2008-02-21 |
Infineon Technologies Ag |
Elektronisches Bauteil als Multichipmodul und Verfahren zu dessen Herstellung
|
US6711312B1
(en)
*
|
2002-12-20 |
2004-03-23 |
General Electric Company |
Integrated optoelectronic circuit and method of fabricating the same
|
US7327022B2
(en)
*
|
2002-12-30 |
2008-02-05 |
General Electric Company |
Assembly, contact and coupling interconnection for optoelectronics
|
US7122404B2
(en)
*
|
2003-03-11 |
2006-10-17 |
Micron Technology, Inc. |
Techniques for packaging a multiple device component
|
US6879038B2
(en)
*
|
2003-03-12 |
2005-04-12 |
Optical Communication Products, Inc. |
Method and apparatus for hermetic sealing of assembled die
|
US7253735B2
(en)
|
2003-03-24 |
2007-08-07 |
Alien Technology Corporation |
RFID tags and processes for producing RFID tags
|
DE10314172B4
(de)
*
|
2003-03-28 |
2006-11-30 |
Infineon Technologies Ag |
Verfahren zum Betreiben einer Anordnung aus einem elektrischen Bauelement auf einem Substrat und Verfahren zum Herstellen der Anordnung
|
US20040195669A1
(en)
*
|
2003-04-07 |
2004-10-07 |
Wilkins Wendy Lee |
Integrated circuit packaging apparatus and method
|
US6921975B2
(en)
|
2003-04-18 |
2005-07-26 |
Freescale Semiconductor, Inc. |
Circuit device with at least partial packaging, exposed active surface and a voltage reference plane
|
US6838776B2
(en)
*
|
2003-04-18 |
2005-01-04 |
Freescale Semiconductor, Inc. |
Circuit device with at least partial packaging and method for forming
|
US6864165B1
(en)
*
|
2003-09-15 |
2005-03-08 |
International Business Machines Corporation |
Method of fabricating integrated electronic chip with an interconnect device
|
US7338836B2
(en)
*
|
2003-11-05 |
2008-03-04 |
California Institute Of Technology |
Method for integrating pre-fabricated chip structures into functional electronic systems
|
DE10355925B4
(de)
*
|
2003-11-29 |
2006-07-06 |
Semikron Elektronik Gmbh & Co. Kg |
Leistungshalbleitermodul und Verfahren seiner Herstellung
|
US7067352B1
(en)
|
2004-03-08 |
2006-06-27 |
David Ralph Scheid |
Vertical integrated package apparatus and method
|
DE102004018468A1
(de)
*
|
2004-04-16 |
2006-02-16 |
eupec Europäische Gesellschaft für Leistungshalbleiter mbH |
Verfahren zum strukturierten Aufbringen einer laminierbaren Folie auf ein Substrat für ein Halbleitermodul
|
ATE526396T1
(de)
*
|
2004-04-23 |
2011-10-15 |
Hema Quebec |
Verfahren zur expansion von nabelschnurblutzellen
|
DE102004025684A1
(de)
|
2004-04-29 |
2005-11-17 |
Osram Opto Semiconductors Gmbh |
Optoelektronischer Halbleiterchip und Verfahren zum Ausbilden einer Kontaktstruktur zur elektrischen Kontaktierung eines optoelektronischen Halbleiterchips
|
US20050242425A1
(en)
*
|
2004-04-30 |
2005-11-03 |
Leal George R |
Semiconductor device with a protected active die region and method therefor
|
US7289336B2
(en)
*
|
2004-10-28 |
2007-10-30 |
General Electric Company |
Electronic packaging and method of making the same
|
US7688206B2
(en)
|
2004-11-22 |
2010-03-30 |
Alien Technology Corporation |
Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
|
FI20041525A
(fi)
*
|
2004-11-26 |
2006-03-17 |
Imbera Electronics Oy |
Elektroniikkamoduuli ja menetelmä sen valmistamiseksi
|
US7781741B2
(en)
*
|
2005-10-27 |
2010-08-24 |
General Electric Company |
Methods and systems for controlling data acquisition system noise
|
DE102006009723A1
(de)
*
|
2006-03-02 |
2007-09-06 |
Siemens Ag |
Verfahren zum Herstellen und planaren Kontaktieren einer elektronischen Vorrichtung und entsprechend hergestellte Vorrichtung
|
US8829661B2
(en)
*
|
2006-03-10 |
2014-09-09 |
Freescale Semiconductor, Inc. |
Warp compensated package and method
|
US20070212813A1
(en)
*
|
2006-03-10 |
2007-09-13 |
Fay Owen R |
Perforated embedded plane package and method
|
US8049338B2
(en)
|
2006-04-07 |
2011-11-01 |
General Electric Company |
Power semiconductor module and fabrication method
|
US7524775B2
(en)
*
|
2006-07-13 |
2009-04-28 |
Infineon Technologies Ag |
Method for producing a dielectric layer for an electronic component
|
SG139594A1
(en)
*
|
2006-08-04 |
2008-02-29 |
Micron Technology Inc |
Microelectronic devices and methods for manufacturing microelectronic devices
|
US20080190748A1
(en)
*
|
2007-02-13 |
2008-08-14 |
Stephen Daley Arthur |
Power overlay structure for mems devices and method for making power overlay structure for mems devices
|
TW200836315A
(en)
*
|
2007-02-16 |
2008-09-01 |
Richtek Techohnology Corp |
Electronic package structure and method thereof
|
US9610758B2
(en)
*
|
2007-06-21 |
2017-04-04 |
General Electric Company |
Method of making demountable interconnect structure
|
US9953910B2
(en)
*
|
2007-06-21 |
2018-04-24 |
General Electric Company |
Demountable interconnect structure
|
US20080318413A1
(en)
*
|
2007-06-21 |
2008-12-25 |
General Electric Company |
Method for making an interconnect structure and interconnect component recovery process
|
US20080318055A1
(en)
*
|
2007-06-21 |
2008-12-25 |
General Electric Company |
Recoverable electronic component
|
US20080313894A1
(en)
*
|
2007-06-21 |
2008-12-25 |
General Electric Company |
Method for making an interconnect structure and low-temperature interconnect component recovery process
|
US20080318054A1
(en)
*
|
2007-06-21 |
2008-12-25 |
General Electric Company |
Low-temperature recoverable electronic component
|
US7619901B2
(en)
*
|
2007-06-25 |
2009-11-17 |
Epic Technologies, Inc. |
Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system
|
US20090028491A1
(en)
|
2007-07-26 |
2009-01-29 |
General Electric Company |
Interconnect structure
|
US7605466B2
(en)
*
|
2007-10-15 |
2009-10-20 |
General Electric Company |
Sealed wafer packaging of microelectromechanical systems
|
TWI360207B
(en)
|
2007-10-22 |
2012-03-11 |
Advanced Semiconductor Eng |
Chip package structure and method of manufacturing
|
US7915696B2
(en)
*
|
2007-10-24 |
2011-03-29 |
General Electric Company |
Electrical connection through a substrate to a microelectromechanical device
|
US7950144B2
(en)
*
|
2008-04-30 |
2011-05-31 |
Freescale Semiconductor, Inc. |
Method for controlling warpage in redistributed chip packaging panels
|
FI123205B
(fi)
|
2008-05-12 |
2012-12-31 |
Imbera Electronics Oy |
Piirimoduuli ja menetelmä piirimoduulin valmistamiseksi
|
US8253241B2
(en)
|
2008-05-20 |
2012-08-28 |
Infineon Technologies Ag |
Electronic module
|
US8354304B2
(en)
*
|
2008-12-05 |
2013-01-15 |
Stats Chippac, Ltd. |
Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant
|
US20110156261A1
(en)
*
|
2009-03-24 |
2011-06-30 |
Christopher James Kapusta |
Integrated circuit package and method of making same
|
US8163596B2
(en)
|
2009-03-24 |
2012-04-24 |
General Electric Company |
Stackable electronic package and method of making same
|
US8026608B2
(en)
*
|
2009-03-24 |
2011-09-27 |
General Electric Company |
Stackable electronic package
|
US9299661B2
(en)
*
|
2009-03-24 |
2016-03-29 |
General Electric Company |
Integrated circuit package and method of making same
|
TWI456715B
(zh)
|
2009-06-19 |
2014-10-11 |
Advanced Semiconductor Eng |
晶片封裝結構及其製造方法
|
TWI466259B
(zh)
*
|
2009-07-21 |
2014-12-21 |
Advanced Semiconductor Eng |
半導體封裝件、其製造方法及重佈晶片封膠體的製造方法
|
TWI405306B
(zh)
|
2009-07-23 |
2013-08-11 |
Advanced Semiconductor Eng |
半導體封裝件、其製造方法及重佈晶片封膠體
|
US20110084372A1
(en)
|
2009-10-14 |
2011-04-14 |
Advanced Semiconductor Engineering, Inc. |
Package carrier, semiconductor package, and process for fabricating same
|
US8378466B2
(en)
|
2009-11-19 |
2013-02-19 |
Advanced Semiconductor Engineering, Inc. |
Wafer-level semiconductor device packages with electromagnetic interference shielding
|
US8169065B2
(en)
*
|
2009-12-22 |
2012-05-01 |
Epic Technologies, Inc. |
Stackable circuit structures and methods of fabrication thereof
|
US8569894B2
(en)
|
2010-01-13 |
2013-10-29 |
Advanced Semiconductor Engineering, Inc. |
Semiconductor package with single sided substrate design and manufacturing methods thereof
|
US8372689B2
(en)
|
2010-01-21 |
2013-02-12 |
Advanced Semiconductor Engineering, Inc. |
Wafer-level semiconductor device packages with three-dimensional fan-out and manufacturing methods thereof
|
US8320134B2
(en)
|
2010-02-05 |
2012-11-27 |
Advanced Semiconductor Engineering, Inc. |
Embedded component substrate and manufacturing methods thereof
|
US20110198762A1
(en)
*
|
2010-02-16 |
2011-08-18 |
Deca Technologies Inc. |
Panelized packaging with transferred dielectric
|
US10276486B2
(en)
*
|
2010-03-02 |
2019-04-30 |
General Electric Company |
Stress resistant micro-via structure for flexible circuits
|
TWI411075B
(zh)
|
2010-03-22 |
2013-10-01 |
Advanced Semiconductor Eng |
半導體封裝件及其製造方法
|
US8278746B2
(en)
|
2010-04-02 |
2012-10-02 |
Advanced Semiconductor Engineering, Inc. |
Semiconductor device packages including connecting elements
|
US8624374B2
(en)
|
2010-04-02 |
2014-01-07 |
Advanced Semiconductor Engineering, Inc. |
Semiconductor device packages with fan-out and with connecting elements for stacking and manufacturing methods thereof
|
US8349727B2
(en)
|
2010-04-08 |
2013-01-08 |
Liang Guo |
Integrated method for high-density interconnection of electronic components through stretchable interconnects
|
US8941222B2
(en)
|
2010-11-11 |
2015-01-27 |
Advanced Semiconductor Engineering Inc. |
Wafer level semiconductor package and manufacturing methods thereof
|
US9406658B2
(en)
|
2010-12-17 |
2016-08-02 |
Advanced Semiconductor Engineering, Inc. |
Embedded component device and manufacturing methods thereof
|
US20120161319A1
(en)
*
|
2010-12-23 |
2012-06-28 |
Stmicroelectronics Pte Ltd. |
Ball grid array method and structure
|
CN103827893A
(zh)
*
|
2011-09-28 |
2014-05-28 |
金雅拓技术亚洲有限公司 |
制造具有微电路的数据载体的方法
|
US9245819B2
(en)
*
|
2012-02-22 |
2016-01-26 |
Freescale Semiconductor, Inc. |
Embedded electrical component surface interconnect
|
US9078352B2
(en)
*
|
2012-10-29 |
2015-07-07 |
Avago Technologies General Ip (Singapore) Pte. Ltd. |
Low inductance flex bond with low thermal resistance
|
US9544499B2
(en)
*
|
2013-11-17 |
2017-01-10 |
Energy Re-Connect Ltd. |
System apparatus and device for facilitating network edge device backup and methods of operation thereof
|
US9419156B2
(en)
*
|
2013-08-30 |
2016-08-16 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Package and method for integration of heterogeneous integrated circuits
|
US9305901B2
(en)
|
2014-07-17 |
2016-04-05 |
Seagate Technology Llc |
Non-circular die package interconnect
|
KR102497583B1
(ko)
*
|
2015-10-27 |
2023-02-10 |
삼성전자주식회사 |
유연한 연결부를 갖는 반도체 장치 및 그 제조방법
|
US10678150B1
(en)
|
2018-11-15 |
2020-06-09 |
Applied Materials, Inc. |
Dynamic generation of layout adaptive packaging
|
US11934762B2
(en)
|
2021-08-06 |
2024-03-19 |
Applied Materials, Inc. |
Overlaying on locally dispositioned patterns by ML based dynamic digital corrections (ML-DDC)
|