DE3482013D1 - Verfahren zum herstellen einer integrierten hybridschaltung. - Google Patents

Verfahren zum herstellen einer integrierten hybridschaltung.

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Publication number
DE3482013D1
DE3482013D1 DE8484113495T DE3482013T DE3482013D1 DE 3482013 D1 DE3482013 D1 DE 3482013D1 DE 8484113495 T DE8484113495 T DE 8484113495T DE 3482013 T DE3482013 T DE 3482013T DE 3482013 D1 DE3482013 D1 DE 3482013D1
Authority
DE
Germany
Prior art keywords
producing
hybrid circuit
integrated hybrid
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8484113495T
Other languages
English (en)
Inventor
Kazuhiro C O Patent Matsuzaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP21098783A external-priority patent/JPS6054994B2/ja
Priority claimed from JP21098883A external-priority patent/JPS60103693A/ja
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE3482013D1 publication Critical patent/DE3482013D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE8484113495T 1983-11-11 1984-11-08 Verfahren zum herstellen einer integrierten hybridschaltung. Expired - Lifetime DE3482013D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP21098783A JPS6054994B2 (ja) 1983-11-11 1983-11-11 接着剤
JP21098883A JPS60103693A (ja) 1983-11-11 1983-11-11 混成集積回路の製造方法

Publications (1)

Publication Number Publication Date
DE3482013D1 true DE3482013D1 (de) 1990-05-23

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ID=26518369

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Application Number Title Priority Date Filing Date
DE8484113495T Expired - Lifetime DE3482013D1 (de) 1983-11-11 1984-11-08 Verfahren zum herstellen einer integrierten hybridschaltung.

Country Status (3)

Country Link
US (1) US4635346A (de)
EP (1) EP0142783B1 (de)
DE (1) DE3482013D1 (de)

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* Cited by examiner, † Cited by third party
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DE3517965A1 (de) * 1985-05-18 1986-11-20 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zur herstellung einer elektrischen schaltung in hybridtechnik
EP0252739B1 (de) * 1986-07-09 1993-10-06 LINTEC Corporation Klebestreifen zum Kleben von Plättchen
US5296074A (en) * 1987-03-30 1994-03-22 E. I. Du Pont De Nemours And Company Method for bonding small electronic components
CA1290676C (en) * 1987-03-30 1991-10-15 William Frank Graham Method for bonding integrated circuit chips
US5045141A (en) * 1988-07-01 1991-09-03 Amoco Corporation Method of making solderable printed circuits formed without plating
US4976813A (en) * 1988-07-01 1990-12-11 Amoco Corporation Process for using a composition for a solder mask
US5019535A (en) * 1989-03-28 1991-05-28 General Electric Company Die attachment method using nonconductive adhesive for use in high density interconnected assemblies
DE3923023A1 (de) * 1989-07-12 1991-01-24 Siemens Ag Uv-haertbarer klebstoff fuer ein halbleiterchipmontageverfahren
US4928387A (en) * 1989-09-07 1990-05-29 Rockwell International Corp. Temporary soldering aid for manufacture of printed wiring assemblies
FR2685159B1 (fr) * 1991-12-17 1996-11-22 Matra Sep Imagerie Inf Procede de fabrication de circuits electroniques a micro-composants nus et circuit encapsule realisable par ce procede.
US5608261A (en) * 1994-12-28 1997-03-04 Intel Corporation High performance and high capacitance package with improved thermal dissipation
US5766975A (en) * 1995-01-09 1998-06-16 Integrated Device Technology, Inc. Packaged integrated circuit having thermal enhancement and reduced footprint size
US6505665B1 (en) * 1998-09-17 2003-01-14 Intermedics, Inc. Method and apparatus for use in assembling electronic devices
US8231692B2 (en) * 2008-11-06 2012-07-31 International Business Machines Corporation Method for manufacturing an electronic device

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Publication number Priority date Publication date Assignee Title
DE1065965B (de) * 1956-12-04 1959-09-24
US3644252A (en) * 1969-05-13 1972-02-22 Velsicol Chemical Corp Adhesive compositions containing styrene/isobutylene copolymer
GB1370782A (en) * 1970-11-11 1974-10-16 Ciba Geigy Ag Adhesive compositions
JPS5232370B2 (de) * 1972-08-09 1977-08-20
US3970623A (en) * 1974-11-29 1976-07-20 The Goodyear Tire & Rubber Company Adhesive composition containing a copolymer of butadiene, styrene, and acrylonitrile, plus a tackifying resin
US4007311A (en) * 1975-11-06 1977-02-08 Shell Oil Company Polyacrylate-grafted block copolymer adhesive compositions
US4143005A (en) * 1977-09-19 1979-03-06 Rca Corporation Extrudable, non-flowing and non-aqueous solvent soluble hold down compound for printed wiring board assembly
US4215025A (en) * 1977-12-27 1980-07-29 Rca Corporation Water soluble adhesive coating for mounting components to printed wiring boards
US4251597A (en) * 1978-12-01 1981-02-17 Rohm And Haas Company Coating, impregnating and adhesive compositions curable at ambient temperature, and methods of using them
JPS54105774A (en) * 1978-02-08 1979-08-20 Hitachi Ltd Method of forming pattern on thin film hybrid integrated circuit
US4162997A (en) * 1978-03-02 1979-07-31 Hercules Incorporated Heat-fusible pastes for printing inks, adhesives and moldings
JPS54144203A (en) * 1978-05-01 1979-11-10 Fuji Yakuhin Kogyo Kk Method of making flat printing plate
DE3064555D1 (en) * 1979-02-26 1983-09-22 Nat Res Dev Method of incorporating a distributed microwave circuit element in a microwave integrated circuit
US4372475A (en) * 1981-04-29 1983-02-08 Goforth Melvin L Electronic assembly process and apparatus
US4487638A (en) * 1982-11-24 1984-12-11 Burroughs Corporation Semiconductor die-attach technique and composition therefor

Also Published As

Publication number Publication date
EP0142783B1 (de) 1990-04-18
EP0142783A2 (de) 1985-05-29
US4635346A (en) 1987-01-13
EP0142783A3 (en) 1987-04-22

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