DE3772900D1 - Verfahren zum herstellen einer duennschichtschaltung und nach diesem verfahren hergestellte passive schaltung. - Google Patents
Verfahren zum herstellen einer duennschichtschaltung und nach diesem verfahren hergestellte passive schaltung.Info
- Publication number
- DE3772900D1 DE3772900D1 DE8787201179T DE3772900T DE3772900D1 DE 3772900 D1 DE3772900 D1 DE 3772900D1 DE 8787201179 T DE8787201179 T DE 8787201179T DE 3772900 T DE3772900 T DE 3772900T DE 3772900 D1 DE3772900 D1 DE 3772900D1
- Authority
- DE
- Germany
- Prior art keywords
- thin
- producing
- circuit
- produced
- passive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
- H01L21/707—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thin-film circuits or parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49099—Coating resistive material on a base
Landscapes
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Semiconductor Integrated Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Non-Adjustable Resistors (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Microwave Amplifiers (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT21126/86A IT1197776B (it) | 1986-07-15 | 1986-07-15 | Processo per l'ottenimento di circuiti passivi a strato sottile con linee resistive a differenti resistenze di strato e circuito passivo realizzato con il processo suddetto |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3772900D1 true DE3772900D1 (de) | 1991-10-17 |
Family
ID=11177117
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8787201179T Expired - Lifetime DE3772900D1 (de) | 1986-07-15 | 1987-06-19 | Verfahren zum herstellen einer duennschichtschaltung und nach diesem verfahren hergestellte passive schaltung. |
Country Status (7)
Country | Link |
---|---|
US (1) | US5152869A (de) |
EP (1) | EP0256568B1 (de) |
JP (1) | JPH07101730B2 (de) |
DE (1) | DE3772900D1 (de) |
GR (1) | GR3003237T3 (de) |
IT (1) | IT1197776B (de) |
NO (1) | NO173037C (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1197776B (it) * | 1986-07-15 | 1988-12-06 | Gte Telecom Spa | Processo per l'ottenimento di circuiti passivi a strato sottile con linee resistive a differenti resistenze di strato e circuito passivo realizzato con il processo suddetto |
IT1216135B (it) * | 1988-03-18 | 1990-02-22 | Sits Soc It Telecom Siemens | Dielettrico mediante deposizioni in processo per la realizzazione di vuoto di metalli, e relativo fori metallizzati in un substrato prodotto ottenuto. |
US5310965A (en) * | 1991-08-28 | 1994-05-10 | Nec Corporation | Multi-level wiring structure having an organic interlayer insulating film |
US5288951A (en) * | 1992-10-30 | 1994-02-22 | At&T Bell Laboratories | Copper-based metallizations for hybrid integrated circuits |
US5352331A (en) * | 1993-12-07 | 1994-10-04 | Trw Inc. | Cermet etch technique for integrated circuits |
EP0697723A3 (de) * | 1994-08-15 | 1997-04-16 | Ibm | Verfahren zur Metallisierung einer isolierenden Schicht |
US6498385B1 (en) | 1999-09-01 | 2002-12-24 | International Business Machines Corporation | Post-fuse blow corrosion prevention structure for copper fuses |
DE10039710B4 (de) * | 2000-08-14 | 2017-06-22 | United Monolithic Semiconductors Gmbh | Verfahren zur Herstellung passiver Bauelemente auf einem Halbleitersubstrat |
US6475400B2 (en) | 2001-02-26 | 2002-11-05 | Trw Inc. | Method for controlling the sheet resistance of thin film resistors |
DE10213940A1 (de) * | 2002-03-28 | 2003-10-30 | Bosch Gmbh Robert | Verfahren zur Herstellung einer auf einem Substrat aufgebauten Dünnschichtanordnung, insbesondere Sensoranordnung sowie eine Dünnschichtanordnung |
TWI266568B (en) * | 2004-03-08 | 2006-11-11 | Brain Power Co | Method for manufacturing embedded thin film resistor on printed circuit board |
US7199016B2 (en) | 2004-08-13 | 2007-04-03 | Raytheon Company | Integrated circuit resistor |
JP2009295346A (ja) * | 2008-06-03 | 2009-12-17 | Hitachi Cable Ltd | 電気接点層付金属材及びその製造方法 |
US8242876B2 (en) | 2008-09-17 | 2012-08-14 | Stmicroelectronics, Inc. | Dual thin film precision resistance trimming |
US8400257B2 (en) | 2010-08-24 | 2013-03-19 | Stmicroelectronics Pte Ltd | Via-less thin film resistor with a dielectric cap |
US8659085B2 (en) | 2010-08-24 | 2014-02-25 | Stmicroelectronics Pte Ltd. | Lateral connection for a via-less thin film resistor |
US8436426B2 (en) * | 2010-08-24 | 2013-05-07 | Stmicroelectronics Pte Ltd. | Multi-layer via-less thin film resistor |
US8927909B2 (en) | 2010-10-11 | 2015-01-06 | Stmicroelectronics, Inc. | Closed loop temperature controlled circuit to improve device stability |
US9159413B2 (en) | 2010-12-29 | 2015-10-13 | Stmicroelectronics Pte Ltd. | Thermo programmable resistor based ROM |
US8809861B2 (en) | 2010-12-29 | 2014-08-19 | Stmicroelectronics Pte Ltd. | Thin film metal-dielectric-metal transistor |
US8981527B2 (en) * | 2011-08-23 | 2015-03-17 | United Microelectronics Corp. | Resistor and manufacturing method thereof |
US8526214B2 (en) | 2011-11-15 | 2013-09-03 | Stmicroelectronics Pte Ltd. | Resistor thin film MTP memory |
US9140735B2 (en) | 2013-05-03 | 2015-09-22 | Infineon Technologies Ag | Integration of current measurement in wiring structure of an electronic circuit |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3423821A (en) * | 1965-03-18 | 1969-01-28 | Hitachi Ltd | Method of producing thin film integrated circuits |
US4112196A (en) * | 1977-01-24 | 1978-09-05 | National Micronetics, Inc. | Beam lead arrangement for microelectronic devices |
JPS55162254A (en) * | 1979-06-05 | 1980-12-17 | Nec Corp | Composite integrated circuit |
US4226932A (en) * | 1979-07-05 | 1980-10-07 | Gte Automatic Electric Laboratories Incorporated | Titanium nitride as one layer of a multi-layered coating intended to be etched |
JPS57113264A (en) * | 1980-12-29 | 1982-07-14 | Fujitsu Ltd | Manufacture of mis type capacitor |
DE3200983A1 (de) * | 1982-01-14 | 1983-07-21 | Siemens AG, 1000 Berlin und 8000 München | Elektrisches netzwerk |
IT1197776B (it) * | 1986-07-15 | 1988-12-06 | Gte Telecom Spa | Processo per l'ottenimento di circuiti passivi a strato sottile con linee resistive a differenti resistenze di strato e circuito passivo realizzato con il processo suddetto |
US4801469A (en) * | 1986-08-07 | 1989-01-31 | The United States Of America As Represented By The Department Of Energy | Process for obtaining multiple sheet resistances for thin film hybrid microcircuit resistors |
-
1986
- 1986-07-15 IT IT21126/86A patent/IT1197776B/it active
-
1987
- 1987-06-19 EP EP87201179A patent/EP0256568B1/de not_active Expired - Lifetime
- 1987-06-19 DE DE8787201179T patent/DE3772900D1/de not_active Expired - Lifetime
- 1987-07-13 NO NO872916A patent/NO173037C/no unknown
- 1987-07-13 JP JP62173102A patent/JPH07101730B2/ja not_active Expired - Lifetime
-
1990
- 1990-12-11 US US07/627,568 patent/US5152869A/en not_active Expired - Fee Related
-
1991
- 1991-11-29 GR GR91401653T patent/GR3003237T3/el unknown
Also Published As
Publication number | Publication date |
---|---|
EP0256568A2 (de) | 1988-02-24 |
IT8621126A1 (it) | 1988-01-15 |
NO173037B (no) | 1993-07-05 |
JPS6329961A (ja) | 1988-02-08 |
NO872916D0 (no) | 1987-07-13 |
EP0256568A3 (en) | 1988-08-10 |
NO173037C (no) | 1993-10-13 |
IT8621126A0 (it) | 1986-07-15 |
US5152869A (en) | 1992-10-06 |
EP0256568B1 (de) | 1991-09-11 |
NO872916L (no) | 1988-01-18 |
IT1197776B (it) | 1988-12-06 |
GR3003237T3 (en) | 1993-02-17 |
JPH07101730B2 (ja) | 1995-11-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |