IT1216135B - Dielettrico mediante deposizioni in processo per la realizzazione di vuoto di metalli, e relativo fori metallizzati in un substrato prodotto ottenuto. - Google Patents

Dielettrico mediante deposizioni in processo per la realizzazione di vuoto di metalli, e relativo fori metallizzati in un substrato prodotto ottenuto.

Info

Publication number
IT1216135B
IT1216135B IT8819830A IT1983088A IT1216135B IT 1216135 B IT1216135 B IT 1216135B IT 8819830 A IT8819830 A IT 8819830A IT 1983088 A IT1983088 A IT 1983088A IT 1216135 B IT1216135 B IT 1216135B
Authority
IT
Italy
Prior art keywords
holes
metal
dielectric
emptying
substrate
Prior art date
Application number
IT8819830A
Other languages
English (en)
Other versions
IT8819830A0 (it
Inventor
Giampiero Ferraris
Tarcisio Cagnin
Original Assignee
Sits Soc It Telecom Siemens
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sits Soc It Telecom Siemens filed Critical Sits Soc It Telecom Siemens
Publication of IT8819830A0 publication Critical patent/IT8819830A0/it
Priority to IT8819830A priority Critical patent/IT1216135B/it
Priority to US07/316,365 priority patent/US5011761A/en
Priority to DE89200550T priority patent/DE68907237T2/de
Priority to AT89200550T priority patent/ATE91061T1/de
Priority to EP89200550A priority patent/EP0333252B1/en
Priority to ES198989200550T priority patent/ES2041394T3/es
Priority to AU31179/89A priority patent/AU618584B2/en
Priority to ZA891890A priority patent/ZA891890B/xx
Priority to NO891153A priority patent/NO175610C/no
Application granted granted Critical
Publication of IT1216135B publication Critical patent/IT1216135B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Physical Vapour Deposition (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
IT8819830A 1988-03-18 1988-03-18 Dielettrico mediante deposizioni in processo per la realizzazione di vuoto di metalli, e relativo fori metallizzati in un substrato prodotto ottenuto. IT1216135B (it)

Priority Applications (9)

Application Number Priority Date Filing Date Title
IT8819830A IT1216135B (it) 1988-03-18 1988-03-18 Dielettrico mediante deposizioni in processo per la realizzazione di vuoto di metalli, e relativo fori metallizzati in un substrato prodotto ottenuto.
US07/316,365 US5011761A (en) 1988-03-18 1989-02-27 Process for making metallized holes in a dielectric substrate by vacuum deposition of metals and the product obtained thereby
EP89200550A EP0333252B1 (en) 1988-03-18 1989-03-06 Process for making metallized holes in a dielectric substrate by vacuum deposition of metals and the product obtained thereby
AT89200550T ATE91061T1 (de) 1988-03-18 1989-03-06 Verfahren fuer die herstellung von metallisierten loechern in einem substrat durch eine metallablagerung im vakuum und auf diese weise hergestelltes produkt.
DE89200550T DE68907237T2 (de) 1988-03-18 1989-03-06 Verfahren für die Herstellung von metallisierten Löchern in einem Substrat durch eine Metallablagerung im Vakuum und auf diese Weise hergestelltes Produkt.
ES198989200550T ES2041394T3 (es) 1988-03-18 1989-03-06 Proceso para la fabricacion de taladros metalizados en un substrato dielectrico mediante deposicion en vacio de metales y el producto obtenido de esta manera.
AU31179/89A AU618584B2 (en) 1988-03-18 1989-03-09 Process for making metallized holes in a dielectric substrate by vacuum deposition of metals and the product obtained thereby
ZA891890A ZA891890B (en) 1988-03-18 1989-03-13 Process for making metallized holes in a dielectric substrate by vacuum deposition of metals and the product obtained thereby
NO891153A NO175610C (no) 1988-03-18 1989-03-16 Fremgangsmåte for å fremstille metalliserte hull i et dielektrisk substrat med vakuumavsetning av metaller og produkter fremstilt derved

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8819830A IT1216135B (it) 1988-03-18 1988-03-18 Dielettrico mediante deposizioni in processo per la realizzazione di vuoto di metalli, e relativo fori metallizzati in un substrato prodotto ottenuto.

Publications (2)

Publication Number Publication Date
IT8819830A0 IT8819830A0 (it) 1988-03-18
IT1216135B true IT1216135B (it) 1990-02-22

Family

ID=11161637

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8819830A IT1216135B (it) 1988-03-18 1988-03-18 Dielettrico mediante deposizioni in processo per la realizzazione di vuoto di metalli, e relativo fori metallizzati in un substrato prodotto ottenuto.

Country Status (9)

Country Link
US (1) US5011761A (it)
EP (1) EP0333252B1 (it)
AT (1) ATE91061T1 (it)
AU (1) AU618584B2 (it)
DE (1) DE68907237T2 (it)
ES (1) ES2041394T3 (it)
IT (1) IT1216135B (it)
NO (1) NO175610C (it)
ZA (1) ZA891890B (it)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5584956A (en) * 1992-12-09 1996-12-17 University Of Iowa Research Foundation Method for producing conductive or insulating feedthroughs in a substrate
ATE162924T1 (de) * 1993-12-22 1998-02-15 Italtel Spa Verfahren zur herstellung von metallisierten löchern in dielektrischen substraten mit untereinander verbundenen dünnschichtleiter- und/oder widerstandsbahnen
DE19524099A1 (de) * 1995-07-01 1997-01-02 Karlsruhe Forschzent Verfahren zur Herstellung von Formeinsätzen
US7479304B2 (en) * 2002-02-14 2009-01-20 Applied Materials, Inc. Gas distribution plate fabricated from a solid yttrium oxide-comprising substrate
ITTO20030846A1 (it) * 2003-10-28 2005-04-29 Intier Automotive Closures Spa Procedimento per la realizzazione di un corpo di supporto per una serratura di un autoveicolo e corpo di supporto cosi' ottenuto.
US10622194B2 (en) 2007-04-27 2020-04-14 Applied Materials, Inc. Bulk sintered solid solution ceramic which exhibits fracture toughness and halogen plasma resistance
US10242888B2 (en) 2007-04-27 2019-03-26 Applied Materials, Inc. Semiconductor processing apparatus with a ceramic-comprising surface which exhibits fracture toughness and halogen plasma resistance

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4226932A (en) * 1979-07-05 1980-10-07 Gte Automatic Electric Laboratories Incorporated Titanium nitride as one layer of a multi-layered coating intended to be etched
DE3427015A1 (de) * 1984-07-21 1986-01-30 Nippon Mektron, Ltd., Tokio/Tokyo Verfahren zur herstellung von durchkontaktierungen in gedruckten schaltungen
IT1191680B (it) * 1986-03-19 1988-03-23 Gte Telecom Spa Processo per la realizzazione di fori metallizzati in un substrato dotato di cammini conduttivi e resistivi,e prodotto ottenuto con il processo suddetto
IT1197776B (it) * 1986-07-15 1988-12-06 Gte Telecom Spa Processo per l'ottenimento di circuiti passivi a strato sottile con linee resistive a differenti resistenze di strato e circuito passivo realizzato con il processo suddetto

Also Published As

Publication number Publication date
NO175610B (no) 1994-07-25
ES2041394T3 (es) 1993-11-16
NO175610C (no) 1994-11-02
AU3117989A (en) 1989-09-21
EP0333252A2 (en) 1989-09-20
IT8819830A0 (it) 1988-03-18
NO891153L (no) 1989-09-19
AU618584B2 (en) 1992-01-02
US5011761A (en) 1991-04-30
ZA891890B (en) 1989-11-29
EP0333252A3 (en) 1990-09-05
DE68907237D1 (de) 1993-07-29
DE68907237T2 (de) 1993-12-02
NO891153D0 (no) 1989-03-16
EP0333252B1 (en) 1993-06-23
ATE91061T1 (de) 1993-07-15

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Legal Events

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TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19960327