IT1191680B - Processo per la realizzazione di fori metallizzati in un substrato dotato di cammini conduttivi e resistivi,e prodotto ottenuto con il processo suddetto - Google Patents

Processo per la realizzazione di fori metallizzati in un substrato dotato di cammini conduttivi e resistivi,e prodotto ottenuto con il processo suddetto

Info

Publication number
IT1191680B
IT1191680B IT19803/86A IT1980386A IT1191680B IT 1191680 B IT1191680 B IT 1191680B IT 19803/86 A IT19803/86 A IT 19803/86A IT 1980386 A IT1980386 A IT 1980386A IT 1191680 B IT1191680 B IT 1191680B
Authority
IT
Italy
Prior art keywords
realization
conductive
product obtained
substrate equipped
resistive paths
Prior art date
Application number
IT19803/86A
Other languages
English (en)
Other versions
IT8619803A0 (it
IT8619803A1 (it
Inventor
Carla Bassani
Carlo Villa
Maurizio Ziboni
Original Assignee
Gte Telecom Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gte Telecom Spa filed Critical Gte Telecom Spa
Priority to IT19803/86A priority Critical patent/IT1191680B/it
Publication of IT8619803A0 publication Critical patent/IT8619803A0/it
Priority to EP87200298A priority patent/EP0238118A2/en
Publication of IT8619803A1 publication Critical patent/IT8619803A1/it
Application granted granted Critical
Publication of IT1191680B publication Critical patent/IT1191680B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0542—Continuous temporary metal layer over metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
IT19803/86A 1986-03-19 1986-03-19 Processo per la realizzazione di fori metallizzati in un substrato dotato di cammini conduttivi e resistivi,e prodotto ottenuto con il processo suddetto IT1191680B (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IT19803/86A IT1191680B (it) 1986-03-19 1986-03-19 Processo per la realizzazione di fori metallizzati in un substrato dotato di cammini conduttivi e resistivi,e prodotto ottenuto con il processo suddetto
EP87200298A EP0238118A2 (en) 1986-03-19 1987-02-24 Process for making metallized holes in a substrate having conductive and resistive paths and the product obtained by said process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT19803/86A IT1191680B (it) 1986-03-19 1986-03-19 Processo per la realizzazione di fori metallizzati in un substrato dotato di cammini conduttivi e resistivi,e prodotto ottenuto con il processo suddetto

Publications (3)

Publication Number Publication Date
IT8619803A0 IT8619803A0 (it) 1986-03-19
IT8619803A1 IT8619803A1 (it) 1987-09-19
IT1191680B true IT1191680B (it) 1988-03-23

Family

ID=11161372

Family Applications (1)

Application Number Title Priority Date Filing Date
IT19803/86A IT1191680B (it) 1986-03-19 1986-03-19 Processo per la realizzazione di fori metallizzati in un substrato dotato di cammini conduttivi e resistivi,e prodotto ottenuto con il processo suddetto

Country Status (2)

Country Link
EP (1) EP0238118A2 (it)
IT (1) IT1191680B (it)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1216135B (it) * 1988-03-18 1990-02-22 Sits Soc It Telecom Siemens Dielettrico mediante deposizioni in processo per la realizzazione di vuoto di metalli, e relativo fori metallizzati in un substrato prodotto ottenuto.
WO1992009102A1 (en) * 1990-11-15 1992-05-29 International Business Machines Corporation A method of making a multilayer thin film structure
US5266446A (en) * 1990-11-15 1993-11-30 International Business Machines Corporation Method of making a multilayer thin film structure
ATE162924T1 (de) * 1993-12-22 1998-02-15 Italtel Spa Verfahren zur herstellung von metallisierten löchern in dielektrischen substraten mit untereinander verbundenen dünnschichtleiter- und/oder widerstandsbahnen
SE523150C2 (sv) 2000-01-14 2004-03-30 Ericsson Telefon Ab L M Kretsmönsterkort och metod för tillverkning av kretsmönsterkort med tunt kopparskikt

Also Published As

Publication number Publication date
IT8619803A0 (it) 1986-03-19
IT8619803A1 (it) 1987-09-19
EP0238118A2 (en) 1987-09-23

Similar Documents

Publication Publication Date Title
BR8502659A (pt) Processo e produto
DE3175779D1 (en) Planar multi-level metal-insulator structure comprising a substrate, a conductive interconnection pattern and a superposed conductive structure and a method to form such a structure
GR3000829T3 (en) Lightweight insulating boards and process for manufacturing same.
IT8522362A0 (it) Articoli per la rosolatura a microonde e metodo per la loro fabbricazione.
EP0262750A3 (en) Very large scale parallel computer
EP0430116A3 (en) Method for forming through holes in a polyimide substrate
ZA851755B (en) Electroplated substrate
DE3787305D1 (de) Verfahren zum Herstellen von funktionellen Filmen auf dünnem durchsichtigem elektrisch leitendem Muster, sowie seine Abstände.
BR8603483A (pt) Processo para minimizar a distorcao em substratos de ceramica com camadas multiplas e substrato resultante
BR8700993A (pt) Processo de formacao de camada fotorresistente em um substrato
SG3395G (en) Method for forming conductive traces on a substrate
EP0214310A4 (en) CONDUCTIVE POLYMER SOLUTION AND PROCESS FOR PRODUCING CONDUCTIVE ARTICLES FROM THIS SOLUTION.
GB8628789D0 (en) Forming conductive pattern
DE68918177D1 (de) Feinstruktur-Herstellungsverfahren.
DE3789990D1 (de) Elektronisches Druckverfahren.
IT1191680B (it) Processo per la realizzazione di fori metallizzati in un substrato dotato di cammini conduttivi e resistivi,e prodotto ottenuto con il processo suddetto
IT1191646B (it) Processo per l'adesione di poli-p.xililene a substrati e articoli ottenuti
EP0214296A4 (en) Structure for mounting electronic devices.
IT8621464A0 (it) Di-iodo-benzene. processo per la trans-alogenazione catalitica di un poli-iodo benezene e in particolare di un
DE3769056D1 (de) Thermisches drucken in zwei durchgaengen.
BR8505481A (pt) Processo de recuperacao de metais
BR8603660A (pt) Aperfeicoamento no processo de galvanizacao eletrolitica
PT85287A (pt) Processo para a preparacao de placas condutoras com a superficie de cobre
BR8501220A (pt) Maquina de escrever eletronica
KR890003385U (ko) 전자 건반