DE3227657C2 - Keramische Vielschicht-Schaltungsplatte und Verfahren zu ihrer Herstellung - Google Patents

Keramische Vielschicht-Schaltungsplatte und Verfahren zu ihrer Herstellung

Info

Publication number
DE3227657C2
DE3227657C2 DE3227657A DE3227657A DE3227657C2 DE 3227657 C2 DE3227657 C2 DE 3227657C2 DE 3227657 A DE3227657 A DE 3227657A DE 3227657 A DE3227657 A DE 3227657A DE 3227657 C2 DE3227657 C2 DE 3227657C2
Authority
DE
Germany
Prior art keywords
sintering temperature
glass
raw
crystallized glass
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3227657A
Other languages
German (de)
English (en)
Other versions
DE3227657A1 (de
Inventor
Akira Yokohama Ikegami
Nobuyuki Yokosuka Sugishita
Hiromi Yokohama Tosaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE3227657A1 publication Critical patent/DE3227657A1/de
Application granted granted Critical
Publication of DE3227657C2 publication Critical patent/DE3227657C2/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
    • H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851—Intermediate layer is discontinuous or differential
    • Y10T428/24868—Translucent outer layer
    • Y10T428/24876—Intermediate layer contains particulate material [e.g., pigment, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
DE3227657A 1981-07-24 1982-07-23 Keramische Vielschicht-Schaltungsplatte und Verfahren zu ihrer Herstellung Expired DE3227657C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56115039A JPS5817651A (ja) 1981-07-24 1981-07-24 多層回路板とその製造方法

Publications (2)

Publication Number Publication Date
DE3227657A1 DE3227657A1 (de) 1983-02-17
DE3227657C2 true DE3227657C2 (de) 1984-09-13

Family

ID=14652676

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3227657A Expired DE3227657C2 (de) 1981-07-24 1982-07-23 Keramische Vielschicht-Schaltungsplatte und Verfahren zu ihrer Herstellung

Country Status (3)

Country Link
US (1) US4490429A (OSRAM)
JP (1) JPS5817651A (OSRAM)
DE (1) DE3227657C2 (OSRAM)

Families Citing this family (85)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5857703A (ja) * 1981-10-01 1983-04-06 日本電気株式会社 抵抗アレ−
JPS599992A (ja) * 1982-07-08 1984-01-19 株式会社日立製作所 多層配線基板の製造方法
JPS5911700A (ja) * 1982-07-12 1984-01-21 株式会社日立製作所 セラミツク多層配線回路板
JPS59162169A (ja) * 1983-03-04 1984-09-13 株式会社日立製作所 セラミック多層配線板
JPS6028296A (ja) * 1983-07-27 1985-02-13 株式会社日立製作所 セラミツク多層配線回路板
KR900004379B1 (ko) * 1983-09-16 1990-06-23 마쯔시다덴기산교 가부시기가이샤 세라믹 다층기판 및 그 제조방법
DE3476993D1 (en) * 1983-11-30 1989-04-13 Taiyo Yuden Kk Low temperature sintered ceramic materials for use in soliddielectric capacitors or the like, and method of manufacture
JPS60208886A (ja) * 1984-03-31 1985-10-21 株式会社東芝 電子部品の製造方法
JPS60221358A (ja) * 1984-04-13 1985-11-06 日本碍子株式会社 電気絶縁体用セラミック組成物
JPS60254697A (ja) * 1984-05-31 1985-12-16 富士通株式会社 多層セラミック回路基板および製法
US4650923A (en) * 1984-06-01 1987-03-17 Narumi China Corporation Ceramic article having a high moisture proof
FR2575331B1 (fr) * 1984-12-21 1987-06-05 Labo Electronique Physique Boitier pour composant electronique
US4943470A (en) * 1985-01-11 1990-07-24 Ngk Spark Plug Co., Ltd. Ceramic substrate for electrical devices
US4712161A (en) * 1985-03-25 1987-12-08 Olin Corporation Hybrid and multi-layer circuitry
DE3621667A1 (de) * 1985-06-29 1987-01-08 Toshiba Kawasaki Kk Mit einer mehrzahl von dickfilmen beschichtetes substrat, verfahren zu seiner herstellung und dieses enthaltende vorrichtung
JPH0634452B2 (ja) * 1985-08-05 1994-05-02 株式会社日立製作所 セラミツクス回路基板
JPS6248097A (ja) * 1985-08-28 1987-03-02 日本特殊陶業株式会社 多層回路基板の製造法
US4766671A (en) * 1985-10-29 1988-08-30 Nec Corporation Method of manufacturing ceramic electronic device
JPH0658841B2 (ja) * 1985-11-16 1994-08-03 株式会社住友金属セラミックス 抵抗体を有する電子回路基板
JPS62117302A (ja) * 1985-11-16 1987-05-28 株式会社住友金属セラミックス 抵抗体を有する電子回路基板
JPS62252901A (ja) * 1985-11-30 1987-11-04 株式会社住友金属セラミックス 抵抗体を有する電子回路基板
US4724040A (en) * 1986-01-14 1988-02-09 Asahi Chemical Research Laboratory Co., Ltd. Method for producing electric circuits on a base boad
EP0247575B1 (en) * 1986-05-30 1993-07-21 Furukawa Denki Kogyo Kabushiki Kaisha Multilayer printed wiring board and method for producing the same
JPS63107095A (ja) * 1986-10-23 1988-05-12 富士通株式会社 多層セラミツク回路基板
JPS63181399A (ja) * 1987-01-22 1988-07-26 日本特殊陶業株式会社 高熱伝導性厚膜多層配線基板
US4775596A (en) * 1987-02-18 1988-10-04 Corning Glass Works Composite substrate for integrated circuits
DE3713987A1 (de) * 1987-04-27 1988-11-10 Siemens Ag Verfahren zur herstellung einer strukturierten keramikfolie bzw. eines aus solchen folien aufgebauten keramikkoerpers
JPS6447099A (en) * 1987-08-18 1989-02-21 Nec Corp Ceramic composite substrate
FR2621174B1 (fr) * 1987-09-25 1991-06-14 Thomson Hybrides Microondes Capacite integree dans un circuit hyperfrequence
US4978483A (en) * 1987-09-28 1990-12-18 Redding Bruce K Apparatus and method for making microcapsules
USRE35064E (en) * 1988-08-01 1995-10-17 Circuit Components, Incorporated Multilayer printed wiring board
US4882650A (en) * 1988-12-05 1989-11-21 Sprague Electric Company Magnesium titanate ceramic and dual dielectric substrate using same
JPH0632367B2 (ja) * 1989-01-24 1994-04-27 富士通株式会社 セラミック基板のｉ／ｏパッドの形成方法
US4985376A (en) * 1989-01-31 1991-01-15 Asahi Glass Company, Ltd. Conductive paste compositions and ceramic substrates
US5066620A (en) * 1989-01-31 1991-11-19 Asahi Glass Company Ltd. Conductive paste compositions and ceramic substrates
JP2700920B2 (ja) * 1989-05-19 1998-01-21 京セラ株式会社 コンデンサー内蔵複合回路基板
JP2700921B2 (ja) * 1989-05-24 1998-01-21 京セラ株式会社 コンデンサー内蔵複合回路基板
JP2753887B2 (ja) * 1989-09-29 1998-05-20 京セラ株式会社 コンデンサー内蔵複合回路基板
US5024975A (en) * 1989-10-19 1991-06-18 E. I. Du Pont De Nemours And Co., Inc. Crystallizable, low dielectric constant, low dielectric loss composition
JP2743115B2 (ja) * 1990-09-29 1998-04-22 京セラ株式会社 コンデンサー内蔵複合回路基板
JP2753892B2 (ja) * 1990-09-29 1998-05-20 京セラ株式会社 コンデンサー内蔵複合回路基板
WO1992014275A1 (en) * 1991-02-05 1992-08-20 Tdk Corporation Dielectric filter
JPH05116985A (ja) * 1991-05-22 1993-05-14 Ngk Spark Plug Co Ltd セラミツク基板
US5192622A (en) * 1991-08-09 1993-03-09 International Business Machines Corporation Low-cost ternary composite for use in vias in glass-ceramic structures
US5162977A (en) * 1991-08-27 1992-11-10 Storage Technology Corporation Printed circuit board having an integrated decoupling capacitive element
JPH0563168A (ja) * 1991-08-30 1993-03-12 Sharp Corp アクテイブマトリクス基板
JPH05152111A (ja) * 1991-11-28 1993-06-18 Rohm Co Ltd チツプ型複合部品
DE69329357T2 (de) * 1992-05-14 2001-04-26 Matsushita Electric Industrial Co., Ltd. Verfahren zur Herstellung von Leitern in Kontaktlöcher in vielschichtigen Keramiksubstraten
JP3167455B2 (ja) * 1992-09-14 2001-05-21 新日本製鐵株式会社 半導体装置及びその製造方法
US5387459A (en) * 1992-12-17 1995-02-07 Eastman Kodak Company Multilayer structure having an epitaxial metal electrode
JPH0811696B2 (ja) * 1993-04-22 1996-02-07 日本電気株式会社 多層ガラスセラミック基板とその製造方法
JPH07245482A (ja) * 1994-03-03 1995-09-19 Shinko Electric Ind Co Ltd セラミック回路基板及びその製造方法
US5478653A (en) * 1994-04-04 1995-12-26 Guenzer; Charles S. Bismuth titanate as a template layer for growth of crystallographically oriented silicon
US5504993A (en) * 1994-08-30 1996-04-09 Storage Technology Corporation Method of fabricating a printed circuit board power core using powdered ceramic materials in organic binders
US6399230B1 (en) * 1997-03-06 2002-06-04 Sarnoff Corporation Multilayer ceramic circuit boards with embedded resistors
KR100546471B1 (ko) * 1997-03-06 2006-01-26 샤프 가부시키가이샤 금속 다층 회로 기판상의 두꺼운 세라믹
JPH11171645A (ja) * 1997-12-09 1999-06-29 Hitachi Metals Ltd 電子部品
US6068782A (en) * 1998-02-11 2000-05-30 Ormet Corporation Individual embedded capacitors for laminated printed circuit boards
US6608760B2 (en) 1998-05-04 2003-08-19 Tpl, Inc. Dielectric material including particulate filler
US6616794B2 (en) 1998-05-04 2003-09-09 Tpl, Inc. Integral capacitance for printed circuit board using dielectric nanopowders
US20040109298A1 (en) * 1998-05-04 2004-06-10 Hartman William F. Dielectric material including particulate filler
US20020062924A1 (en) * 1998-05-04 2002-05-30 Hartman William F. Definable integrated passives for circuitry
CN100540494C (zh) * 1998-10-16 2009-09-16 株式会社村田制作所 用于电路板中的结晶玻璃合成物以及烧结结晶玻璃
DE10122393A1 (de) * 2001-05-09 2002-11-14 Philips Corp Intellectual Pty Flexible Leiterfolie mit einer elektronischen Schaltung
WO2002098818A1 (en) * 2001-06-01 2002-12-12 Paratek Microwave, Inc. Tunable dielectric compositions including low loss glass
JP3840921B2 (ja) * 2001-06-13 2006-11-01 株式会社デンソー プリント基板のおよびその製造方法
CN1630946A (zh) * 2001-07-12 2005-06-22 株式会社日立制作所 电子电路部件
JP2004214573A (ja) * 2003-01-09 2004-07-29 Murata Mfg Co Ltd セラミック多層基板の製造方法
JP2005026445A (ja) * 2003-07-02 2005-01-27 North:Kk 多層配線板とその製造方法
US20050094465A1 (en) * 2003-11-03 2005-05-05 Netlist Inc. Printed circuit board memory module with embedded passive components
US20060074164A1 (en) * 2003-12-19 2006-04-06 Tpl, Inc. Structured composite dielectrics
US20080128961A1 (en) * 2003-12-19 2008-06-05 Tpl, Inc. Moldable high dielectric constant nano-composites
US20060074166A1 (en) * 2003-12-19 2006-04-06 Tpl, Inc. Title And Interest In An Application Moldable high dielectric constant nano-composites
US7193838B2 (en) * 2003-12-23 2007-03-20 Motorola, Inc. Printed circuit dielectric foil and embedded capacitors
TWI268522B (en) * 2004-07-29 2006-12-11 Rohm And Haas Electronic Materials L L C Dielectric structure
US7135377B1 (en) * 2005-05-20 2006-11-14 Phoenix Precision Technology Corporation Semiconductor package substrate with embedded resistors and method for fabricating same
US20070109720A1 (en) * 2005-10-27 2007-05-17 Kyocera Corporation Dielectric paste, capacitor-embedded glass-ceramic multilayer substrate, electronic component and method of manufacturing capacitor-embedded glass-ceramic multilayer substrate
US7768055B2 (en) * 2005-11-30 2010-08-03 International Business Machines Corporation Passive components in the back end of integrated circuits
JP2007173857A (ja) * 2007-02-13 2007-07-05 Kyocera Corp 多層基板およびその製造方法
JP2007165932A (ja) * 2007-02-22 2007-06-28 Matsushita Electric Ind Co Ltd 多層基板
EP2437581A1 (de) * 2010-09-30 2012-04-04 Odelo GmbH Leuchtdiode auf Keramiksubstratbasis
JP5644945B2 (ja) * 2011-06-29 2014-12-24 株式会社村田製作所 多層セラミック基板およびその製造方法
US9648743B2 (en) 2011-12-16 2017-05-09 Snaptrack, Inc. Multilayer glass ceramic substrate with embedded resistor
JP6380726B1 (ja) * 2016-12-21 2018-08-29 大日本印刷株式会社 貫通電極基板、半導体装置及び貫通電極基板の製造方法
JP7381323B2 (ja) * 2019-12-17 2023-11-15 日東電工株式会社 両面配線回路基板の製造方法および両面配線回路基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT941712B (it) * 1970-11-04 1973-03-10 Du Pont Dielettrici di incrocio parzialmen te cristallizzati non riducibili e vetri per la loro produzione
US3977887A (en) * 1974-03-08 1976-08-31 International Business Machines Corporation High dielectric constant ceramics which can be sintered at low temperatures
DE2553763C3 (de) * 1975-11-29 1982-08-19 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur Herstellung einer elektronischen Schaltung
US4301324A (en) * 1978-02-06 1981-11-17 International Business Machines Corporation Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper
US4234367A (en) * 1979-03-23 1980-11-18 International Business Machines Corporation Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors

Also Published As

Publication number Publication date
US4490429A (en) 1984-12-25
DE3227657A1 (de) 1983-02-17
JPS5817651A (ja) 1983-02-01
JPH0343786B2 (OSRAM) 1991-07-03

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