FR2621174B1 - Capacite integree dans un circuit hyperfrequence - Google Patents

Capacite integree dans un circuit hyperfrequence

Info

Publication number
FR2621174B1
FR2621174B1 FR8713286A FR8713286A FR2621174B1 FR 2621174 B1 FR2621174 B1 FR 2621174B1 FR 8713286 A FR8713286 A FR 8713286A FR 8713286 A FR8713286 A FR 8713286A FR 2621174 B1 FR2621174 B1 FR 2621174B1
Authority
FR
France
Prior art keywords
microwave circuit
capacity integrated
capacity
integrated
microwave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR8713286A
Other languages
English (en)
Other versions
FR2621174A1 (fr
Inventor
Marie-Laure Joyeux
Evelyne Da Silva
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thomson Hybrides et Microondes
Original Assignee
Thomson Hybrides et Microondes
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson Hybrides et Microondes filed Critical Thomson Hybrides et Microondes
Priority to FR8713286A priority Critical patent/FR2621174B1/fr
Publication of FR2621174A1 publication Critical patent/FR2621174A1/fr
Application granted granted Critical
Publication of FR2621174B1 publication Critical patent/FR2621174B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
FR8713286A 1987-09-25 1987-09-25 Capacite integree dans un circuit hyperfrequence Expired - Fee Related FR2621174B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8713286A FR2621174B1 (fr) 1987-09-25 1987-09-25 Capacite integree dans un circuit hyperfrequence

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8713286A FR2621174B1 (fr) 1987-09-25 1987-09-25 Capacite integree dans un circuit hyperfrequence

Publications (2)

Publication Number Publication Date
FR2621174A1 FR2621174A1 (fr) 1989-03-31
FR2621174B1 true FR2621174B1 (fr) 1991-06-14

Family

ID=9355228

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8713286A Expired - Fee Related FR2621174B1 (fr) 1987-09-25 1987-09-25 Capacite integree dans un circuit hyperfrequence

Country Status (1)

Country Link
FR (1) FR2621174B1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5097315A (en) * 1989-10-05 1992-03-17 Sumitomo Electric Industries, Ltd. Integrated capacitor disposed over damaged crystal area
US5164800A (en) * 1990-08-30 1992-11-17 Sumitomo Electric Industries, Ltd. Semiconductor device
US6197450B1 (en) 1998-10-22 2001-03-06 Ramot University Authority For Applied Research & Industrial Development Ltd. Micro electrochemical energy storage cells
DE19851458C2 (de) 1998-11-09 2000-11-16 Bosch Gmbh Robert Monolithisch integrierte Schaltung mit mehreren, einen Nebenschluß nach Masse bildenden Kapazitäten und Verstärkerschaltung
US6952044B2 (en) * 2002-05-31 2005-10-04 Motorola, Inc. Monolithic bridge capacitor
WO2011154862A1 (fr) 2010-06-06 2011-12-15 Ramot At Tel-Aviv University Ltd Micro-batterie tridimensionnelle pourvue d'une anode de silicium poreux
WO2017055984A1 (fr) 2015-09-30 2017-04-06 Ramot At Tel Aviv University Ltd. Micro-batterie 3d sur substrat imprimé en 3d

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817651A (ja) * 1981-07-24 1983-02-01 Hitachi Ltd 多層回路板とその製造方法
FR2524712B1 (fr) * 1982-03-31 1985-06-07 Radiotechnique Compelec Circuit hyperfrequence a condensateur integre et application a un circuit d'alimentation

Also Published As

Publication number Publication date
FR2621174A1 (fr) 1989-03-31

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Legal Events

Date Code Title Description
ST Notification of lapse